PT2730682T - Solução alcalina, sem cianeto, para eletrodeposição de ligas de ouro, um método para eletrodepositar e um substrato compreendendo um depósito brilhante e sem corrosão de uma liga de ouro - Google Patents

Solução alcalina, sem cianeto, para eletrodeposição de ligas de ouro, um método para eletrodepositar e um substrato compreendendo um depósito brilhante e sem corrosão de uma liga de ouro

Info

Publication number
PT2730682T
PT2730682T PT12192458T PT12192458T PT2730682T PT 2730682 T PT2730682 T PT 2730682T PT 12192458 T PT12192458 T PT 12192458T PT 12192458 T PT12192458 T PT 12192458T PT 2730682 T PT2730682 T PT 2730682T
Authority
PT
Portugal
Prior art keywords
electroplating
free
gold
cyanide
bright
Prior art date
Application number
PT12192458T
Other languages
English (en)
Portuguese (pt)
Inventor
Nelias Coline
Pommier Nicolas
Duprat Jean-Jacques
Original Assignee
Coventya Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coventya Sas filed Critical Coventya Sas
Publication of PT2730682T publication Critical patent/PT2730682T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PT12192458T 2012-11-13 2012-11-13 Solução alcalina, sem cianeto, para eletrodeposição de ligas de ouro, um método para eletrodepositar e um substrato compreendendo um depósito brilhante e sem corrosão de uma liga de ouro PT2730682T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12192458.3A EP2730682B1 (fr) 2012-11-13 2012-11-13 Solution alcaline sans cyanure pour l'électrodéposition d'alliages d'or, procédé d'électrodéposition et substrat comprenant un dépôt anticorrosion brillant d'un alliage d'or

Publications (1)

Publication Number Publication Date
PT2730682T true PT2730682T (pt) 2018-11-09

Family

ID=47189760

Family Applications (1)

Application Number Title Priority Date Filing Date
PT12192458T PT2730682T (pt) 2012-11-13 2012-11-13 Solução alcalina, sem cianeto, para eletrodeposição de ligas de ouro, um método para eletrodepositar e um substrato compreendendo um depósito brilhante e sem corrosão de uma liga de ouro

Country Status (5)

Country Link
EP (1) EP2730682B1 (fr)
ES (1) ES2685317T3 (fr)
PL (1) PL2730682T3 (fr)
PT (1) PT2730682T (fr)
TR (1) TR201811860T4 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105132973A (zh) * 2015-09-22 2015-12-09 太原工业学院 一种环保型无氰电镀铜锌合金溶液及其电镀铜锌合金工艺
CN110699721B (zh) * 2019-11-20 2021-08-20 长春黄金研究院有限公司 一种无氰镀金铜合金电镀液及其应用
CN110699713A (zh) * 2019-11-21 2020-01-17 长春黄金研究院有限公司 一种无氰金合金电铸液及其使用方法
CN114075680A (zh) * 2020-08-21 2022-02-22 江苏澳光电子有限公司 一种耐腐蚀水封电镀液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5340529A (en) * 1993-07-01 1994-08-23 Dewitt Troy C Gold jewelry alloy
US5750018A (en) * 1997-03-18 1998-05-12 Learonal, Inc. Cyanide-free monovalent copper electroplating solutions
US6511589B1 (en) * 2001-08-17 2003-01-28 Electroplating Engineers Of Japan Limited Gold plating solution and gold plating method using thereof
JP2003183258A (ja) * 2001-12-19 2003-07-03 Tanaka Kikinzoku Kogyo Kk 金錯体
JP2005256072A (ja) 2004-03-11 2005-09-22 Tanaka Kikinzoku Kogyo Kk 金錯体
SG127854A1 (en) * 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes

Also Published As

Publication number Publication date
ES2685317T3 (es) 2018-10-08
PL2730682T3 (pl) 2018-12-31
EP2730682A1 (fr) 2014-05-14
EP2730682B1 (fr) 2018-07-25
TR201811860T4 (tr) 2018-09-21

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