GB1238462A - - Google Patents
Info
- Publication number
- GB1238462A GB1238462A GB1238462DA GB1238462A GB 1238462 A GB1238462 A GB 1238462A GB 1238462D A GB1238462D A GB 1238462DA GB 1238462 A GB1238462 A GB 1238462A
- Authority
- GB
- United Kingdom
- Prior art keywords
- duct
- rectifier
- heat sink
- turbulator
- july
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004411 aluminium Substances 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 238000013019 agitation Methods 0.000 abstract 1
- 239000002826 coolant Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
1,238,462. Cooling rectifiers. ENGLISH ELECTRIC CO. Ltd. 10 July, 1968 [11 July, 1967], No. 31759/67. Heading H1K. A semi-conductor rectifier assembly includes a rectifier, such as a thyristor, with a heat sink which contains at least one coolant duct in which is placed a turbulator comprising an elongate helically coiled member 6, the coiled member itself being positioned along a helical path. As shown the member is secured to a helical coil 8 and to a stiffening central spindle 7. The components of the turbulator may be fixed in the duct by a " through-soldering " technique involving immersion and agitation in a solder bath. The duct(s) may be formed entirely within the base-plate of the rectifier or the standard base of a rectifier may be machined to fit into a heat sink part and to define the duct(s) therewith. The heat sink structure may be formed of copper, aluminium or pre-tinned aluminium.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3175967 | 1967-07-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1238462A true GB1238462A (en) | 1971-07-07 |
Family
ID=10327978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1238462D Expired GB1238462A (en) | 1967-07-11 | 1967-07-11 |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH466874A (en) |
FR (1) | FR1571827A (en) |
GB (1) | GB1238462A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3800182A (en) * | 1973-01-10 | 1974-03-26 | Varian Associates | Heat transfer duct |
DE4301865A1 (en) * | 1993-01-25 | 1994-07-28 | Abb Management Ag | Cooling box for electric component |
WO2001063667A1 (en) * | 2000-02-23 | 2001-08-30 | Teracom Ab | Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus |
WO2001063666A1 (en) * | 2000-02-23 | 2001-08-30 | Teracom Ab | Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2203213A1 (en) * | 1996-05-31 | 1997-11-30 | R-Theta Inc. | Heat sink with coolant accelerator |
-
1967
- 1967-07-11 GB GB1238462D patent/GB1238462A/en not_active Expired
-
1968
- 1968-07-01 FR FR1571827D patent/FR1571827A/fr not_active Expired
- 1968-07-03 CH CH990968A patent/CH466874A/en unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3800182A (en) * | 1973-01-10 | 1974-03-26 | Varian Associates | Heat transfer duct |
DE4301865A1 (en) * | 1993-01-25 | 1994-07-28 | Abb Management Ag | Cooling box for electric component |
WO2001063667A1 (en) * | 2000-02-23 | 2001-08-30 | Teracom Ab | Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus |
WO2001063666A1 (en) * | 2000-02-23 | 2001-08-30 | Teracom Ab | Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus |
Also Published As
Publication number | Publication date |
---|---|
CH466874A (en) | 1968-12-31 |
FR1571827A (en) | 1969-06-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |