RU2630948C1 - Method of thermo-stabilisation of electronic equipment - Google Patents

Abstract

FIELD: electricity.

SUBSTANCE: method for thermo-stabilisation of electronic equipment based on the passage of a pre-cooled or heated coolant through a microchannel heat exchanger installed on electronic equipment is that the heat carrier is preheated or cooled by a thermal stabilization unit based on thermoelectric modules, then it is circulated in a single hydraulic circuit with a microchannel heat exchanger.

EFFECT: increasing the efficiency of heat exchange, reduction of weight and dimensions and significant energy saving for the operation of the units of the system.

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Description

The invention relates to electronics and can be used to provide the required thermal conditions of the elements of electronic equipment, in particular electronic circuit boards.

A known method and heat exchange system (see patent No. 2515308, class C10J 3/10, publ. 05/10/2014), based on mixing with additives and / or catalysts of biomass, which is compressed by a compression device 1 and fed into the reactor system 2, which includes a heating section 3 with a first heat exchanger 6, a reaction section 4 and a cooling section 5 with a second heat exchanger 12. A heat carrier, which uses molten salt, circulates between the first heat exchanger 6 and the second heat exchanger 12. The heat exchangers 6 and 12 are connected They are provided with a circulating coolant system, which also includes a first salt tank 13, which maintains a temperature close to the maximum working temperature of the molten salt, and a second salt tank 14 with a temperature close to the melting temperature of the molten salt.

The disadvantage of this method is the impossibility of heating the system in the event of a decrease in temperature below the permissible level, a significant difficulty in regulating the flow of coolant.

A known temperature control system of a connected satellite (see patent No. 2158703, class B64G 1/50, publ. 10.11.2000), containing instrument heat exchangers, a compensator, an electric pump unit and a liquid circuit with a flow regulator and distributor. The latter has one input and two outputs. The second output of the distributor is bypassed to the output of the radiator-cooler of the system. The line parameters from the first output of the distributor to the connection point with the bypass satisfy the special condition. Through hydraulic sockets, the liquid cooling channel of the repeater is connected to the system before testing the satellite. Prior to this connection, the hydraulic connectors are connected to each other through an annular partition with a specially selected number of holes. The elements installed in the liquid circuit are preferably qualified during past system designs. The invention is aimed at improving the reliability and resource of the system when working in orbit, as well as at reducing its mass and manufacturing cost.

The disadvantage of this system is the impossibility of heating the system if the temperature drops below the permissible level, the difficulty in adjusting the flow of the coolant.

The closest known technical solutions is the method and system of thermal control of the spacecraft (see patent No. 2237600, CL B64G 1/50, publ. 10.10.2004 - prototype), containing a closed circulation circuit with a liquid coolant. The circuit includes a liquid sub-circuit of the apparatus service systems module interconnected by means of hydraulic connectors. In the liquid path, the sub-circuit of the unit's service systems module contains:

- radiator;

- liquid path for heat removal from devices;

- volume compensator;

- electric pump unit;

- coolant flow rate regulator;

- liquid subcontour of the payload module of the device, the liquid path of which passes through thermostatically controlled panels (heat-generating devices coated with thermal insulation are installed on their outer surfaces).

Thermostatic panels are made in the form of honeycomb panels with built-in liquid paths. Three panels are installed perpendicularly on them: two side panels, in parallel planes, perpendicular to the transverse axis of the vehicle, parallel to the geostationary orbital functioning of the axis of rotation of the Earth, and at least one central panel between these side panels mounted perpendicular to them.

In this case, the liquid path of the payload module in the honeycomb panels is made of pipelines with shelves in the areas of their contact with the inner surfaces of the skin in the areas of location on their outer surfaces of the fuel devices. On the side of the shelves glued to the inner surface of the inner skin of the panel, and on the unused side of the shelves the glued electric heater is turned on, for example, when the devices are not working (the outer surfaces of the outer skin of the side panels are designed to be used as a radiating surface, and an optical coating is glued on them , and devices are not installed on them, and therefore pipelines are not connected to the outer skin of the side panels).

