RU1811046C - Process of manufacture of wire bundles - Google Patents

Abstract

The invention relates to the field of radio engineering, automation, and computer technology, and in particular, to a technology for automating the processes of manufacturing wire harnesses. SUMMARY OF THE INVENTION: the method arranges the patterns on the pattern perpendicular to the strings along the cutout in the pattern, and the terminals are addressed using the address comb by laying the wire under the address plates, then the wire is raised at the address between the adjacent address plates of the comb and the plant t him for the address plate of the next address. The ends of the wires are fixed to the elastic block, and the ends of the wires are trimmed under the elastic block. The wires are strapped together with the strings of the stitching mechanism. The harness is removed together with the elastic block by turning the strings up. The method accelerates the manufacturing process of the bundle and the quality of the binding. 3 ill. ё

Description

The invention relates to the field of radio engineering, automation and computer technology, and in particular to a technology for automating the processes of making harnesses from electrical wires.

The aim of the invention is to improve the quality and speed up the manufacturing process of harnesses.

The proposed method for the manufacture of wire harnesses is implemented using the template for the layout and binding of wires, which is explained in the drawings, where:

Figure 1 shows a fragment of the layout of the wire on the template:

Figure 2 shows the addressing of the conclusions of the harness in the address module of the template;

Fig. 3 shows the removal of the bundled harness from the template.

The template for the layout and strapping of the harness contains a panel 1 with a notch 2,

repeating the contours of the bundle 3, the strings 4 installed along the edges of the notch 2 and the address modules 5.

A method of manufacturing wire harnesses is as follows.

After the layout, it is a panel 1 with a notch 2, repeating the contours of the bundle 3. The strings 4 on which the bundle 3 is laid are located perpendicular to the wires 6 and are pivotally-swivel on one side (pos. A, Fig. 1 and Fig. 3) fixed on the edge of the cut-out 2 of the panel 1. In the addressing locations of the terminals 7, address modules 5 are installed. The wire 6 coming from the coil through the wire stacker 8 is laid along the notch 2 and is laid on the strings 4 that support the Zine harness and allows it to sag into the notch 2 of the panel 1 of the template.

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The method of laying the wires perpendicular to the strings along the cutout of the template eliminates the sagging of the wires and keeps them at a predetermined distance from the shuttle of the binding mechanism, providing a calibrated tightening of the knots of the binding threads and high-quality binding of the wires of the bundles.

Addressing of pins 7 (Fig. 2) takes place using an address module 5 located on the addressing section of pins 7 of tow 3 along cutout 2 in panel 1.

The address module 5 comprises a comb 9 of address plates 10 and an elastic block 11 for fixing the terminals 7 of the bundled bundle 3.

A wire stacker 8 conducts a wire 6 along a series of plates 10, under a horizontal portion thereof. Having selected the desired plate 10 corresponding to the address of the given wire 6, the wire layer 8 leads the wire 6 behind it and lifts it near this plate above the level of its horizontal part. Next, the wire 6 moves and winds over the top of the plate 10 of the next address.

Thus, when addressing, the wire 6 is wound behind the plate 10 of the selected address in its lower part, then it is shifted towards the plate 10 of the next address and wound behind it in its upper part.

This technological technique of addressing the conclusions of 7 bundles to the specified addresses allows you to form a zone (pos. B, figure 2), guaranteed to be free of wires for pricking the needle of the sewing mechanism, leading automated tying 12 wires of the bundle 3 wires, eliminates the possibility of tying shuttle threads to the address plates 10 and ensures the fixation of the address pins 7, excluding the movement of wires 6 in the vertical direction when tying.

Having performed the operation of laying out the wires 6 and distributing their conclusions 7 to the given addresses, the bundle and its address part are strapped with threads 12 using a sewing mechanism.

The harness sections located between the strings 4 are tied along a zigzag path in a known manner, and when tying the harness sections passing over the strings 4, the needle of the sewing mechanism is injected before and after the string 4. The lower shuttle thread passes under the string 4, tying it to the wires 6.

The arrangement of wires 6 on the strings 4 of the template eliminates the sagging of the expanded wires b below the panel level .1, which

may lead to a violation of their integrity by a shuttle device.

By tying the strand to be tied to the strings 4 of the template, when tying, the wires 6 are kept from moving in the center of the panel, which provides a gap between the wires 6 and the edge of the cutout 2 in the panel 1, which is necessary for the needle of the sewing mechanism to pass. In addition, vertical movements of the bundle are excluded, which can lead to damage to the insulation of the wires 6.

Binding a Harness to Strings

4 is produced only at the intersection of the tow with strings 4, which does not violate

density after taking off

harness with pattern.

The fabricated harness 3 is removed from the template together with the elastic pads 11 by turning the strings 4 upward (Fig. 3).

The proposed method for the manufacture of wire harnesses, in comparison with the prototype, allows:

1. to improve the quality of manufacture of harnesses due to:

- elimination of sagging of wires below the panel level due to the layout of wires perpendicular to the strings along the cutout in the template, which allows to provide a calibrated tightening of the knots of the binding threads;

d fixing the harness with a shuttle using a shuttle thread covering the string from below and not allowing it to move behind

threads of the sewing mechanism;

- a method of laying out the terminals of the bundle in the address module, which allows forming zones that are guaranteed to be free of wires for pricking the needle of the sewing mechanism that conducts automated strapping of the wires of the bundle.

2. accelerate the process of manufacturing the harnesses by easily removing the harness from the template together with elastic address blocks by turning the strings up without disassembling the structural elements of the template.

Claims (1)

SUMMARY OF THE INVENTION A method for manufacturing wire harnesses including arranging wires perpendicular to the strings of the template, addressing the wires, fixing the ends of the wires in an elastic element, tying the wires with a flexible thread together with the strings of the template by means of a sewing mechanism and removing the harness from the template, characterized in that, in order to speed up the process and improve the quality of the binding, the addressing of each wire is carried out using an address module in the form combs with p-shaped plates by moving each wire along one of the combs with its establishment under the horizontal shelves of the combs and lifting above them with an arrangement between adjacent upper flanges of the comb plates of the next address, and removing the bundle from the template is carried out together with the elastic element by turning the strings of the template over its surface. FIG. 3