RU2244364C1 - Integrated circuit manufacturing process - Google Patents

Abstract

FIELD: microelectronics; integrated circuit manufacture.

SUBSTANCE: manufacturing process for k integrated circuit includes installation of n components on common dielectric base having external leads. Then sealing compound is applied to components so that it covers them and spreads over surface of common dielectric base provided with external leads and is restrained thereon due to surface tension forces. Single workpiece produced in the process is divided into parts to obtain k integrated circuits. This group method for manufacturing integrated circuits makes it possible to dispense with use of special integrated-circuit package forming auxiliaries.

EFFECT: facilitated manufacture.

1 cl, 2 dwg

Description

The invention relates to the field of microelectronics and can be used in the manufacture of microcircuits.

As a prototype, a method of manufacturing microcircuits was selected, which consists in the fact that n pieces of elements are mounted on the crystal holders of the outputs connected by an external frame. The crystal holders of the findings with the elements are placed in a snap, having k forming individual cavity microcircuit chips, which are then filled with a sealing compound. After this conclusion is separated from the outer frame, getting k pieces of microcircuits [1].

The aim of the invention is the creation of a group method of manufacturing microcircuits without the use of forming equipment.

This goal is achieved by the fact that n pieces of elements are installed on a common dielectric base with external terminals. The installation of elements means their mechanical fastening on a common dielectric base and electrical connection with external terminals and with each other in accordance with the functional purpose of the chip. As elements, semiconductor crystals, film and / or chip - electronic components can serve. The described method allows to produce at the same time, in the same group, microcircuit with a different number of elements and / or various functional purposes. In the general case, the number of elements is n≤k. Then, for example, by dipping, a sealing compound is applied so that, enveloping the installed elements, it spreads over the surface of a common dielectric base with external terminals, holding on to it due to surface tension forces. The sealing compound applied by similar methods covers the entire surface of a common dielectric base with external terminals in a continuous layer. Formed in this way a single workpiece is separated, for example, by sharp abrasive using a wire into parts, getting k pieces of microcircuits.

The figure 1 presents the sequence of technological operations of manufacturing microcircuits, n pieces of elements 1 are installed on a common dielectric base 2 with external leads 3. The sealing compound 4, enveloping the installed elements 1, is applied to a common dielectric base 2. The uniform blank 5 formed in this way is divided into part 6, getting k pieces of microcircuits 7. Due to the forces of surface tension, the upper part of the individual housing of microcircuits can be formed flat or domed depending ty from the width of the common dielectric base with external terminals, the amount of applied sealing compound and its viscosity (figure 2).

Sources of information

1. US patent No. 5317189, CL. H 01 L 23/48, 05/31/94.

Claims (1)

A method of manufacturing k pieces of microchips, characterized in that n pieces of elements are mounted on a common dielectric base with external terminals, on the surface of which is then applied a sealing compound so that it envelops the installed elements and spreads over the surface of a common dielectric base with external terminals, holding onto due to surface tension forces, a single blank formed in this way is divided into parts.

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