Low heat appliances are installed on the side panels. Heat-loaded appliances with a relatively low maximum permissible operating temperature are located on the base panel. Heat-loaded devices with a relatively high maximum permissible operating temperature are installed on the central panel, which ensures the flow of coolant into the radiator with the highest possible temperature. The minimum possible wall and shelf thicknesses are 1.2 mm and 1.5 mm, respectively; the minimum possible shelf width is 30 mm. Pipelines have one shelf in the side and base panels, and two shelves in the central one. Optimum internal diameters of pipelines and types of connection of fluid paths: in the side panels, parallel connection of fluid paths with an inner diameter of pipelines of 12 mm is allowed, and in the remaining panels, serial connection of fluid paths with an inner diameter of 16 mm is allowed.

The method of thermoregulation during orbital operation is as follows.

The circulation of the liquid coolant in the liquid paths of the thermal control system in a closed loop is carried out by an electric pump unit.

Excessive heat from operating devices located on the panels is directly (almost completely) perceived by the coolant moving in the liquid path located under each heat-generating device.

In the process of movement of the coolant in the liquid path of the radiator, the main amount of excess heat is removed by radiation into outer space; and a smaller part of the excess heat is removed by radiation into outer space from the outer surfaces of the side panels.

In all conditions, the required operating pressure of the coolant in the liquid path of the temperature control system is maintained by means of a volume compensator, the liquid cavity of which is in communication with the liquid path near the entrance to the electric pump unit.

The disadvantage of this method is the significant difficulty in regulating the heating and cooling of the coolant.

The disadvantage of this device is the presence of an additional coolant heater, which significantly increases the mass and energy consumption.

The objective of the invention is to increase the efficiency of heat transfer, reducing mass and dimensions and significant energy savings on the operation of the system units.

The problem is achieved in that in the known method of thermal stabilization of electronic equipment, based on the passage of a pre-cooled or heated coolant through a microchannel heat exchanger mounted on electronic equipment, according to the invention, the coolant is preheated or cooled by a thermal stabilization unit based on thermoelectric modules, then it is brought into a circulation state in a single hydraulic circuit with a microchannel heat exchanger.

This method is implemented in a thermal stabilization device for electronic equipment containing a microchannel heat exchanger, a radiator with fans, a pump, an expansion tank, a valve, a monitoring and control system, pipelines, which according to the invention is equipped with a thermal stabilization unit based on thermoelectric modules with a cooling and heating system for thermoelectric modules.

The invention is illustrated in FIG. 1-3.

In FIG. 1 shows a pneumohydraulic circuit of a thermal stabilization system for electronic equipment, consisting of a pneumohydraulic cooling or heating circuit of electronic equipment and a pneumohydraulic cooling circuit or heating of thermoelectric modules, FIG. 2 shows a pneumohydraulic circuit of a thermal stabilization system for electronic equipment, consisting of a pneumohydraulic cooling or heating circuit of electronic equipment and an air cooling circuit or heating of thermoelectric modules, FIG. 3 shows a schematic block diagram of the monitoring and control of a hybrid thermal stabilization system.

The installation includes:

1 - pneumohydraulic circuit for cooling or heating electronic equipment;

2 - pump;

3 - microchannel heat exchanger;

4 - radiator with fans;

5 - block thermal stabilization based on thermoelectric modules;

6 - valve;

7 - an expansion tank;

8 - pneumohydraulic cooling or heating circuit of thermoelectric modules;

9 - pump;

10 - radiator with fans;

11 - an expansion tank;

12 - circuit air cooling or heating of thermoelectric modules;

13 - air heat exchanger (cooler);

14 - temperature sensor of the electronic module;

15 - ambient temperature sensor;

16 - block input and output parameters;

17 - block monitoring and control system.

Structurally, the device for thermal stabilization of electronic equipment contains a pneumohydraulic circuit 1 for cooling or heating of electronic equipment. Circuit 1 consists of a pump 2, a microchannel heat exchanger 3, a radiator 4 with fans, a thermal stabilization unit 5 based on thermoelectric modules, a valve 6, an expansion tank 7, and pipelines. For the most efficient operation of the thermal stabilization unit 5, in addition to circuit 1, a separate pneumo-hydraulic circuit 8 (Fig. 1) of liquid cooling or heating of thermoelectric modules is used. Circuit 8 consists of a pump 9, a heat exchanger of the thermal stabilization unit 5 based on thermoelectric modules, a radiator 10 with fans, an expansion tank 11, and pipelines. For the most efficient operation of the thermal stabilization unit 5, in addition to circuit 1, a separate circuit 12 (Fig. 2) of air cooling or heating of thermoelectric modules is used. The circuit 12 consists of a cooler 13, which is an air finned heat exchanger with fans. In the device for thermal stabilization of electronic equipment together with circuit 1, only circuit 8 or only circuit 12 is used. Expansion tanks 7, 11 serve to charge the system with coolant and compensate for its expansion during operation. To determine the parameters of the system, a temperature sensor for the electronic module 14 and an ambient temperature sensor 15 are provided. The shaded arrows indicate the direction of the coolant (liquid). The monitoring and control system comprises a parameter input and output unit 16, a monitoring and control system 17.

