PT2923836T - Processo para produção de um molde de impressão para impressão técnica - Google Patents

Processo para produção de um molde de impressão para impressão técnica

Info

Publication number
PT2923836T
PT2923836T PT151604337T PT15160433T PT2923836T PT 2923836 T PT2923836 T PT 2923836T PT 151604337 T PT151604337 T PT 151604337T PT 15160433 T PT15160433 T PT 15160433T PT 2923836 T PT2923836 T PT 2923836T
Authority
PT
Portugal
Prior art keywords
printing
manufacturing
technical
stencil
printing stencil
Prior art date
Application number
PT151604337T
Other languages
English (en)
Original Assignee
Christian Koenen Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Christian Koenen Gmbh filed Critical Christian Koenen Gmbh
Publication of PT2923836T publication Critical patent/PT2923836T/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B41C1/145—Forme preparation for stencil-printing or silk-screen printing by perforation using an energetic radiation beam, e.g. a laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • B41N1/248—Mechanical details, e.g. fixation holes, reinforcement or guiding means; Perforation lines; Ink holding means; Visually or otherwise detectable marking means; Stencil units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
PT151604337T 2014-03-25 2015-03-24 Processo para produção de um molde de impressão para impressão técnica PT2923836T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014205547.4A DE102014205547B4 (de) 2014-03-25 2014-03-25 Verfahren zur Herstellung einer Druckschablone für den technischen Druck

Publications (1)

Publication Number Publication Date
PT2923836T true PT2923836T (pt) 2021-02-12

Family

ID=52780850

Family Applications (1)

Application Number Title Priority Date Filing Date
PT151604337T PT2923836T (pt) 2014-03-25 2015-03-24 Processo para produção de um molde de impressão para impressão técnica

Country Status (7)

Country Link
EP (1) EP2923836B1 (pt)
DE (1) DE102014205547B4 (pt)
DK (1) DK2923836T3 (pt)
ES (1) ES2838025T3 (pt)
HU (1) HUE053142T2 (pt)
PL (1) PL2923836T3 (pt)
PT (1) PT2923836T (pt)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110328963A (zh) * 2019-07-31 2019-10-15 江苏盟星智能科技有限公司 一种丝网激光直接制版机及加工方法
MX2022010585A (es) * 2020-02-28 2022-12-13 Newtech Llc Modificacion de superficie de plantillas de pasta de soldadura.
JP7112123B2 (ja) * 2020-11-27 2022-08-03 ミタニマイクロニクス株式会社 スクリーンマスク及び印刷物の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3160084B2 (ja) 1992-07-24 2001-04-23 株式会社ムラカミ スクリーン印刷用メタルマスクの製造方法
DE19503983A1 (de) 1995-02-07 1996-08-08 Koenen Gmbh Verfahren zum Herstellen von Metallschablonen für die SMD-Technik
DE29708329U1 (de) 1997-05-09 1997-09-04 Becker Reiner Siebdruckschablone für pastöse Druckmedien
US6273327B1 (en) 1999-06-16 2001-08-14 Trw Inc. Apparatus and method for depositing solder material onto a circuit board
DE102005016027B4 (de) 2005-04-07 2016-05-04 Koenen Gmbh Verfahren zur Herstellung einer Druckschablone für den technischen Siebdruck und damit hergestellte Druckschablone
JP2009208259A (ja) * 2008-02-29 2009-09-17 Kyocer Slc Technologies Corp 印刷マスクおよびこれを用いた配線基板の製造方法

Also Published As

Publication number Publication date
DK2923836T3 (da) 2021-02-22
DE102014205547B4 (de) 2024-03-21
PL2923836T3 (pl) 2021-08-23
EP2923836A1 (de) 2015-09-30
DE102014205547A1 (de) 2015-10-01
HUE053142T2 (hu) 2021-06-28
EP2923836B1 (de) 2020-11-25
ES2838025T3 (es) 2021-07-01

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