RU2349058C1 - Radio-electronic block with intraplate screening - Google Patents

Abstract

FIELD: physics, radio.

SUBSTANCE: invention concerns radio engineering and can be used at designing of radio-electronic blocks. Radio-electronic block with the intraplate screening, containing the structural printed-circuit board with the outside and interior conductor layers, bearing printing conductors and the electroradioelements grouped on screened by means of barrier and plane screens to the functional bands, and barrier screens are formed by the joined corresponding constructive devices of interlaminar linkings by the screening printing conductors executed in outside and interior conductor layers the friend under the friend with disruptures for printing conductors, traversing barrier screens, and plane screens are formed by the earthen planes serving by conductors of potential "ground" feeding for electroradioelements of screened functional bands, thus specified earthen planes located in one interior conductor layer are joined among themselves by earthen crosspieces and connected to a point of an application of potential "ground" on the structural printed-circuit board, And each screened functional band has the natural barrier screen located on its perimeter, and the natural earthen plane serving by its plane screen, located in a band sweepped by the barrier screen, thus earthen planes and barrier screens in screened functional bands structurally are not related with each other, and constructive devices of interlaminar linkings and devices of the barrier screen are executed in the form of the metallised groove of the interlaminar linkings transiting along a printing screening barrier with printed-circuit boards erected in it, electrically by uniters the adjacent plates and-or uniters the adjacent payments with a payment with an intraplate screening where one leg of the metallised groove concerns one screened band, and other leg of the metallised groove - to other screened band, Thus the place of transition to other leg of the metallised groove is isolated from one leg of the metallised groove on a thickness of the plate, between two screening bands in places of transition barrier screens are isolated from one leg of the metallised groove to other leg also, and barrier screens are related to a point of an application "ground" each one with an own wire with the argentiferous coat, transiting through a ferrite ring.

EFFECT: increase of efficiency of protection of the radio-electronic block from action of electromagnetic noises, decrease of its mass and dimensions parameters, simplification of manufacturing techniques and maintenance of high reproducibility of the radio-electronic block.

11 dwg

Description

The invention relates to radio engineering and can be used in the design of electronic blocks for solving problems of increasing the efficiency of protecting the electronic block from electromagnetic interference, reducing weight and size characteristics, simplifying manufacturing techniques and ensuring high reproducibility of the electronic block.

A technical solution is known (USSR Author's Certificate No. 480206, H05K 7/12, publ. 05.08.75), consisting of a printed circuit board with electrical radio elements installed on it and interstage printed screens made on both sides of the board and connected to earth buses;

cases and covers, equipped with shielding partitions, repeating the pattern of interstage printed screens. In the thickenings of the shielding partitions, the mounting elements of the board and cover, as well as through holes for mounting the unit on the object, are placed. The connection between the cascades is carried out by printed conductors passing in the gaps of the printed interstage screens. The screening partitions of the case and the cover are in contact with the printed interstage screens, ensuring the shielded volumes are closed when the board is pinched along the perimeters of the cascades. The interstage printed screens located on opposite sides of the board are connected by metallized holes through a certain step. The disadvantages of the technical solution: the location of the metallized holes through a certain step helps to reduce the shielding effect of the block, and the location of these holes in several rows to increase the noise immunity leads to an increase in the mass and size characteristics of the block, many shielding partitions complicate the manufacturing technology and reduce the reproducibility of the electronic block.

The closest technical solution (prototype) is an electronic block with on-board shielding (RF Patent No. 2260928. Н05К 1/00, publ. 2005.09.20), which contains a multilayer printed circuit board with external and internal conductive layers, carrying printed conductors and radio-electronic elements grouped on functional zones shielded by means of barrier and planar screens. The barrier screens are formed by the associated corresponding structural elements of the interlayer connections by shielding printed conductors made in the outer and inner conductive layers under each other with gaps for the printed conductors crossing the barrier screens. Plane screens are formed by ground planes that serve as power conductors of the Earth potential for electrical elements of shielded functional zones, while these ground planes located in one inner conducting layer are interconnected by earth jumpers and connected to the Earth supply point on a multilayer printed circuit board . Each shielded functional area has its own barrier screen located along its perimeter, and its own earthen plane, serving as its plane screen, located inside the area covered by the barrier screen. Earth planes and barrier screens in the shielded functional zones are not structurally connected with each other, and earth jumpers connecting the ground planes of the shielded functional zones to each other and to the potential supply point “Earth” on the multilayer printed circuit board pass through the corresponding gaps in the barrier shielded printed conductors screens. Barrier screens are connected to the point of supply of the Earth potential on a multilayer printed circuit board by their own earth printed conductors. The disadvantages of the prototype: the shielding effect of the on-board plane shielding is reduced at the borders of the shielded zones, which leads to their mutual influence on each other and increase the level of spurious interference and induced interference. A lot of metallized openings of interlayer connections that provide shielding of the block located on a large area of the printed shielding barrier significantly increase the overall dimensions of the electronic block, complicate its design and manufacturing technology, resulting in a low level of reproducibility.

