RU62490U1 - DEVICE HOUSING - Google Patents

Abstract

The utility model relates to the field of radio equipment, and can be used in the design of cases of electronic equipment. The technical result, to which the claimed technical solution is directed, is to ensure efficient heat dissipation in the housing of electronic equipment. This result is achieved in that the casing of the device with at least one heat-generating element enclosed in it comprises a casing cooling system including an inlet and an outlet. Moreover, it differs in that the cooling system of the housing is formed by the inner and outer left side, right side, front and rear walls, forming a closed loop and made with the possibility of passage between the inner and outer wall of the cooling air flow, as well as a double top cover. Moreover, the inner side walls are made in the form of radiators, and the outer side walls contain at least two outlet openings made with a height offset relative to the opposite side walls. The inlet is located on the rear wall, and the outlet holes on the outer side walls and the top cover are located on the side of the front wall of the housing.

Description

The utility model relates to the field of radio equipment, and can be used in the design of cases of electronic equipment.

The housing of the radio-electronic unit is known from the prior art (Copyright certificate No. 1725414, IPC: N 05 K 5/00, 04/07/1992). The housing of the electronic unit is made in the form of upper and lower sections of a box-shaped, interconnected along a diagonal plane. The bases of the sections and panels are equipped with shelves placed at an angle to them. The shelves are located one above the other and are detachably connected. The mating side walls are equipped with curly flanges of a U-shape. To remove heat in the side walls of the upper section, blinds are made.

The disadvantage of this device is the insufficiently effective heat removal from the radioelements and the device body.

A device for thermal protection of electronic modules is known (Patent RU No. 2236099, published 2004.09.10, IPC: H 05 K 7/20, H 05 K 5/02, H 05 K 5/06), which serves to remove heat from electronic modules using heat-shielding mixtures during their endothermic decomposition. The device comprises an outer casing, a heat-insulating casing, dividing the inner cavity formed by the inner surfaces of the outer casing into two parts, heat-shielding mixtures and means for removing gaseous decomposition products from the casing. Part of the cavity between the inner surfaces of the outer casing and the outer surfaces of the heat-reflecting casing contains a mixture consisting of crystalline hydrates of sodium carbonate and sodium hydrogen phosphate, and part

the cavity between the internal surfaces of the heat-reflecting casing and the electronic modules contains a mixture consisting of crystalline sodium hydrate and sodium pentaerythritol. In addition, to increase the heat-shielding properties, the outer metal surface of the outer casing has a fire-retardant intumescent coating - paint with a thickness of 0.2 to 2 mm with an expansion ratio of 40 to 100, an expansion temperature of at least 90 ° C and not more than 120 ° C. The disadvantage of this device is its complexity.

The closest in technical essence and the achieved results to the proposed technical solution is the case cooling system (Application No. 2001113266, published 2003.06.10, IPC: N 05 K 7/20). The cooling system of the housing, in which the heat-generating element is located, having an inlet through which air enters from the outside, an outlet through which air flows out of the housing, a radiator with a heat-dissipating fin that is partially or entirely located inside the housing near the inlet a hole, and a device for transferring heat, which is released by a working heat-generating element, into a radiator with a heat-dissipating fin, while heat that is released by a working heat-generating the element is transferred to the radiator with a heat-dissipating fin device for heat transfer, and the air that enters the case through the inlet first passes through the heat-dissipating radiator fin, taking away heat from it, which is released by the working heat-generating element, and then after heating to the radiator is discharged through the outlet from the housing to the outside, while cooling the housing itself.

The disadvantages of this device include the insufficiently efficient heat removal from the radioelements and the device body.

The technical result, to which the claimed technical solution is directed, is to ensure efficient heat dissipation in the housing of electronic equipment.

The technical result is achieved in that the casing of the device with at least one fuel element enclosed in it comprises a cooling system of the casing including an inlet and an outlet. Moreover, it differs in that the cooling system of the housing is formed by the inner and outer left side, right side, front and rear walls, forming a closed loop and made with the possibility of passage between the inner and outer wall of the cooling air flow, as well as a double top cover. Moreover, the inner side walls are made in the form of radiators, and the outer side walls contain at least two outlet openings made with a height offset relative to the opposite side walls. The inlet is located on the rear wall, and the outlet holes on the outer side walls and the top cover are located on the side of the front wall of the housing.

The invention is illustrated by drawings, where:

Figure 1 - front view of the device;

Figure 2 is a rear view of the housing of the device;

Figure 3 - section aa, bb in figure 1;

Figure 4 - section BB, GG in Figure 1;

Figure 5 - cross section DD in Figure 2.

The housing of the device 1 (Figure 1-FIG. 5) contains at least one heat-generating element 2. The heat-generating element may be, for example, a printed circuit board with electric radio elements installed on it. The housing of the device 1 contains a cooling system 3 of the housing of the device 1, including inlet 4 and weekend

openings 5. The cooling system 3 of the housing 1 of the device 1 is formed by the inner left side wall 6 and the outer side left wall 7, as well as the inner side right 8 and the outer side right wall 9, the inner front wall 10 and the outer front wall 11, the inner rear wall 12 and the outer rear wall 13, as well as the inner cover 14 and the outer cover 15. The walls form a closed loop and are made with a gap that allows the passage between the inner and outer walls of the cooling air stream. Moreover, the inner side walls 6, 8 are made in the form of radiators, and the outer side walls 7, 9 contain at least two vertical outlet openings 5 made with a height offset relative to the opposite side walls. The inlet 4 is located on the outer rear wall 13, and the outlet 5 on the outer side 7, 9 walls and the upper cover 14, 15 are located on the side of the front wall 10. 11 of the device 1.

