PL430653A1 - Sposób wycinania użytków z folii polipropylenowej oraz urządzenie do realizacji tego sposobu - Google Patents
Sposób wycinania użytków z folii polipropylenowej oraz urządzenie do realizacji tego sposobuInfo
- Publication number
- PL430653A1 PL430653A1 PL430653A PL43065319A PL430653A1 PL 430653 A1 PL430653 A1 PL 430653A1 PL 430653 A PL430653 A PL 430653A PL 43065319 A PL43065319 A PL 43065319A PL 430653 A1 PL430653 A1 PL 430653A1
- Authority
- PL
- Poland
- Prior art keywords
- cutting
- foil
- laser
- implementing
- pieces
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Laser Beam Processing (AREA)
Abstract
Przedmiotem wynalazku jest sposób wytwarzania użytków z folii polipropylenowej o grubości od 20 µm do 100 µm obejmujący dostarczanie folii nad stołem operacyjnym, mocowanie folii do stołu, wycinanie użytku o zadanym kształcie za pomocą głowicy tnącej techniką laserową, osuszanie układu optycznego głowicy tnącej, nawijanie ażuru na bęben odbiorczy i opcjonalnie przenoszenie użytku do formy wtryskarki, charakteryzujące się tym, że użytki (142) wycina się w procesie zimnej ablacji laserem ultrafioletowym o długości fali promienia UV wynoszącej 355 nm, energii impulsu wynoszącej od 5 do 13 µJ, mocy lasera wynoszącej 5 W, częstotliwości wynoszącej od 20 do 150 kHz, czasie trwania impulsu wynoszącym od 15 do 35 ns i wielkości plamki wynoszącej od 5 do 50 µm, a cięcie prowadzi się przy zmiennej prędkości skanowania wynoszącej od 50 do 1500 mm/s. Przedmiotem wynalazku jest także urządzenie do realizacji sposobu.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL430653A PL430653A1 (pl) | 2019-07-18 | 2019-07-18 | Sposób wycinania użytków z folii polipropylenowej oraz urządzenie do realizacji tego sposobu |
EP20020260.4A EP3766626A1 (en) | 2019-07-18 | 2020-06-04 | Method of cutting pieces out of a polypropylene film and a device for implementing this method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL430653A PL430653A1 (pl) | 2019-07-18 | 2019-07-18 | Sposób wycinania użytków z folii polipropylenowej oraz urządzenie do realizacji tego sposobu |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20020260.4A Previously-Filed-Application EP3766626A1 (en) | 2019-07-18 | 2020-06-04 | Method of cutting pieces out of a polypropylene film and a device for implementing this method |
Publications (1)
Publication Number | Publication Date |
---|---|
PL430653A1 true PL430653A1 (pl) | 2021-01-25 |
Family
ID=71409077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL430653A PL430653A1 (pl) | 2019-07-18 | 2019-07-18 | Sposób wycinania użytków z folii polipropylenowej oraz urządzenie do realizacji tego sposobu |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP3766626A1 (pl) |
PL (1) | PL430653A1 (pl) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113473715B (zh) * | 2021-06-28 | 2022-06-07 | 江苏先河激光技术有限公司 | 一种用于fpc柔性电路板的激光切割贴合方法、装置 |
CN115431143B (zh) * | 2022-06-02 | 2024-05-28 | 河南华辰智控技术有限公司 | 金属材料抗疲劳抛光装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PL128119B1 (en) | 1979-12-24 | 1983-12-31 | Prod Nauk Podzespolow Elektron | Blanking die for foil shapes |
