RU173793U1 - RACK INSTRUMENT WITH OPTIMIZED HEAT EXCHANGE - Google Patents

Abstract

The technical solution relates to electronics and can be used to accommodate heat-loaded electronic equipment. The instrument rack with optimized heat transfer comprises a frame with walls forming at least two floors, while the floor walls are made of at least two perforated plates located horizontally with a gap. In the instrument rack, perforation of plates can be performed in the form of two or more rows of holes uniformly distributed over the width of the partition or in the form of a grid of uniformly distributed holes. In the instrument rack, perforation of plates in the form of holes arranged in a checkerboard pattern can be performed. The holes in the plates of the partition wall in the instrument rack can be located one above the other. The holes in the plates of the partition wall in the instrument rack can be offset with respect to the holes in the adjacent plate. 1 n and 10 z.p. f-ly, 3 Fig.

Description

The utility model relates to radio electronics and can be used to accommodate heat-loaded electronic equipment.

Known cabinet electronic equipment (US patent No. 6788535, priority date 12/12/2002, registration date 09/07/2004), containing the main electronic compartment, made for the installation of heat-generating electrical equipment. The main compartment includes a rear wall panel and two clamshell doors, a floor panel and a cover panel, together forming a body, a forced air cooling device. A ventilated compartment containing a ventilation cooling system is attached to the main compartment. Common signs are the presence of a body (frame) with panels (walls). The disadvantages of this design of the cabinet is the presence of energy costs for forced air cooling, and turning off the ventilating device will quickly overheat the electrical equipment installed in the upper zone of the cabinet. Thus, the presence of fans leads to low reliability of cooling of electrical equipment.

Known cabinet electronic equipment (CEA) with passive cooling (RF patent No. 158898, priority date 07/30/2015, publication date 01/20/2016), containing mounted on the frame front cover, rear cover, side covers and top cover with seals. The frame contains two side covers with cutouts for easy air passage. The frame contains interfloor partitions, providing a complete overlap of the passage section of the frame between floors. Common with the claimed utility model features is the presence of a frame with covers (walls) and interfloor partitions. The disadvantage is the lack of convective heat transfer between the upper and lower floors, which can lead to overheating of the lower floor.

A known instrument cabinet (RF patent No. 773977, priority date 04/01/1976, publication date 10/23/1980) containing a case with double partitions installed in it that do not completely overlap the cabinet cross section between the REA units. Common signs are the presence of a case (frame) and double partitions installed in it. The disadvantage is the uneven cooling of the electronic equipment due to the fact that the air flow passes only along the front wall of the cabinet.

Known cabinet for electro-radio equipment (RF patent No. 3860, priority date 13.09.2005, publication date 10.06.2006). Common with the claimed utility model features are the case (frame), covers, pallets for shelves with holes for mounting harnesses and cables (plates with holes). The disadvantage is the low efficiency of heat removal from the convective flow of air passing through a tray with holes.

The task of optimizing heat transfer in the claimed utility model is understood as increasing the total amount of heat removed from the floors of the rack, as well as providing the possibility of installing more heat-loaded modules or modules with increased requirements for maintaining the operating temperature in the lower floor.

The technical result consists in increasing the efficiency of removing heat from the convective flow between the floors of the rack for electronic equipment, providing better heat dissipation from the lower floor of the rack while ensuring ease of manufacture.

The technical result is achieved due to the fact that the instrument rack contains a frame with walls forming at least two floors, while the floor walls are made of at least two perforated plates arranged horizontally with a gap.

The presence of perforation in the interfloor partitions allows the transfer of heat by convection of air from the lower module to the upper of the entire area of the partition, while part of the heat is removed through a buffer formed by perforated plates and side walls. The air flow blows over both plates of the interfloor partition, partially enters and swirls into the space formed by the gap of these plates. The path that the hot stream passes in contact with the walls and plates increases, and, accordingly, a large amount of heat is transferred to the frame. Thus, part of the heat from the modules installed in the lower floor does not enter the upper floor through convection, but is distributed to heat the double interfloor partition with a gap, and passes from this partition (buffer zone) to the body (frame and walls). Performing perforations in the plates and placing them in the frame are simple typical operations. The design is easy to manufacture.

In the instrument rack, perforation of plates can be performed in the form of two or more rows of holes uniformly distributed over the width of the partition or in the form of a grid of uniformly distributed holes. In the instrument rack, perforation of plates in the form of holes arranged in a checkerboard pattern can be performed. The holes in the plates of the partition wall in the instrument rack can be located one above the other. Such types of perforation will provide a uniform convective flow, which will increase the efficiency of heat removal from the lower floor.

The holes in the plates of the partition wall in the instrument rack can be offset with respect to the holes in the adjacent plate. In this case, an additional displacement of the convective flow is formed, which can increase the heat transfer efficiency in the buffer zone.

The holes in the plates in the instrument rack can be made in the form of circles, or ellipses, or rectangles. The shape of the holes provides ease of manufacture and the efficiency of convective flow passage.

In the dashboard rack on the walls can be placed radiators. In the rack of the instrument wall can be made in the form of radiators. The rack instrument wall can be made with cutouts. In the rack of the instrument perforation of the plates can be made with the possibility of mounting heat-generating electrical equipment. Perforated partitions can be made of aluminum alloy. All this increases the efficiency of heat removal from the rack floors and from the buffer zone.