Since there are heat-generating elements 2 inside the device’s case 1, during operation of the device the internal walls of the device’s case 1 are heated. Due to the small thermal resistance between the walls of the case, heat is distributed evenly across all structural elements. In order to avoid overheating inside the device, it is necessary to provide heat removal.

Heat removal in the housing of the device 1 (Fig.3, 4, 5) is as follows. Through the inlet 4 in the rear wall of the housing 12, 13, air under pressure enters the cooling system 3 of the housing 1 of the device 1, formed by double walls (internal and external) left side 6, 7, right side 8, 9, rear 12, 13 and front 10 , 11, as well as double upper covers 14, 15. Cooling the inner rear wall 12, the air is distributed into three streams and enters the space formed by the inner 14 and

the outer 15 top covers, as well as the space formed by the inner and outer left and right side and front walls. In this case, the inner walls of the housing are made in the form of radiators, and the outer walls have openings that provide a free exit of the cooling air flow to the external environment. Outlets 5 on the outer lateral left and right walls are placed with a displacement along the height of the walls, which allows for the formation of channels for the cooling air flow and uniform heat dissipation at different levels.

The cooling of the side walls of the device is as follows. The cooling air flow between the rear 12, 13 walls is distributed and enters the space between the inner 14 and outer 15 covers and the inner 6, 8 and outer 7, 9 side walls, forming horizontal channels. In this case, in one of the channels (Fig. 3), on the left side, a cooling air stream passes the space between the inner and outer side walls and is directed into the space between the inner and outer front walls, cooling them, and leaves the outlet on the right outer wall. The cooling air flow on the right side passes the space between the inner and outer right side walls, cooling them, and goes into the outlet on the outer wall. At the same time, in the other channel (Figure 4), cooling takes place in the reverse order: on the right side, the cooling air flow passes the space between the inner and outer side walls and goes into the space between the inner and outer front walls, cooling them, and leaves the outlet hole on the left outer wall. The cooling air flow on the left side passes the space between the inner and outer left side walls, cooling them, and goes into the outlet on the outer wall.

The number of channels is determined by the number of outlet openings on the side walls, and may be different, depending on the dimensions of the device case. Moreover, the cooling air flow from the rear wall passes through the entire inner space of the upper cover (Figure 5), cooling it. The exit of the cooling air flow from the space of the upper cover is carried out through the outlet 5 located on the front wall side.

An example of the use of a device case with a heat sink can be case 1 for an electronic computer (PC), inside of which there are installed printed circuit boards with heat-generating elements 2 between the front and back walls. During operation of the computer, the internal walls of the case are heated. Due to the small thermal resistance between the walls of the housing, the heat is distributed evenly over all structural elements. In order to avoid overheating inside the computer case, it contains a cooling system 3. The cooling system 3 of the computer case 1 is formed by the inner left side wall 6 and the outer side left wall 7, as well as the inner side right 8 and the outer side right wall 9, inner front wall 10 and the outer front wall 11, the inner rear wall 12 and the outer rear wall 13, as well as the inner cover 14 and the outer cover 15. The walls form a closed loop and are made with a gap that allows passage between the inner and outer the walls of the cooling air flow. Moreover, the inner side walls 6, 8 are made in the form of radiators, and each of the outer side walls 7, 9 contains two groups of two vertical outlet openings 5 made with a height offset relative to the opposite side walls, which allows the formation of horizontal channels for passage of the cooling air flow and uniform heat removal from the walls

corps. The inlet 4 is located on the outer rear wall 13, and the outlet 5 on the outer side walls and the top cover are located on the side of the front wall of the housing. The computer case also contains a front panel 16 with connectors installed on it and a bottom 17. The cooling of the side walls of the computer case is as follows. The cooling air flow from the opening in the rear wall is divided into three parts and enters the space between the inner and outer cover, and also between the inner and outer side walls, forming horizontal channels. In this case, in one of the channels (Figure 4) on the left side, the cooling air flow passes the space between the inner 6 and outer 7 side walls and is directed into the space between the inner 10 and outer 11 front walls, cooling them, and goes into the outlet 5 on the right outer wall 9. The cooling air flow on the right side passes the space between the inner 8 and outer 9 right side walls, cooling them, and goes into the outlet 5 on the right outer wall 9. At the same time in another channel (Figure 5) cooling runs in the opposite order from the right side cooling air flow passes between the inner 8 and outer 9, the right side wall and directed into the space between the inner 10 and outer front walls 11, cooling them, and exits into the exit port 7 on the left outer wall. The cooling air flow on the left side passes the space between the inner 6 and outer 7 left side walls, cooling them, and goes into the outlet on the left outer 7 wall. The top cover is cooled by a cooling stream of air passing from the back wall over the entire inner surface of the cover and exiting through an opening in the outer cover.

The proposed design of the housing of the device allows for efficient heat removal, both from the walls of the housing, and from the elements located inside the housing, due to the creation of organized air flows in the housing of the device.

Claims (1)

The device body with at least one heat-generating element enclosed in it, comprising a body cooling system including an inlet, an outlet, characterized in that the body cooling system is formed by internal and external left side, right side, front and rear walls forming closed loop and made with the possibility of passage between the inner and outer walls of the cooling air flow, as well as a double top cover, while the inner side walls are made in the form of diators, and the outer side walls contain at least two outlet openings made with a height offset relative to the opposite side walls, the inlet opening located on the rear wall, and the outlet holes on the outer side walls and the top cover placed on the side of the front wall of the housing .