RU1825812C - Potting and sealing compound - Google Patents

Abstract

Usage: for sealing the stator windings of electric motors and as electromagnets. SUMMARY OF THE INVENTION: The casting and sealing compound contains, parts by weight: epoxy diane resin 100, methoxynaphthoylenebenzimidazole 5-12, iron powder. 100-200, epoxyaniline resin is the condensation product of aniline and epichlorohydrin in an alkaline medium 10-24, isomethyl tetrahydrophthalic anhydride 4E + M, where E is the epoxy number of the epoxy resin: N is the amount of epoxy aniline resin. Methoxynaphthoylenebenzimidazole is dissolved with stirring in an epoxy aniline resin at 100-110 ° C, the solution is mixed with an epoxy resin heated to 30-40 ° C, after homogenizing the mixture, isomethyltetrahydrophthalic anhydride heated to 50-60 ° C is introduced into it. ; C, after stirring for 10-15 minutes, a filler heated to 60-70 ° C is introduced into the composition, and the mixture is stirred for 20-30 minutes. After that, the composition was kept in vacuum (residual pressure 0.01 MPa) at 70 ° C for 30 minutes. Compound characteristics: breakdown voltage of isolation of PNET-IMID 9.6 kV, breakdown voltage after thermal aging at 240 ° C (300 h) 7.1 kV, heat resistance 192 ° C (Martens), tensile strength when the enameled wire is shifted relative to the cured compound at 20 ° C 3.3 MPa, at 150 ° C 1.4 MPa, the flexural strength after exposure to fuel T-1

Description

The invention relates to curable compositions based on epoxy-diodian resins used in electrical and radio engineering, in particular for sealing the stator windings of an electrode and g / gels and electromagnet coils.

The purpose of the invention is to increase the adhesion of the compound to the enamel of the insulation of winding wires at elevated temperatures.

The goal is achieved. that the filling and sealing compound. Including epoxy diane resin and hardener, it contains isomethyltetrahydrophthalic anhydride as a reagent and, in addition, a solution of methoxynaphthylenebenzimidazole in epoxyaniline resin - the product of the condensation of aniline and epichlorohydrin in an alkaline medium and the filler is iron powder;

Epoxy Dianova

resin100

Iron Powder100-200

Methoxynaphthoylenebenzimidazole 5-12

Epoxyanilinov

resin (EA) 10-24

Isomethyltetrahydrophthalic anhydride 4E + M.

E is the epoxy number of the epoxy resin.

N is the amount of EA resin.

In compound 8, resins of grades ED-24, ED-22, ED-20, ED-16 can be used. As hardener - isomethyl tetrahydrophthalic anhydride (iso-MTHFA),

The filler is finely divided iron powders.

Megoxynaphthoylenebenzimidazole is used in industry as a phosphor under the brand name L-25. Its introduction reduces the internal stresses, increases the heat resistance of the cured composition, the stability of the characteristics when working at elevated temperatures, and. also speeds up the curing process.

The compound is prepared as follows.

The calculated amount of methoxynaphthylene-benzimidazole is dissolved with stirring in EA resin at 100-110 ° C; the resulting solution (not cooling) is mixed with the required amount of epoxy heated to 30-40 ° C; after homogenizing the mixture, a calculated amount of iso-MTHFA heated to 50-60 ° C is introduced into it with stirring; after

by stirring for 10-15 minutes, a filler heated to 60-70 ° C is introduced into the composition, and the mixture is stirred for 20-30 minutes. After that, the composition is kept in vacuum (residual pressure 0.01 MPa) at 70 ° C for 30 minutes.

Examples of compounds and their properties are given in table. 1 and 2.

As can be seen from the table. 2, the compound has higher characteristics (especially at elevated temperatures) compared to the prototype.

Claims (1)

An example of the compound will increase the working life of electric motors and other electric machines and the reliability of their operation at elevated temperatures. SUMMARY OF THE INVENTION A casting and sealing compound comprising an epoxy Dianova resin and a hardener, characterized in that, in order to increase the adhesion of the compound to the enamel of the insulation of the winding wires at elevated temperature, it contains isomethyltetrahydroflale anhydride and additionally a solution of methoxynamide epoxyaniline resin is a condensation product of aniline and epichlorohydrin in an alkaline medium and the filler is iron powder in the following ratio of components, wt.%: Epoxy Dianova Resin 100 Methoxynaphthoylenebenzimidazole 5-12 Iron Powder 100-200 Epoxyanilin Resin 10-24 Isomethyltetrahydrophthalic anhydride 4E + 1M, where E is the epoxy number of the epoxy resin, N is the amount of epoxy aniline resin. Table 1 table 2