FIG. 1 - frame rack instrument.

FIG. 2 - frame rack instrument with one module of electrical equipment on the lower and one on the upper floors.

FIG. 3 - frame rack instrument with a full load of electrical modules.

1-3, the front and side walls are not shown.

The instrument rack with optimized heat transfer (Fig. 1) contains a frame 1 with walls (not shown in the figure), forming in this design two floors (upper and lower). In this case, the role of the frame is played by the corners, front panel, side panels (not shown). The rack can be implemented with an independent frame, for example, from a steel profile. Instead of the front wall there may be a door or doors. In this case, the interfloor partitions are made of at least two plates 2, perforated with holes 3 and located horizontally with a gap of 4.

In FIG. 2, beams 5 are visible, attached to the holes 3 of the plate 2, electrical modules 6 are installed on the beams 5.

One, two or more modules can be installed on each floor. For example, in FIG. 3 full loading of the instrument rack involves the installation of five modules of 6 electrical equipment on each floor. Frame 1 can be made of two, three or more floors. The walls of the dashboard can be sealed or contain holes.

The air temperature inside the rack increases as a result of Joule and induction heating, and in the absence of holes on the side walls of the rack (under sealing conditions), the air is heated more intensively. As a result of heating, a stream of air is formed, which is directed to the plates 2 of the interfloor partition, passes through the holes 3 in the lower plate, partially swirls in the gap 4 between the plates 2. The flow of heated air from the lower floor receives a large contact area with the surface of the plates 2, and accordingly a large the amount of heat on the plates 2 is given to the frame 1 and to its walls. Thus, part of the heat from the modules 6 installed in the lower floor does not reach the upper floor as a result of convection, but is distributed to heat the double interfloor partition 2 with a gap of 4 (buffer) and transfers to the body (frame and walls).

The achievement of the technical result is confirmed by the simulation results. Simulation of the distribution of heated air in the instrument rack confirmed that the presence of a frame with walls forming at least two floors, interfloor partitions made of at least two perforated plates located with a gap, ensures optimal heat transfer between the floors of the rack without the expense of electricity for forced convection air flow.

Modeling was carried out in the Solidworks software package in order to compare the heat transfer efficiency between floors in the claimed design of the instrument rack with similar structures.

During the simulation, it was assumed that the ambient temperature is 45 ° C, the instrument rack consists of two floors with sealed walls and contains four electrical modules on each floor, the rack is made of aluminum alloy AMg6. Heat dissipation power on each floor: two modules of 15 W and two modules of 5 W, total on the floor - 40 W. Only on two floors - 80 watts.

The table shows the results of thermal modeling in different designs with the calculation of the average temperature (T) for the modules on the floor.

Without partitions (T, ° C) With one perforated partition (T, ° C) With two perforated plates (Fig. 4) (T, ° C) With two solid plates (T, ° C) With one solid plate (T, ° C) one 2 3 four 5 6 Top floor 65.34 64.46 64.09 63.61 63.65 Ground floor 62.84 63 62.95 63.46 63.54 Amount 128.18 127.46 127.04 127.07 127.19

The design of the rack, which does not have a partition, can lead to overheating of electronic equipment installed on the top floor, as in this case, the temperatures on the top floor are maximum (on average 65.34 ° C). In this design, the maximum temperature is also maximum, reflecting the amount of heat not removed from the floors of the rack.

The design of the rack with one plate (perforated - column 3 and solid - column 6) increases the amount of heat removed (due to conductive removal through the plate).

The design of the rack with two plates (perforated - column 4, solid - column 5) provides maximum heat dissipation. In a design with perforated plates, more heat is removed (the total temperature is the lowest). At the same time, the temperature of the upper floor decreases by 1.25 ° C from the worst version of the design, and the temperature of the lower floor practically does not increase compared to the best option for this floor (complete absence of a partition). When using this design, more heat-loaded modules or modules can be installed on the lower floor, which are subject to increased requirements for maintaining the operating temperature, i.e. optimized heat transfer is provided.

Claims (11)

1. The instrument rack, comprising a frame with walls, forming at least two floors, while the floor walls are made of at least two perforated plates located horizontally with a gap. 2. The instrument rack according to claim 1, in which the perforation of the plates is made in the form of two or more rows of holes uniformly distributed over the width of the partition or in the form of a grid of uniformly distributed holes. 3. The instrument rack according to claim 1, in which the perforation of the plates is made in the form of holes arranged in a checkerboard pattern. 4. Dashboard according to any one of paragraphs. 1, 2 and 3, in which the holes in the plates of the interfloor partition are located one above the other. 5. Dashboard according to any one of paragraphs. 1, 2 and 3, in which the holes in the plates of the interfloor partition are offset with respect to the holes in the adjacent plate. 6. Dashboard according to any one of paragraphs. 1, 2, 3 and 4, in which the holes in the plates are made in the form of circles, or ellipses, or rectangles. 7. The instrument rack according to claim 1, in which radiators are placed on the walls. 8. The instrument rack according to claim 1, in which the side walls are made in the form of radiators. 9. The instrument rack according to claim 1, in which the side walls are made with cutouts. 10. The instrument rack according to claim 1, in which the perforation of the plates is made with the possibility of mounting heat-generating electrical equipment. 11. The instrument rack according to claim 1, in which the perforated plates are made of aluminum alloy.

Images