SE0000588D0 - Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus - Google Patents

Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus

Info

Publication number
SE0000588D0
SE0000588D0 SE0000588A SE0000588A SE0000588D0 SE 0000588 D0 SE0000588 D0 SE 0000588D0 SE 0000588 A SE0000588 A SE 0000588A SE 0000588 A SE0000588 A SE 0000588A SE 0000588 D0 SE0000588 D0 SE 0000588D0
Authority
SE
Sweden
Prior art keywords
channels
tubes
block
thermal conductivity
manufacturing
Prior art date
Application number
SE0000588A
Other languages
Swedish (sv)
Other versions
SE522799C2 (en
SE0000588L (en
Inventor
Goeran Linder
Jari Tuomela
Original Assignee
Teracom Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teracom Ab filed Critical Teracom Ab
Priority to SE0000588A priority Critical patent/SE522799C2/en
Publication of SE0000588D0 publication Critical patent/SE0000588D0/en
Priority to AU2001236289A priority patent/AU2001236289A1/en
Priority to EP01908546A priority patent/EP1275149A1/en
Priority to PCT/SE2001/000388 priority patent/WO2001063667A1/en
Publication of SE0000588L publication Critical patent/SE0000588L/en
Publication of SE522799C2 publication Critical patent/SE522799C2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An apparatus is provided for transporting away heat from heated elements. The apparatus comprises a block (9; 18; 27) of a material having good thermal conductivity on to which the elements are provided in thermal contact. Channels (7, 8; 17; 25) are provided in the block. A liquid, for example water, is forced to flow through the channels. The channels are made by tubes having thin walls and made by a non-corrosive material against the streaming liquid, such as steel, preferably acid proof stainless steel, or gold or silver. The tubes could be cast, or fastened in some other way, for example electroplated in half channels in two blocks to be firmly joined to each other, in a material having good thermal conductivity, for example aluminium. The material of the tubes could have less thermal conductivity than the material of the block.
SE0000588A 2000-02-23 2000-02-23 Apparatus for the removal of heat from heated elements and a method of manufacturing the apparatus SE522799C2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE0000588A SE522799C2 (en) 2000-02-23 2000-02-23 Apparatus for the removal of heat from heated elements and a method of manufacturing the apparatus
AU2001236289A AU2001236289A1 (en) 2000-02-23 2001-02-22 Apparatus for heat transport away from heated elements and method for manufacturing the apparatus
EP01908546A EP1275149A1 (en) 2000-02-23 2001-02-22 Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus
PCT/SE2001/000388 WO2001063667A1 (en) 2000-02-23 2001-02-22 Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0000588A SE522799C2 (en) 2000-02-23 2000-02-23 Apparatus for the removal of heat from heated elements and a method of manufacturing the apparatus

Publications (3)

Publication Number Publication Date
SE0000588D0 true SE0000588D0 (en) 2000-02-23
SE0000588L SE0000588L (en) 2001-08-24
SE522799C2 SE522799C2 (en) 2004-03-09

Family

ID=20278558

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0000588A SE522799C2 (en) 2000-02-23 2000-02-23 Apparatus for the removal of heat from heated elements and a method of manufacturing the apparatus

Country Status (4)

Country Link
EP (1) EP1275149A1 (en)
AU (1) AU2001236289A1 (en)
SE (1) SE522799C2 (en)
WO (1) WO2001063667A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7017651B1 (en) * 2000-09-13 2006-03-28 Raytheon Company Method and apparatus for temperature gradient control in an electronic system
EP3410478A1 (en) * 2017-05-29 2018-12-05 Mitsubishi Electric R & D Centre Europe B.V. Power module and method for manufacturing the power module
DE102021119213B4 (en) 2021-07-25 2023-02-09 Fachhochschule Kiel, Körperschaft des öffentlichen Rechts Helix channel cooler unit

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1238462A (en) * 1967-07-11 1971-07-07
JPH06101524B2 (en) * 1985-09-18 1994-12-12 株式会社東芝 Cooling element for semiconductor element
US4720981A (en) * 1986-12-23 1988-01-26 American Standard Inc. Cooling of air conditioning control electronics
DE4301865A1 (en) * 1993-01-25 1994-07-28 Abb Management Ag Cooling box for electric component
DE4421025C2 (en) * 1994-06-16 1999-09-09 Abb Patent Gmbh Heatsink with at least one cooling channel
US5826643A (en) * 1996-06-07 1998-10-27 International Business Machines Corporation Method of cooling electronic devices using a tube in plate heat sink

Also Published As

Publication number Publication date
WO2001063667A1 (en) 2001-08-30
AU2001236289A1 (en) 2001-09-03
SE522799C2 (en) 2004-03-09
EP1275149A1 (en) 2003-01-15
SE0000588L (en) 2001-08-24

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Legal Events

Date Code Title Description
NUG Patent has lapsed