Before the system starts, the following preparatory steps are performed:

1) The circuit 1 is filled with coolant through the expansion tank 7.

2) The remaining gas is displaced in circuit 1.

3) The tightness of circuit 1 is checked.

4) In the case of liquid cooling and heating of thermoelectric modules 5, the circuit 8 is charged with coolant through an expansion tank 11.

5) The remaining gas is displaced in circuit 8.

6) The tightness of circuit 8 is checked.

7) Set the required values of the adjustable parameters for the monitoring and control system 17 using the input and output unit 16.

8) Functional check of all system units and temperature sensors is performed.

The operation of the thermal stabilization system is as follows. The coolant of circuit 1 is pumped to the microchannel heat exchanger 3 by pump 2, after heat exchange in the microchannel heat exchanger 3, which is installed on electronic equipment, the coolant enters the radiator 4. Then the coolant enters the thermal stabilization unit 5 based on thermoelectric modules, then the coolant enters pump 2. The coolant circuit 8 with a pump 9 is fed to the thermal stabilization unit 5 based on thermoelectric modules, after which the coolant enters the radiator 10 and then to the pump 9. In case for If the thermoelectric modules are heated or heated, an air cooling circuit 12 or thermoelectric module heating is applied, then the cooler cooling fans 13 are turned on.

The heat transfer rate in the radiator 10 of circuit 8 is changed by the fans. To save energy, the rotational speed of the radiator fans 11 is regulated by the commands received from the monitoring and control unit 17. The pump 9 controls the heat carrier flow by changing the rotor speed by the commands coming from the monitoring and control unit 17, which also saves electricity. To change the intensity of heat transfer in the circuit 12, as well as to save electricity, the rotational speed of the cooler fans 13 is controlled by commands received from the monitoring and control system unit 17.

To determine the parameters of the system, two temperature sensors 14, 15 are provided. According to the parameters received from the temperature sensors and data from the input and output unit of parameters 16, the monitoring and control system 17 provides a control signal (Fig. 3):

- pump 2 (on / off, increase / decrease speed);

- a thermal stabilization unit 5 based on thermoelectric modules (switching on / off, increasing / decreasing power, changing polarity);

- radiator fans 4 (on / off, increase / decrease speed);

- valve 6 (changing the direction of movement of the coolant);

- pump 9 circuit 8 (on / off, increase / decrease speed);

- radiator fans 10 (on / off, increase / decrease speed);

- fans of cooler 13 of circuit 12 (on / off, increase / decrease in speed).

By analyzing the information received from the temperature sensors 14, 15 and comparing it with the control parameters specified through the input and output unit of parameters 16, the monitoring and control system 17 gives commands to reduce or increase the heat transfer intensity in the microchannel heat exchanger 3. The monitoring and control system can to regulate both one and all parameters simultaneously.

The monitoring and control system (Fig. 3), if necessary (analyzing data from temperature sensors), gives the following commands:

- to change the polarity of the thermal stabilization unit based on thermoelectric modules, which allows the heating of the electronic module;

- switching valve 6 to the line bypassing the radiator 4 and turning off the fan, which reduces the heat transfer of the coolant with the environment.

All data obtained during the operation of the system is displayed on the block 16 input and output parameters for their control.

The advantage of the above scheme is the ability to adjust the power of the system elements, maintaining a constant temperature on the electronic module (by analyzing data from temperature sensors), thereby performing more economical work.

Thus, the implementation of the invention leads to an increase in the efficiency of heat transfer, a reduction in mass and dimensions, and significant energy savings in the operation of the system units.

Claims (1)

The method of thermal stabilization of electronic equipment based on passing a pre-cooled or heated coolant through a microchannel heat exchanger mounted on electronic equipment, characterized in that the coolant is preheated or cooled by a thermal stabilization unit based on thermoelectric modules, then it is brought into a circulation state in a single hydraulic circuit with a microchannel heat exchanger .

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