SE0000587L - Anordning för borttransport av värme från upphettade element och förfarande för att tillverka anordningen. - Google Patents

Anordning för borttransport av värme från upphettade element och förfarande för att tillverka anordningen.

Info

Publication number
SE0000587L
SE0000587L SE0000587A SE0000587A SE0000587L SE 0000587 L SE0000587 L SE 0000587L SE 0000587 A SE0000587 A SE 0000587A SE 0000587 A SE0000587 A SE 0000587A SE 0000587 L SE0000587 L SE 0000587L
Authority
SE
Sweden
Prior art keywords
channels
liquid
path
tubes
elements
Prior art date
Application number
SE0000587A
Other languages
English (en)
Swedish (sv)
Other versions
SE0000587D0 (sv
Inventor
Goeran Linder
Jari Tuomela
Original Assignee
Teracom Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teracom Ab filed Critical Teracom Ab
Priority to SE0000587A priority Critical patent/SE0000587L/
Publication of SE0000587D0 publication Critical patent/SE0000587D0/xx
Priority to AU2001236288A priority patent/AU2001236288A1/en
Priority to PCT/SE2001/000387 priority patent/WO2001063666A1/en
Publication of SE0000587L publication Critical patent/SE0000587L/

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE0000587A 2000-02-23 2000-02-23 Anordning för borttransport av värme från upphettade element och förfarande för att tillverka anordningen. SE0000587L (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0000587A SE0000587L (sv) 2000-02-23 2000-02-23 Anordning för borttransport av värme från upphettade element och förfarande för att tillverka anordningen.
AU2001236288A AU2001236288A1 (en) 2000-02-23 2001-02-22 Apparatus for heat transport away from heated elements and method for manufacturing the apparatus
PCT/SE2001/000387 WO2001063666A1 (en) 2000-02-23 2001-02-22 Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0000587A SE0000587L (sv) 2000-02-23 2000-02-23 Anordning för borttransport av värme från upphettade element och förfarande för att tillverka anordningen.

Publications (2)

Publication Number Publication Date
SE0000587D0 SE0000587D0 (sv) 2000-02-23
SE0000587L true SE0000587L (sv) 2001-08-24

Family

ID=20278557

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0000587A SE0000587L (sv) 2000-02-23 2000-02-23 Anordning för borttransport av värme från upphettade element och förfarande för att tillverka anordningen.

Country Status (3)

Country Link
AU (1) AU2001236288A1 ( )
SE (1) SE0000587L ( )
WO (1) WO2001063666A1 ( )

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE524673C2 (sv) * 2003-01-31 2004-09-14 Tykoflex Ab Anordning för kylning av väremalstrande komponenter medelst en kylplatta och förfaranden för tillverkning av densamma
US7542495B1 (en) * 2007-11-12 2009-06-02 Gooch And Housego Plc Corrosion resistant cooled acousto-optic devices
CN101610664B (zh) 2008-06-20 2014-05-14 萨帕铝型材（上海）有限公司 液体冷却器及其制造方法
CA2771764C (en) * 2009-08-27 2018-07-17 Air Motion Systems, Inc. Multiple row scalable led-uv module
CN103443917B (zh) * 2011-03-10 2015-08-12 丰田自动车株式会社 冷却器
US9468131B2 (en) * 2014-04-16 2016-10-11 Raytheon Company Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels
KR20230132124A (ko) * 2022-03-08 2023-09-15 엘에스일렉트릭(주) 유로 모듈 및 이를 포함하는 전력 기기

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1238462A ( ) * 1967-07-11 1971-07-07
JPH06101524B2 (ja) * 1985-09-18 1994-12-12 株式会社東芝 半導体素子用冷却体
DE4301865A1 (de) * 1993-01-25 1994-07-28 Abb Management Ag Kühldose
DE4421025C2 (de) * 1994-06-16 1999-09-09 Abb Patent Gmbh Kühlkörper mit mindestens einem Kühlkanal
JPH08215737A (ja) * 1995-02-17 1996-08-27 Toshiba Corp 半導体素子用冷却ブロックの製造方法及びその冷却ブロック
DE19747321C2 (de) * 1997-10-27 2002-08-01 Semikron Elektronik Gmbh Flüssigkeitskühler für Leistungshalbleiterbauelemente

Also Published As

Publication number Publication date
AU2001236288A1 (en) 2001-09-03
SE0000587D0 (sv) 2000-02-23
WO2001063666A1 (en) 2001-08-30

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Legal Events

Date Code Title Description
NAV Patent application has lapsed