RU2333621C1 - Radiator device - Google Patents

Abstract

FIELD: electronics.

SUBSTANCE: invention pertains to electronics and specifically to heat transfer and can be used in aircraft-borne equipment for increasing efficiency of heat transfer and protection from electromagnetic interference. The radiator device is in contact with a heat-loaded element and has several lamellar thermal plates, each of which has a heat absorption part, in contact with the surface of the heat loaded element, and a heat releasing surface, which is a continuation of the heat absorption part. The thermal plates are arranged in piles, in which the heat absorption part of the plates forms the centre of the pile of the thermal plates. The device also has a pair of squeezing blocks between the heat absorption parts of the pile of thermal plates and squeezing the heat absorption part of the plates. The heat releasing part of the plates is such that, after forming the plates, a structure is formed, in which the heat releasing parts of the plate are parallel to each other, and the heat absorption parts form a closed space on all sides, in which the heat loaded element is put. The plates have a current conducting coating. The radiator device has a ventilator, fitted such that, air streams pass through parallel thermal plates. Besides that, the radiator device is in electrical contact with the contact area of a printed circuit board, forming a single earthing contour.

EFFECT: design of a highly efficient heat transfer radiator and protection from electromagnetic interferences.

3 cl, 4 dwg

Description

The invention relates to the field of electronics, namely to heat dissipation, and can be used in a complex of airborne equipment of aircraft to solve problems of increasing the efficiency of heat removal and protection against electromagnetic interference.

A technical solution is known ("Heat removal in semiconductor devices" Aksenov A.I., Glushkova D.N., Ivanov V.I. Publishing house "Energy", 1971. p.142-144, Fig.7.9), where radiator is used a device for removing heat by gluing with a high-temperature adhesive a set of plates stamped from sheet material.

The disadvantage of this radiator device is the increase in thermal resistance at the junction of the plates and heat removal from only one side of the heat-loaded element, which leads to uneven cooling of the element.

The closest technical solution (prototype) is a radiator device (Russian patent No. 2251827, Н05К 7/20, publ. 06/20/2004, "ZALMAN TECH CO., LTD" (KR)) for absorbing heat generated from a heat source, and the radiator It is in contact with this heat source and releases absorbed heat to the air. Moreover, the radiator contains many sheet-shaped radiator plates, each of which has a heat-absorbing part in contact with the upper surface of the heat source and essentially located perpendicular to this surface, and a heat-releasing part extending from the heat-absorbing part. In this design, a plurality of radiator plates are arranged in the stack to form a stack of radiator plates, the heat-absorbing part forms the center of the stack of radiator plates. A pair of compression blocks is located between the heat-absorbing parts of the foot of the radiator plates and compresses the heat-absorbing parts, each of the radiator plates having at least one curved part, which allows you to distribute individual radiator plates in the radial direction under the action of the force applied to the curved parts when the radiator plates are tightly compressed by a pair of compression blocks, giving the radiator a column shape with an elliptical base.

The disadvantage of this radiator device is the lack of heat removal efficiency, due to the fact that the radiator is in contact with only one surface - the top surface of the heat source, which leads to uneven cooling of the heat-loaded element, and there is no protection against electromagnetic interference of the heat-loaded element.

The technical result of the invention is the creation of a highly efficient heat sink and protection against electromagnetic interference.

The technical result is achieved in that the radiator device in contact with the heat-loaded element, containing many sheet-like radiator plates, each of which has a heat-absorbing part in contact with the surface of the heat-loaded element, and a heat transfer part, which is a continuation of the heat-absorbing part, and many radiator plates are located in in the form of a foot, in which the heat-absorbing part of the plates forms the center of the foot of the radiator plates, and a pair of compression blocks, located between heat-absorbing parts of the foot of the radiator plates and compressing heat-absorbing parts of the plates, and the heat-removing parts of the plates are formed in such a way that after the formation of the plates, a structure is formed in which the heat-releasing parts of the plates are parallel to each other, and the heat-absorbing parts form a closed space on all sides, in which is located a heat-loaded element, the plates having a conductive coating.

The radiator device is additionally equipped with a fan installed in such a way that air flows through parallel radiator plates.

In addition, the radiator device is in electrical contact with the contact area of the printed circuit board, forming a single ground loop.

The essence of the invention lies in the fact that, unlike the prototype, where the radiator device has a heat-absorbing part in contact with only one surface of a heat-loaded element and is perpendicular to this surface to absorb heat from a heat-loaded element, in the proposed technical solution for absorbing heat generated from a heat-loaded element element, the radiator device is in contact with this element and transfers the absorbed heat to the air, while the radiator device consists of a plurality of leaf-shaped radiator plates, each of which has a heat-absorbing part in contact with the surface of the heat-loaded element and a heat-releasing part extending from the heat-absorbing part to transfer the absorbed heat to the environment, the radiator plates being in the form of a stack, the center of which is formed by the heat-absorbing part radiator plates, and a pair of compression blocks located between the heat-absorbing parts of the foot of the radiator plates and compressing heat-absorbing parts, to orye form a closed on all sides by heat-loaded element design. A closed surface increases the area of contact with the surface of the heat-loaded element, thereby increasing the efficiency of heat removal.