US6734387B2 (en) * | 1999-05-27 | 2004-05-11 | Spectra Physics Lasers, Inc. | Method and apparatus for micro-machining of articles that include polymeric materials |
ATE252816T1 (de) * | 1999-08-03 | 2003-11-15 | Xsil Technology Ltd | Schaltungsvereinzelungssystem und verfahren |
US20060097430A1 (en) * | 2004-11-05 | 2006-05-11 | Li Xiaochun | UV pulsed laser machining apparatus and method |
JP5665170B2 (ja) | 2010-04-27 | 2015-02-04 | スターテクノ株式会社 | インモールドラベル成形品のラベル切断装置、ラベル切断供給装置、ラベル切断受け渡し装置とラベル切断方法、ラベル切断供給方法及びラベル切断受け渡し方法 |
JP5729752B2 (ja) * | 2010-12-27 | 2015-06-03 | スターテクノ株式会社 | インモールドラベル成形用ラベル切断装置におけるラベルシート移送装置及びラベルシート移送方法 |
TW201232606A (en) | 2011-01-31 | 2012-08-01 | Gallant Prec Machining Co | Multilayer thin-films substrate processing method and processing apparatus thereof |
US20130168373A1 (en) * | 2011-12-28 | 2013-07-04 | Heng-Kuan Lin | Laser cutting plotter |
US20130258034A1 (en) | 2012-03-31 | 2013-10-03 | Devlinks, Ltd. | In-Mold Labeling |
PL225519B1 (pl) | 2012-07-25 | 2017-04-28 | Natalii Spółka Z Ograniczoną Odpowiedzialnością | Sposób wykrawania etykiet, zwłaszcza z materiałów warstwowych i układania ich w stosy oraz urządzenia do realizacji tych sposobów |
CN203124969U (zh) | 2013-01-23 | 2013-08-14 | 刘茂珍 | 基于自适应光学的激光微细加工设备 |
CN103128450B (zh) | 2013-02-19 | 2015-08-19 | 深圳市海目星激光科技有限公司 | 一种紫外激光加工装置 |
ITUB20153944A1 (it) | 2015-09-28 | 2017-03-28 | Cartes S R L | Apparato e metodo per produrre porzioni discrete. |
CN105665942A (zh) | 2016-03-28 | 2016-06-15 | 深圳华工激光设备有限公司 | 一种用于薄膜加工中的激光设备及其方法 |
-
2019
- 2019-07-18 PL PL430653A patent/PL430653A1/pl unknown
-
2020
- 2020-06-04 EP EP20020260.4A patent/EP3766626A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP3766626A1 (en) | 2021-01-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102584490B1 (ko) | 투명한 재료의 레이저 가공 방법 및 장치 | |
CN100444326C (zh) | 晶片分割方法 | |
TWI632975B (zh) | 雷射鑽孔材料的方法及玻璃物件 | |
PL430653A1 (pl) | Sposób wycinania użytków z folii polipropylenowej oraz urządzenie do realizacji tego sposobu | |
US20110132885A1 (en) | Laser machining and scribing systems and methods | |
CN103030266B (zh) | 激光切割方法与装置 | |
KR20190003766A (ko) | 사파이어 절단 방법 및 그 장치 | |
WO2015132640A1 (ru) | Способ лазерной наплавки и устройство для его осуществления | |
TW201235143A (en) | Method and apparatus for improved laser scribing of opto-electric devices | |
CN104576530A (zh) | 晶片的加工方法 | |
JP2015533654A5 (pl) | ||
JP2004066327A5 (pl) | ||
JP5879106B2 (ja) | 脆性材料基板のスクライブ方法 | |
WO2004086935A3 (en) | System, apparatus and method for large area tissue ablation | |
CN101733556A (zh) | 一种激光切割机 | |
RU2019121901A (ru) | Способ изготовления пропускающей оптики | |
CN109352184B (zh) | 硅基晶圆的分束激光切割方法 | |
JP2003334675A5 (pl) | ||
WO2020239857A1 (en) | Laser hole drilling apparatus and method | |
CN104625429A (zh) | 一种对金属厚板的激光切割工艺 | |
CN108747060A (zh) | 一种基于激光能量调控的空腔结构零件打孔背壁防护方法 | |
CN107520541B (zh) | 激光切割脆性材料的方法 | |
WO2013091780A8 (en) | Operating machine and related method for the surface treatment of cylinders | |
CN204209284U (zh) | 一种硬质材料激光深加工设备 | |
CN109128532A (zh) | 一种多工位即时清洗的激光阵列微孔加工方法 |