The technical result of the invention is to increase the efficiency of protection of the electronic unit from electromagnetic interference, reduce its weight and size characteristics, simplify manufacturing technology and ensure high reproducibility of the electronic unit.

The specified technical result is achieved in that the electronic block with on-board shielding, containing a multilayer printed circuit board with outer and inner conductive layers, carrying printed conductors and electro-radio elements grouped by functional zones shielded by means of barrier and planar screens, the barrier screens being formed by connected corresponding structural elements interlayer connections with shielding printed conductors made in the external and internal one layer under each other with gaps for printed conductors crossing the barrier screens, and the plane screens are formed by earthen planes serving as power conductors of the Earth potential for the radio-electronic elements of the shielded functional zones, while these earthen planes located in one inner conducting layer are connected between earthing jumpers and connected to the point of supply of the potential "Earth" on a multilayer printed circuit board, and each shielded functional area has its own a barrier screen located along its perimeter, and its own earthen plane, serving as its plane screen, located inside the area covered by the barrier screen, while the earthen planes and barrier screens in the shielded functional areas are not structurally connected to each other, characterized in that the structural the elements of the interlayer connections and the elements of the barrier screen are made in the form of a metallized groove of the interlayer connections that runs along the printed screening barrier with circuit boards electrically connecting adjacent boards and / or connecting adjacent boards to a board with internal circuit board shielding, where one side of the metallized groove refers to one shielded area and the other side of the metallized groove to the other shielded zone, with the transition from one side of the metallized groove the thickness of the board is isolated to the other side of the metallized groove, and the barrier screens between the two shielding zones at the points of transition from one side of the metallized groove to the other side, and the barrier screens are connected to the “Earth” supply point, each with its own silver-coated wire passing through the ferrite ring.

In the proposed technical solution, the use of a metallized groove of interlayer connections leads to the shielding of two adjacent functional zones, each of which forms its own barrier screen. This technical solution helps to reduce weight and size characteristics, while high shielding efficiency is achieved due to the continuous shielding surface. The electrical connection and shielding of two adjacent functional zones, each of which forms its own barrier screen, is carried out by means of a metallized groove, which helps to simplify the manufacturing technology of the electronic unit and ensures a high level of reproducibility.

The essence of the technical solution, its feasibility and the possibility of industrial application are illustrated by the drawings shown in figures 1-10, illustrating an example of the implementation of the electronic unit on a ten-layer printed circuit board.

figure 1 is an example illustrating the location of radio elements in the outer first conductive layer of a ten-layer printed circuit board in the considered embodiment of the inventive electronic block (view from the side of the elements of the first conductive layer, printed conductors are conventionally shown as a fragment) with a local enlarged view of the milling place of the transition of the barrier screen ;

figure 2 is a fragment of the print pattern of the inner second conductive layer (view from the side of the first layer, the layers are conditionally transparent) with a local enlarged view of the place of milling the transition of the barrier screen;

figure 3 is a fragment of the print pattern of the inner third conductive layer (view from the side of the first layer, the layers are conditionally transparent) with a local enlarged view of the milling place of the transition of the barrier screen;

4 is a fragment of the print pattern of the inner fourth conductive layer (view from the side of the first layer, the layers are conditionally transparent) with a local enlarged view of the milling place of the transition of the barrier screen;

5 is a fragment of the print pattern of the inner fifth conductive layer (view from the side of the first layer, the layers are conditionally transparent) with a local enlarged view of the milling place of the transition of the barrier screen;

6 is a fragment of the print pattern of the inner sixth conductive layer (view from the side of the first layer, the layers are conditionally transparent) with a local enlarged view of the milling place of the transition of the barrier screen;

7 is a fragment of the print pattern of the inner seventh conductive layer (view from the side of the first layer, the layers are conditionally transparent) with a local enlarged view of the milling place of the transition of the barrier screen;

Fig. 8 is a fragment of a print pattern of the inner eighth conductive layer (view from the side of the first layer, conditionally transparent layers) with a local enlarged view of the milling place of the transition of the barrier screen;

Fig.9 is a fragment of the print pattern of the inner ninth conductive layer (view from the side of the first layer, the layers are conditionally transparent) with a local enlarged view of the milling place of the transition of the barrier screen;

figure 10 is a fragment of the print pattern of the outer tenth conductive layer (view from the side of the first layer, the layers are conditionally transparent) with a local enlarged view of the milling place of the transition of the barrier screen;

11 is a fragment of the figure where in the metallized groove, passing along the printed screening barrier, the printed circuit boards are installed and the adjacent boards are electrically connected to the circuit board with internal circuit shielding.

