PT3708291T - Liga para soldadura e junta de solda - Google Patents
Liga para soldadura e junta de soldaInfo
- Publication number
- PT3708291T PT3708291T PT198398273T PT19839827T PT3708291T PT 3708291 T PT3708291 T PT 3708291T PT 198398273 T PT198398273 T PT 198398273T PT 19839827 T PT19839827 T PT 19839827T PT 3708291 T PT3708291 T PT 3708291T
- Authority
- PT
- Portugal
- Prior art keywords
- solder joint
- soldering alloy
- soldering
- alloy
- solder
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018138915A JP6493610B1 (ja) | 2018-07-24 | 2018-07-24 | はんだ合金、およびはんだ継手 |
Publications (1)
Publication Number | Publication Date |
---|---|
PT3708291T true PT3708291T (pt) | 2022-02-11 |
Family
ID=65999167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PT198398273T PT3708291T (pt) | 2018-07-24 | 2019-06-28 | Liga para soldadura e junta de solda |
Country Status (9)
Country | Link |
---|---|
US (1) | US20200384577A1 (pt) |
EP (1) | EP3708291B1 (pt) |
JP (1) | JP6493610B1 (pt) |
KR (1) | KR102266566B1 (pt) |
CN (1) | CN111954585B (pt) |
PH (1) | PH12020550954B1 (pt) |
PT (1) | PT3708291T (pt) |
TW (1) | TWI694885B (pt) |
WO (1) | WO2020021967A1 (pt) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6700568B1 (ja) * | 2019-08-09 | 2020-05-27 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ball Grid Arrayおよびはんだ継手 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4144415B2 (ja) * | 2003-01-07 | 2008-09-03 | 千住金属工業株式会社 | 鉛フリーはんだ |
US7282175B2 (en) * | 2003-04-17 | 2007-10-16 | Senju Metal Industry Co., Ltd. | Lead-free solder |
JP4577888B2 (ja) * | 2004-02-04 | 2010-11-10 | 千住金属工業株式会社 | Fe喰われ防止用はんだ合金とFe喰われ防止方法 |
JP2007237252A (ja) * | 2006-03-09 | 2007-09-20 | Nippon Steel Materials Co Ltd | 自動車搭載電子部材用鉛フリーハンダ合金、ハンダボール及び電子部材 |
US8562906B2 (en) * | 2006-03-09 | 2013-10-22 | Nippon Steel & Sumikin Materials Co., Ltd. | Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
CN101642856A (zh) * | 2009-08-20 | 2010-02-10 | 太仓市首创锡业有限公司 | 一种高可靠低银无铅焊料及其制备方法 |
WO2012131861A1 (ja) * | 2011-03-28 | 2012-10-04 | 千住金属工業株式会社 | 鉛フリーはんだボール |
BR112014032941A2 (pt) * | 2012-06-30 | 2017-06-27 | Senju Metal Industry Co | bola de solda sem chumbo |
WO2014170963A1 (ja) * | 2013-04-16 | 2014-10-23 | 千住金属工業株式会社 | 鉛フリーはんだボール及び鉛フリーはんだボールの検査方法 |
CN103586599A (zh) * | 2013-11-12 | 2014-02-19 | 宁波市鄞州恒迅电子材料有限公司 | 无铅焊锡丝 |
JP6323606B1 (ja) * | 2017-10-17 | 2018-05-16 | 千住金属工業株式会社 | 線はんだ、はんだ継手の製造方法およびはんだ付け方法 |
-
2018
- 2018-07-24 JP JP2018138915A patent/JP6493610B1/ja active Active
-
2019
- 2019-06-28 CN CN201980023229.8A patent/CN111954585B/zh active Active
- 2019-06-28 US US16/770,376 patent/US20200384577A1/en not_active Abandoned
- 2019-06-28 KR KR1020207026223A patent/KR102266566B1/ko active IP Right Grant
- 2019-06-28 WO PCT/JP2019/025913 patent/WO2020021967A1/ja unknown
- 2019-06-28 PT PT198398273T patent/PT3708291T/pt unknown
- 2019-06-28 EP EP19839827.3A patent/EP3708291B1/en active Active
- 2019-07-12 TW TW108124629A patent/TWI694885B/zh active
-
2020
- 2020-06-19 PH PH12020550954A patent/PH12020550954B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3708291B1 (en) | 2022-01-05 |
EP3708291A4 (en) | 2020-09-16 |
KR102266566B1 (ko) | 2021-06-18 |
CN111954585B (zh) | 2021-09-28 |
TWI694885B (zh) | 2020-06-01 |
TW202007465A (zh) | 2020-02-16 |
JP6493610B1 (ja) | 2019-04-03 |
WO2020021967A1 (ja) | 2020-01-30 |
CN111954585A (zh) | 2020-11-17 |
PH12020550954A1 (en) | 2021-03-22 |
KR20200118863A (ko) | 2020-10-16 |
EP3708291A1 (en) | 2020-09-16 |
US20200384577A1 (en) | 2020-12-10 |
PH12020550954B1 (en) | 2021-03-22 |
JP2020015054A (ja) | 2020-01-30 |
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