RU2332286C1 - Tin based solder for low temperature soldering - Google Patents

Abstract

FIELD: technological processes.

SUBSTANCE: solder can be used for low temperature soldering of objects from coloured and ferrous metals, particularly in the production of electrical and radio equipment. The solder contains the following components, in the given mass.%: antimony 0.6-1.2, copper 0.2-1.1, nickel 0.1-0.5, cerium 0.01-0.1, bismuth 1.0-5.0, lead 0.15-1.8, tin constitutes the rest.

EFFECT: increased durability of soldered joints; reduced defects when soldering and considerable increase in the life time and reliability of the soldered joints.

3 tbl, 3 ex

Description

The invention relates to the field of mechanical engineering, namely, tin-based solders for low-temperature soldering of parts from non-ferrous and ferrous metals, used, for example, for the production of electrical and radio equipment.

Known solder based on tin PSrM05, having the following chemical composition, wt.%:

Silver 4,5-5,5 Antimony 0.5-1.5 Copper 1.5 -2.5 Tin rest

("Soldering Handbook" Engineering, 2003, p. 88)

The disadvantages of this solder are the content in its composition of a precious metal - silver - and the low corrosion resistance of the compounds.

Also known is solder based on tin PSr0Su8 of the following chemical composition, wt.%:

Silver 7.5-8.5 Antimony 7.0-8.0 Tin rest

(“Soldering Guide”, Engineering, 2003, p. 88)

The disadvantage of this solder is the content of the precious metal - silver.

Known solder based on tin of the following chemical composition, wt.%:

Copper 5.3-7.0 Nickel 0.1-0.5 Tin rest

(EP 1275467)

Known solder has a low wettability of the surface of the base material.

The closest analogue taken as a prototype is a solder for low-temperature soldering based on tin, the following chemical composition, wt.%:

Antimony 0.3-0.7 Copper 0.05-0.15 Nickel 0.05-0.15 Tellurium 0.005-0.01 Tin rest

(A.S. USSR No. 323223)

The disadvantages of the solder prototype are the low strength values of soldered joints.

An object of the invention is to increase the strength of soldered joints.

The stated technical problem is achieved by the fact that a solder based on tin for low-temperature brazing is proposed, containing antimony, copper, nickel, which additionally contains cerium, bismuth, lead, in the following ratio of components, wt.%:

Antimony 0.6-1.2 Copper 0.2-1.1 Nickel 0.1-0.5 Cerium 0.01-0.1 Bismuth 1.0-5.0 Lead 0.15-1.8 Tin rest

The introduction of additional components in the solder of cerium, bismuth and lead with the declared content and ratio of other components provides increased strength values of soldered joints.

Examples of implementation

The proposed solder and prototype solder were smelted in a chamotropic crucible when heated to 400-450 ° C under a layer of activated carbon. Table 1 presents the compositions of the proposed solder and solder prototype.

Strength assessment of lap soldered joints was carried out, for example, on copper (M1) samples made of sheets with a thickness of 2 mm. The lap size was 6.0–6.5 mm; the width of the working part of the samples was 10 mm (Table 2).

Lap joints from steel sheets, for example, St 3 2.2 mm thick, had an overlap value of 6.0-7.0. The width of the working part of the samples was also 10 mm (Table 3).

Table 1 No. p / p S Cu Ni Those Xie Bi Pb Sn one 1,2 0.2 0.5 - 0.01 3,5 1.8 Ost 2 0.6 0.6 0.3 - 0.15 1,0 0.15 - "- 3 0.9 1,1 0.1 - 0.1 5,0 1,0 - "- prototype 0.5 0.1 0.1 0.01 - - - - "- table 2 No. p / p Test temperature, ° С Shear strength τ, kgf / mm ² one twenty 7.2-7.5 200 3.7-4.0 2 twenty 7.0-7.4 200 3.6-4.0 3 twenty 6.9-7.5 200 3.4 -3.7 prototype twenty 4.1-4.5 200 1.7-2.3

Table 3 No. p / p Test temperature, ° С Shear strength τ, kgf / mm ² one twenty 7.0-7.5 200 4.2-4.3 2 twenty 6.8-7.4 200 3.6-4.4 3 twenty 7.8-7.9 200 3.4-3.7 prototype twenty 3.5-4.5 200 1.3-1.8

According to the data of Tables 2 and 3, it is seen that the proposed solder has a strength of joints 2-2.5 times higher than that of the joints made by the prototype solder both at room temperature and at the maximum working temperature for tin-based solders.

The use of the proposed solder for soldering parts will reduce the reject during soldering, significantly increase the resource and reliability of soldered joints.

Claims (1)

Tin-based solder for low temperature brazing, containing antimony, copper, nickel, characterized in that it additionally contains cerium, bismuth and lead in the following ratio, wt.%: Antimony 0.6-1.2 Copper 0.2-1.1 Nickel 0.1-0.5 Cerium 0.01-0.1 Bismuth 1.0-5.0 Lead 0.15-1.8 Tin Rest