In the inventive radio electronic unit with on-board shielding contains the following components:

1 - multilayer printed circuit board;

2 - outer conductive layers;

3 - inner conductive layers;

4 - conductive layers;

5 - printed conductors;

6 - electric radio elements;

7 - barrier screens;

8 - planar screens;

9 - functional areas;

10 - structural element of interlayer connections;

11 - earthen planes;

12 - earthing jumpers (printed conductors crossing the barrier screens);

13 - point of supply of potential "Earth";

14 - gaps in the shielding printed conductors;

15 - element of the barrier screen;

16 - metallized groove of interlayer compounds;

17 - printed screening barrier;

18 - one side of a metallized groove;

19 - one shielded area;

20 - the other side of the metallized groove;

21 - another shielded area;

22 - wire;

23 - board passing through a metallized groove;

24 - adjacent boards;

25 - the first conductive layer;

26 - the second conductive layer;

27 - the third conductive layer;

28 - the fourth conductive layer;

29 - fifth conductive;

30 - the sixth conductive layer;

31 - seventh conductive layer;

32 - eighth conductive layer;

33 - the ninth conductive layer;

34 - the tenth conductive layer;

35 - the place of transition from one surface of a metallized groove to another surface, located in the thickness of the board;

36 - ferrite ring.

An electronic circuit board with on-board shielding, containing a multilayer printed circuit board 1 (Fig. 1) with outer 2 and inner 3 (Fig. 2) conductive layers 4, carrying printed conductors 5 and electro-radio elements 6, grouped by shielded using barrier 7 and planar 8 ( figure 3) of screens to functional zones 9. Barrier screens 7 are formed by connected corresponding structural elements 10 of interlayer connections by shielding printed conductors 5 made in outer 2 (figure 1) and inner 3 (figure 2) conductive layers 4 a friend below each other with gaps 14 (Fig. 3) for printed conductors 12 crossing the barrier screens 7. Plane screens 8 are formed by earthen planes 11 serving as power conductors of the “Earth” potential for electro-radio elements 6 (Fig. 1) of shielded functional zones, while said earth planes 11 (FIG. 3) located in one inner 3 (FIG. 2) conductive layer 4 are interconnected by earth bridges 12 (FIG. 3) and connected to point 13 (FIG. 1) of the “Earth” potential supply on a multilayer printed circuit board 1. Each shielded fun The national zone 9 has its own barrier screen 7 located along its perimeter, and its own earth plane 11, serving as its plane screen 8, located inside the zone, covered by the barrier screen 7. Earth planes 11 and barrier screens 7 in the shielded functional zones 9 are not structurally connected together. Earth lintels 12 connecting earth planes 11 of the shielded functional zones 9 to each other and to the Earth supply point 13 on the multilayer printed circuit board 1, pass through the corresponding gaps 14 in the shielded printed conductors 5 of the barrier screens 7. Structural elements 10 of the interlayer connections and elements the barrier screen 15 is made in the form of a metallized groove 16 of interlayer connections extending along the printed screening barrier 17, where one side 18 (FIG. 2) of the metallized groove 16 refers to one the shielded area 19, and the other side 20 of the metallized slot - to another shielded zone 2 (Figure 1). The transition point from one side of the metallized groove 16 to the other side 20 in the thickness of the board 1 is isolated, and the barrier 7 screens between the two shielding zones 9 are isolated at the points of transition from one side of the metallized groove 16 to the other. The barrier screens 7 are connected to a point 13 of the Earth supply, each with its own stranded wire 22 with a silver-containing coating passing through a ferrite ring 36, to attenuate and suppress electromagnetic interference. Through a metallized groove 16 located along the printed shielding barrier 7, printed circuit boards 1 pass through electrically connecting adjacent boards 24 (FIG. 11) and / or connecting adjacent boards 24 to circuit board 1 (FIG. 1) with on-board shielding. The first conductive layer 25 (FIG. 1), the second conductive layer 26 (FIG. 2), the third conductive layer 27 (FIG. 3), the fourth conductive layer 28 (FIG. 4), the fifth conductive layer 29 (FIG. 5), the sixth conductive layer 30 (FIG. 6), the seventh conductive layer 31 (FIG. 7), the eighth conductive layer 32 (FIG. 8), the ninth conductive layer 33 (FIG. 9), the tenth conductive layer 34 (FIG. 10) are separated from each other in insulating layers.

