RU2707566C1 - Tight case of module - Google Patents

Abstract

FIELD: electrical engineering.

SUBSTANCE: invention relates to tight cases of electric devices and can be used in designs, to which there are high requirements for tightness, heat removal and radiation resistance. Technical result is achieved by the fact that in the tight case containing the base with external leads, the covers attached to the base by soldering along the outline, the external surface of at least one of the covers outside the soldering zone contains a system of irregularities of regular shape, made in the form of bullets. Inner surface of the cover with bullets out of soldering zone contains at least one additional layer of silicon carbide, which has chemical inertness with respect to the getter, on the surface of which a layer of the getter is formed by a known method.

EFFECT: high reliability of the layer of the getter and elements of the module owing to high radiation resistance of the case.

1 cl, 2 dwg

Description

The invention relates to electronic equipment, in particular to sealed enclosures of electrical appliances, which have high requirements for tightness, heat dissipation and radiation resistance.

Known sealed cases of micromodules, patents: RU No. 1568275, RU No. 2037280, specifications LUYUI.432254.001TU and others containing bases (shells) with external terminals and covers connected, including soldering.

The disadvantages of such cases are: design complexity, due, in particular, to the presence of a large number of heterogeneous boundaries, poor heat dissipation from the covers, a limited time for maintaining tightness and a limitation in the amount of dissipated heat power, due to the overall dimensions of the cases and, as a result, their low reliability.

The closest in technical solution is the sealed module case adopted for the prototype (patent RU No. 2526241), consisting of a base with external terminals and two covers, the outer surface of at least one of the covers outside the soldering zone contains a system of irregularities of the correct shape, made in the form of beetles, and the inner surface of the cover with beetles outside the soldering zone contains a getter layer.

The disadvantages of this housing is the degradation of the functional properties of the getter layer and module elements under radiation exposure.

The technical result of the invention is to increase the reliability of the getter layer and module elements by increasing the radiation resistance of the housing.

To achieve the above technical result, a housing design is proposed, consisting of a base with external terminals and two covers, the outer surface of at least one of the covers outside the soldering zone containing a system of irregularities of the correct form, made in the form of pupples, and the inner surface of the cover with contains outside the soldering zone with a getter layer, and between the inner surface of the lid and the getter layer there is an additional layer with the property of resistance to radiation action and chemical inertness to the getter layer, while completely repeating the inner surface of the housing cover, and the additional layer may contain one or more atoms of elements from the following series: carbon, silicon, aluminum, gallium, beryllium, magnesium, cobalt, nickel, niobium, vanadium, titanium, tantalum, zirconium, scandium, rhenium, lead, gold, platinum, tungsten, phosphorus, boron, oxygen, nitrogen, hydrogen.

The creation of an additional protective layer on the inner surface of the lid outside the soldering zone, which is chemically inert to the getter layer and acts as a passive shield (protective shielding) under radiation exposure, reduces the degree of exposure to ionizing radiation on the getter material, as well as on the module elements. Thus, the degree of degradation of the functional properties of the getter layer and module elements is reduced, and hence their reliability is increased. (See Knyazev V.K., Sidorov N.A., Kurbakov V.G., Kasyanov G.V. Radiation resistance of radio engineering materials constructions. Reference book / Edited by N.A. Sidorov, V.K. Knyazev. - M: Soviet radio, 1976. 568 p .; Myrova L.O., Chepizhenko A.Z. Ensuring radiation resistance of communication equipment, - M .: Radio and communications, 1983. 296 p.).

As in the prototype, heat exchange with the environment is carried out due to the processes of heat transfer from the surface of the housing and external conclusions.

In FIG. 1 shows a general view of the structure of the module housing, and FIG. 2 fragment of the lid (incision) with beetle and an additional layer resistant to radiation exposure. The device comprises a shell 1, a cover 2, a beetle 3, external leads 4, an additional layer 5, a getter layer 6.

The device operates as follows. As an example, in a known manner, a module housing was created in which a silicon carbide layer was used as an additional layer. The creation of an additional protective layer of silicon carbide, which has increased radiation resistance and chemical inertness to the getter layer, outside the soldering zone on the inner surface of the housing, provides for the absorption of excess gases (air, water vapor, etc.) generated due to radiation exposure of the module case desorption processes from the heat-loaded elements of the module, as well as due to the processes of leakage from the external environment through various soldering defects, helping to increase the reliability of the module elements. A weakened radiation flux, when passing through the layered system "body - SiC-layer - getter" will also not cause a significant increase in the failure rate of module elements. The technical result is fully achieved. (See A.A. Lebedev, VV Kozlovsky, NB Strokan, DV Davydov, AM Ivanov, AM Strelchuk, R. Yakimova. Radiation resistance of wide-gap semiconductors (for example, silicon carbide) // FTP 2002. T. 35. Issue 11. S. 1354-1359). Considering that silicon carbide has a large coefficient of thermal conductivity and emissivity, the protective layer of it only slightly increases the thermal resistance of the housing and does not reduce the overall intensity of its heat transfer with the environment. In addition, silicon carbide possessing high mechanical characteristics contributes to a significant increase in the strength and stiffness of the case, (see Tairov Yu.M., Tsvetkov VF Semiconductor compounds A B // Handbook of electrical materials. T.3 / Ed. Yu .V. Koritsky, V.V. Pasynkova, B.M. Tareeva.L.: Energoatomizdat, 1988.P. 446-472 .; Mikheev M.A., Mikheeva I.M.Basics of heat transfer.M .: Energy, 1973. S. 196-199).

Thus, the present invention allows to increase the reliability of the getter layer and module elements in radiation conditions and in addition to increase the strength and rigidity of the module housing.

Claims (1)

The sealed module case, consisting of a base with external terminals and two covers connected to the base by soldering along the contour, the outer surface of at least one of the covers, outside the soldering zone contains a system of irregularities of the correct form, made in the form of pupples, and the inner surface of the cover with pupples outside the soldering zone contains a getter layer, characterized in that between the inner surface of the cover and the getter layer there is an additional layer of silicon carbide having chemical inertness to the getter layer and completely Stu echoing the inner surface of the housing cover.

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