Unlike the prototype, where the radiator device plates have at least one curved part, which allows you to distribute in the radial direction of the individual radiator plates under the action of the force applied to the curved part, when the radiator plates are tightly compressed by a pair of compression blocks, giving the radiator a shape columns with an elliptical base, in the proposed radiator device in the heat sink part of the plate are formed in a certain way and after the formation of the plates is formed Wherein the heat-transfer of the plates are parallel to each other, which can improve heat sink efficiency.

Unlike the prototype, where protection against electromagnetic interference is not provided, the proposed radiator device provides and shields the heat-loaded element from electromagnetic interference by applying a conductive coating applied to each plate with the formation of a shielding.

Unlike the prototype, the radiator device is additionally equipped with a fan installed in such a way that air flows through parallel radiator plates.

Unlike the prototype, the radiator device is in electrical contact with the contact area of the printed circuit board, forming a single ground loop.

The proposed drawings show a radiator device:

figure 1 - radiator device in isometry (shown two additional types and details of the compression blocks);

figure 2 is a cross section of a radiator device;

figure 3 - radiator device with a fan in isometry;

4 is a fragment of a radiator device (radiator plates conventionally not shown), where:

1 - radiator plate;

2 - foot plates;

3 - heat-absorbing part of the plate;

4 - the center of the foot of the radiator plates;

5 - compressive blocks;

6 - heat transfer part of the plate;

7 - heat-loaded element;

8 - conductive coating of the plate;

9 - a window in the printed circuit board;

10 - printed circuit board;

11 - mounting holes of the compression blocks;

12 - fasteners of the compression blocks;

13 - fan;

14 - contact pad on the printed circuit board (polygon);

15 - conclusions of the heat-loaded element;

16 - contact pads for desoldering the terminals of the heat-loaded element;

17 - printing tracks;

18 - through metallized holes.

The radiator device is a structure in the form of a plurality of radiator plates 1 (Figs. 1-3), which are placed in the stack 2, forming a L-shaped structure. To form the foot 2 of the radiator plates 1, the heat-absorbing part 3 (Fig. 2) forms the center 4 of the foot of the radiator plates 1 (Figs. 1-3). A pair of compression blocks 5 is located between the heat-absorbing parts 3 (FIG. 2) of the foot 2 (FIGS. 1-3) of the radiator plates 1 and compresses the heat-absorbing parts 3 (FIG. 2).

The heat-absorbing parts 3 of the plates 1 (Figs. 1-3) form a closed space around the heat-loaded element 7 (Figs. 2, 4) and the heat-releasing parts 6 (Figs. 1-3) of the plates 1 are parallel to each other and are formed in a certain way, for example, stepwise forms, and are formed, for example, by stamping before installation in the stack 2. Radiator plates 1 have a conductive coating 9 (Fig.2, 4).

To improve the contact of the heat-loaded element 7 with the heat-releasing part 5 (Figs. 1-3) of the plate 1, adhesive-sealant is used, for example, Elastosil 137-182 TU6-02-1-015-89. The heat-loaded element 7 (Fig.2, 4) is located in the window 9 of the printed circuit board 10 (Fig.1-4) and is fixed in the printed circuit board 10 with glue. The heat-loaded element 7 (Fig.2, 4) is located symmetrically relative to the printed circuit board 10 (Fig.1-4). The compression blocks 5 (Figs. 1-3) have mounting holes 11 (Fig. 1), and on one block 5 (Figs. 1-3) there are threaded holes for tightening by the fastening elements 12. For a more efficient heat removal, a fan 13 ( figure 3), mounted in such a way that the air flows through the parallel radiator plates 1 (figures 1-3).

Radiator plates 1 are in electrical contact with each other and with the contact pad (polygon) 14 (figure 4) located around the perimeter of the window 9 (figure 2, 4) of the printed circuit board on both sides of the printed circuit board 10 (figure 1 -4), and are an integral part of the ground loop, thereby forming a single ground loop. In this case, the conclusions 15 (Fig. 4) of the heat-loaded element 7 (Figs. 2, 4) are soldered to the corresponding contact pads 16 (Fig. 4) of the board 10 (Figs. 1-4), then the printed tracks 17 (Fig. 4) and through the through metallized holes 18 are output into the inner layers of the multilayer printed circuit board 10 (Fig.1-4).

From the above it follows that this device is industrially applicable and solves the technical problem posed: it increases the efficiency of heat removal and provides protection against electromagnetic interference.

Claims (3)

1. A radiator device in contact with a heat-loaded element, containing a plurality of leaf-shaped radiator plates, each of which has a heat-absorbing part in contact with the surface of the heat-loaded element, and a heat-releasing part, which is a continuation of the heat-absorbing part, and many radiator plates are located in the form of a foot, in which the heat-absorbing part of the plates forms the center of the foot of the radiator plates, and a pair of compression blocks located between the heat-absorbing parts of the feet s of radiator plates and compressive heat-absorbing parts of the plates, characterized in that the heat-releasing parts of the plates are formed in such a way that after the formation of the plates, a structure is formed in which the heat-releasing parts of the plates are parallel to each other, and the heat-absorbing parts form a space enclosed on all sides, in which the heat-loaded element, and the plates have a conductive coating. 2. The radiator device according to claim 1, characterized in that the device is additionally equipped with a fan, mounted in such a way that the air flows through parallel radiator plates. 3. The radiator device according to claim 1, characterized in that the radiator plates are in electrical contact with the contact area of the printed circuit board, forming a single ground loop.

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