The assembly of the electronic block with on-board shielding consists in the fact that they carry out a set of flat parallel outer 2 (figure 1) and inner 3 (figure 2) conductive layers 4 (figure 1) and connect them together in a bag, for example, by gluing, providing electrical connections between the conductive layers 4. In the outer 2 and inner 3 (FIG. 2) conductive layers 4 (FIG. 1), the printed conductors 5 are preliminarily formed on each conductive layer 4, grouped into shielded zones using barrier 7 and planar 8 (FIG. 3) eq ANTONOV functional zones 9 (Figure 1). The barrier screens 7 are connected by the corresponding structural elements 10 of the interlayer connections with shielding printed conductors 5, which are performed in the outer 2 and inner 3 (figure 2) conductive layers 4 (figure 1) under each other with gaps 14 (figure 3) for printed conductors 5 crossing the barrier screens 7 (FIG. 1). The plane screens 8 (FIG. 3) form the earth planes 11 (FIG. 3) serving as power conductors of the “Earth” potential for the electro-radio elements 6 (FIG. 1) of the shielded functional zones 9, while said earth planes 11 (FIG. 3) have in one inner 3 (figure 2) conductive layer 4 (figure 1) and interconnected by earthing jumpers 12 (figure 3), and connected to the point 13 (figure 1) supply potential "Earth" on a multilayer printed circuit board 1 Each shielded functional area 9 (figure 2) is formed from its own barrier screen 7 and located Scout along its perimeter. Own earthen plane 11 (Fig. 3), serving as its planar screen 8, is located inside zone 9 (Fig. 1), which is covered by a barrier screen 7. Earth planes 11 (Fig. 3) and barrier screens 7 (Fig. 1) in shielded functional zones 9 are not structurally connected to each other. Earth lintels 12 (Fig. 3), connecting earth planes 11 of the shielded functional zones 9 (Fig. 1) with each other and with point 13 for supplying the potential "Earth" on a multilayer printed circuit board 1, are formed through the corresponding gaps 14 (Fig. 3) in shielding printed conductors 5 (Fig. 1) of the barrier screens 7. Structural elements 10 of the interlayer connections and elements of the barrier screen 7 are made in the form of a metallized groove 16 (Fig. 3) of interlayer connections extending along the printed shielding barrier 17. One side 18 of the metallized pa And 16 refers to one 19 shielded area, and the other side 20 of the metallized groove 16 to the other shielded zone, while the thickness of the board 1 isolates the transition point 35 from one 18 side of the metallized groove 16 to the other side 20 of the metallized groove, for example, by milling the groove isolate the transition point 35 from one side 18 (Fig. 1) to the other side 20. The barrier screens 7 between two shielding zones 9 at the transition points 35 from one (Fig. 1) side 18 of the metallized groove 16 to the other side 20 disappear when milling. The barrier screens 7 are connected to the Earth supply point 13 each with its own silver-coated wire 22, and the wire is passed through a ferrite ring 36. Printed circuit boards 1 are installed in the metallized groove 16 along the printed screen barrier 17 and electrically connected adjacent boards 24 (FIG. 11) and / or connect adjacent boards 24 to the board 1 (FIG. 1) with on-board shielding.

The above constructive solution allows, firstly, to ensure high efficiency of protection of the electronic unit from electromagnetic interference due to internal shielding using a conductive pattern in the form of a metallized groove, secondly, to reduce its overall dimensions and, thirdly, to increase its reproducibility due to improving manufacturing technology.

Thus, from the foregoing, it follows that the claimed invention solves the technical problem and can be used in industrial developments.

Claims (1)

An electronic circuit board with on-board shielding, comprising a multilayer printed circuit board with outer and inner conductive layers, carrying printed conductors and radio-electronic elements grouped according to functional zones shielded by means of barrier and planar screens, the barrier screens being formed by connected corresponding structural elements of interlayer connections by shielding prints in the outer and inner conductive layers under each other with gaps for printed conductors crossing the barrier screens, and planar screens are formed by ground planes that serve as power conductors of the potential "Earth" for the electrical elements of the shielded functional zones, while these ground planes located in one inner conducting layer are interconnected by earth jumpers and connected to the point of supply potential "Earth" on a multilayer printed circuit board, each shielded functional area has its own barrier screen located along its perimeter, and its own earth plane, serving as its plane screen, located inside the area covered by the barrier screen, while the earth planes and barrier screens in the shielded functional zones are not structurally connected to each other, characterized in that the structural elements of the interlayer connections and the elements of the barrier screen are made in the form of a metallized groove of interlayer connections passing along a printed screening barrier with printed circuit boards installed in it, electrically connecting adjacent and / or connecting adjacent boards to an on-board shielded board, where one side of the metallized groove refers to one shielded area and the other side of the metallized groove to the other shielded zone, while the transition from one side of the metallized groove to the other side of the metallized groove is isolated along the thickness of the board, the barrier screens between two shielding zones at the points of transition from one side of the metallized groove to the other side are isolated, and the barrier screens are connected with each Earth supply, each with its own silver-coated wire, passing through a ferrite ring.

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