SE0000587D0 - Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus - Google Patents
Apparatus for heat transport away from heated elements and a method for manufacturing the apparatusInfo
- Publication number
- SE0000587D0 SE0000587D0 SE0000587A SE0000587A SE0000587D0 SE 0000587 D0 SE0000587 D0 SE 0000587D0 SE 0000587 A SE0000587 A SE 0000587A SE 0000587 A SE0000587 A SE 0000587A SE 0000587 D0 SE0000587 D0 SE 0000587D0
- Authority
- SE
- Sweden
- Prior art keywords
- channels
- liquid
- manufacturing
- path
- heated elements
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
An apparatus is provided for transporting away heat from heated elements. The ap-paratus comprises a block (9; 18; 27) of a material having good thermal conductivity on to which the elements are provided in thermal contact. Channels (7,8; 17; 25) are provided in the block. A liquid, for example water, is forced to flow through the channels. Path means (10, 11; 15, 16; 28, 29) in the channels provide a spiral path for the liquid. Whirl means (7,8; 17; 25) in the liquid path provide turbulence to the streaming water. The channels could be made by tubes having corrugated thin walls and made by a non-corrosive material against the streaming liquid, such as steel, preferably acid proof stainless steel. The tubes could be cast, or fastened in some other way, in a material having good thermal conductivity, for example aluminium. A method for producing the apparatus is also disclosed.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0000587A SE0000587L (en) | 2000-02-23 | 2000-02-23 | Apparatus for removing heat from heated elements and method of manufacturing the apparatus. |
AU2001236288A AU2001236288A1 (en) | 2000-02-23 | 2001-02-22 | Apparatus for heat transport away from heated elements and method for manufacturing the apparatus |
PCT/SE2001/000387 WO2001063666A1 (en) | 2000-02-23 | 2001-02-22 | Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0000587A SE0000587L (en) | 2000-02-23 | 2000-02-23 | Apparatus for removing heat from heated elements and method of manufacturing the apparatus. |
Publications (2)
Publication Number | Publication Date |
---|---|
SE0000587D0 true SE0000587D0 (en) | 2000-02-23 |
SE0000587L SE0000587L (en) | 2001-08-24 |
Family
ID=20278557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0000587A SE0000587L (en) | 2000-02-23 | 2000-02-23 | Apparatus for removing heat from heated elements and method of manufacturing the apparatus. |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2001236288A1 (en) |
SE (1) | SE0000587L (en) |
WO (1) | WO2001063666A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE524673C2 (en) * | 2003-01-31 | 2004-09-14 | Tykoflex Ab | Apparatus for cooling heat-generating components by means of a cooling plate and processes for making the same |
US7542495B1 (en) * | 2007-11-12 | 2009-06-02 | Gooch And Housego Plc | Corrosion resistant cooled acousto-optic devices |
CN101610664B (en) | 2008-06-20 | 2014-05-14 | 萨帕铝型材(上海)有限公司 | Liquid cooler and manufacture method thereof |
KR101735135B1 (en) * | 2009-08-27 | 2017-05-12 | 에어 모션 시스템즈, 인크. | Multiple row scalable led-uv module |
US9072197B2 (en) | 2011-03-10 | 2015-06-30 | Toyota Jidosha Kabushiki Kaisha | Cooling apparatus |
US9468131B2 (en) * | 2014-04-16 | 2016-10-11 | Raytheon Company | Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels |
KR20230132124A (en) * | 2022-03-08 | 2023-09-15 | 엘에스일렉트릭(주) | flow path module and electric device include the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1238462A (en) * | 1967-07-11 | 1971-07-07 | ||
JPH06101524B2 (en) * | 1985-09-18 | 1994-12-12 | 株式会社東芝 | Cooling element for semiconductor element |
DE4301865A1 (en) * | 1993-01-25 | 1994-07-28 | Abb Management Ag | Cooling box for electric component |
DE4421025C2 (en) * | 1994-06-16 | 1999-09-09 | Abb Patent Gmbh | Heatsink with at least one cooling channel |
JPH08215737A (en) * | 1995-02-17 | 1996-08-27 | Toshiba Corp | Production of cooling block for semiconductor element and its cooling block |
DE19747321C2 (en) * | 1997-10-27 | 2002-08-01 | Semikron Elektronik Gmbh | Liquid cooler for power semiconductor components |
-
2000
- 2000-02-23 SE SE0000587A patent/SE0000587L/en not_active Application Discontinuation
-
2001
- 2001-02-22 AU AU2001236288A patent/AU2001236288A1/en not_active Abandoned
- 2001-02-22 WO PCT/SE2001/000387 patent/WO2001063666A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
AU2001236288A1 (en) | 2001-09-03 |
WO2001063666A1 (en) | 2001-08-30 |
SE0000587L (en) | 2001-08-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |