PT74271B - Process for fusion joining a second electrically conductive chemical element which is of a solid form or of a dissociable solution form to the matrix of a first also electrically conductive chemical element and apparatus for carrying out such a process - Google Patents

Process for fusion joining a second electrically conductive chemical element which is of a solid form or of a dissociable solution form to the matrix of a first also electrically conductive chemical element and apparatus for carrying out such a process

Info

Publication number
PT74271B
PT74271B PT74271A PT7427182A PT74271B PT 74271 B PT74271 B PT 74271B PT 74271 A PT74271 A PT 74271A PT 7427182 A PT7427182 A PT 7427182A PT 74271 B PT74271 B PT 74271B
Authority
PT
Portugal
Prior art keywords
electrically conductive
chemical element
conductive chemical
matrix
carrying
Prior art date
Application number
PT74271A
Other languages
English (en)
Portuguese (pt)
Other versions
PT74271A (en
Original Assignee
Metafuse Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metafuse Ltd filed Critical Metafuse Ltd
Publication of PT74271A publication Critical patent/PT74271A/pt
Publication of PT74271B publication Critical patent/PT74271B/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C20/00—Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Packages (AREA)
PT74271A 1981-01-13 1982-01-12 Process for fusion joining a second electrically conductive chemical element which is of a solid form or of a dissociable solution form to the matrix of a first also electrically conductive chemical element and apparatus for carrying out such a process PT74271B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22476281A 1981-01-13 1981-01-13
US31967881A 1981-11-09 1981-11-09

Publications (2)

Publication Number Publication Date
PT74271A PT74271A (en) 1982-02-01
PT74271B true PT74271B (en) 1983-08-23

Family

ID=26918999

Family Applications (1)

Application Number Title Priority Date Filing Date
PT74271A PT74271B (en) 1981-01-13 1982-01-12 Process for fusion joining a second electrically conductive chemical element which is of a solid form or of a dissociable solution form to the matrix of a first also electrically conductive chemical element and apparatus for carrying out such a process

Country Status (15)

Country Link
EP (1) EP0056331B1 (fi)
KR (1) KR830009256A (fi)
AU (1) AU7944782A (fi)
BR (1) BR8200156A (fi)
CA (1) CA1212070A (fi)
DD (1) DD202456A5 (fi)
DE (1) DE3276073D1 (fi)
DK (1) DK10982A (fi)
FI (1) FI820064L (fi)
GR (1) GR75833B (fi)
IL (1) IL64705A0 (fi)
MX (1) MX157087A (fi)
NO (1) NO820074L (fi)
PL (1) PL234880A1 (fi)
PT (1) PT74271B (fi)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2118973A (en) * 1982-04-27 1983-11-09 Corrintec Uk Ltd Electrical connector and manufacture thereof
AU8083394A (en) * 1993-10-20 1995-05-08 Orbit Technologies, Inc. Coating for a resistance welding device
AT403674B (de) * 1995-11-08 1998-04-27 Euroligna Masch Aggregate Führungsschiene mit profilrohr und verfahren zu deren herstellung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR774077A (fr) * 1934-06-02 1934-11-30 Fortin & Saunier Ets Perfectionnement aux appareils portatifs pour dépôts électrolytiques
US3743590A (en) * 1971-04-26 1973-07-03 R Roll Electro plating device
US4206028A (en) * 1976-12-14 1980-06-03 Inoue-Japax Research Incorporated Electrochemical polishing system
JPS6056238B2 (ja) * 1979-06-01 1985-12-09 株式会社井上ジャパックス研究所 電気メツキ方法

Also Published As

Publication number Publication date
EP0056331B1 (en) 1987-04-15
BR8200156A (pt) 1982-11-03
PT74271A (en) 1982-02-01
IL64705A0 (en) 1982-03-31
DE3276073D1 (en) 1987-05-21
DK10982A (da) 1982-07-14
DD202456A5 (de) 1983-09-14
NO820074L (no) 1982-07-14
CA1212070A (en) 1986-09-30
GR75833B (fi) 1984-08-02
EP0056331A1 (en) 1982-07-21
FI820064L (fi) 1982-07-14
KR830009256A (ko) 1983-12-19
AU7944782A (en) 1982-07-22
MX157087A (es) 1988-10-21
PL234880A1 (en) 1983-05-09

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