RU2246520C1 - Gluing composition - Google Patents

Abstract

FIELD: chemistry of silico-organic compounds, glues.

SUBSTANCE: invention describes a gluing composition comprising silico-organic triol of the formula:

, adduct of silico-organic oligodiol and aliphatic hexamethylene diisocyanate of the formula:

wherein n = 2-12 and tin dialkyl diacylate as a hardening catalyst in the following ratio of components, mas. p.: adduct, 100; silico-organic triol, 40-60; catalyst, 0.007-0.12. Invention provides the development of gluing composition exhibiting transparent properties in UV region of spectrum and providing hermeticity in joining different optical construction members of lens, filters and so on with photosensitive members of semiconductive structures, among them at elevated moisture and enhanced or reduced temperatures.

EFFECT: valuable properties of gluing composition.

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Description

The invention relates to the field of technical chemistry, and more specifically to the chemistry of siloxane urethane block copolymers, and can be used in the manufacture of semiconductor photodetectors sensitive in the ultraviolet (UV) region of the spectrum.

Known adhesives that are transparent in the UV spectral region, such as UV-235M, UV-215 (GOST 14887.80. Materials of the seminar of the Moscow House of Scientific and Technical Propaganda named after F. Dzerzhinsky, M., 1986, "New adhesives and gluing technology" , p. 117).

The disadvantage of these adhesives is the low adhesion to the optical materials of the design of semiconductor devices, which under real operating conditions leads to depressurization of the optical element - the photosensitive layer and, consequently, to the degradation of the photoelectric parameters of photodetectors, especially at elevated temperatures and humidity.

Known adhesive composition having high elasticity and adhesive strength, which ensures the safety of the photoelectric parameters of the semiconductor photosensitive layers based on lead chalcogenides, including at elevated and low temperatures to high humidity. The composition contains diisocyanate - an adduct of organosilicon oligodiol with 2,4-toluene diisocyanate of the general formula

where n = 2-12, an organosilicon triol of the formula

and the catalyst is tin dialkyl diacylate in the following ratio of components, parts by weight:

adduct - 100

organosilicon triol - 25-55

catalyst - 0.001-0.002

(see Pat. RF No. 2048485, G 08 G 77/00, BI No. 32, 1995).

This composition, as the closest to the proposed composition, is taken as a prototype.

The disadvantage of this composition is the low transmittance in the UV region of the spectrum.

The present invention solves the problem of creating an adhesive composition that is transparent in the UV region of the spectrum and at the same time ensures the tightness of the connection of various optical structural elements (lenses, filters, coverslips, etc.) with photosensitive elements of semiconductor structures, including at elevated and lower temperatures and high humidity.

To solve this problem in a known adhesive composition containing an organosilicon triol of the formula

organic diisocyanate and tin dialkyl diacylate curing catalyst; adduct of organosilicon oligodiol and aliphatic hexamethylene diisocyanate of the formula used as organic diisocyanate

where n = 2-12,

in the following ratio of components, parts by weight:

adduct - 100

organosilicon triol - 40-60

catalyst - 0.001-0.002

The ratio of components in the proposed composition, determined by the results of experimental studies of the authors, provides high adhesion to the materials of construction of modern photodetectors, such as quartz, sapphire, InSb, GaAs, glass, etc., including at elevated and low temperatures and high humidity. This allows you to save a given level of photoelectric parameters in various operating conditions.

The presence in the adduct of aliphatic hexamethylene diisocyanate (HMDI) provides a high transmittance of the proposed composition in the UV region of the spectrum.

The inventive composition is prepared as follows.

First, in a proportion corresponding to the claims, a mixture of an organosilicon triode with a catalyst is prepared, and then, observing the proportion indicated in the formula, the resulting mixture is mixed with an adduct. Thus prepared mass is placed in a vacuum chamber and maintained at a pressure of 1.5-2.0 mm Hg and a temperature of 18-20 ° C for 25-40 minutes. The resulting adhesive composition, which is a viscous viscous liquid, is ready for use.

The inventive composition was made and tested in the manufacture of prototypes of UV photodetectors based on GaAs. Tin dibutyl dicaprilate was used as a curing catalyst. The specific compositions that were used and their properties are shown in the table.

No.
an example Adduct with GMDI, parts by weight Triol, parts by weight The catalyst, parts by weight Strength at uniform separation, MPa Glue lifetime, hour. Coeff. transmittance in the UV region of the spectrum,% immediately after curing after 48 hours at 40 ° C, 98% wet. After 48 hours at 50 ° C after 1 hour at -196 ° C 1. 100 40 0,07 4,5 4.1 4.7 4,5 2-2.5 80-90 2. 100 60 0.12 4.8 4.8 4.6 4.8 1-1.5 85-95 3. 100 fifty 0.10 4.3 4.0 4,5 4.3 1,5-2 80-85 4. 100 40 0.05 not cured 5. 100 60 0.16 not technological 0.25

The curing time of the composition was:

at 20 ° С - 24 hours,

at 50 ° С - 16 hours,

at 100 ° С - 1 hour.

The tests showed the promise of using the proposed composition in the manufacturing technology of modern semiconductor photodetectors for the UV spectral region.

Claims (1)

An adhesive composition containing an organosilicon triode of the formula

an organic diisocyanate and a curing catalyst, tin dialkyl diacylate, characterized in that as an organic diisocyanate it contains an adduct of organosilicon oligodiol and an aliphatic hexamethylene diisocyanate of the formula

where n = 2-12, in the following ratio of components, parts by weight: adduct 100 organosilicon triol 40-60 catalyst 0.007-0.12