PL3756251T3 - Sposób obróbki co najmniej jednej szafy sterowniczej - Google Patents

Sposób obróbki co najmniej jednej szafy sterowniczej

Info

Publication number
PL3756251T3
PL3756251T3 PL19720766.5T PL19720766T PL3756251T3 PL 3756251 T3 PL3756251 T3 PL 3756251T3 PL 19720766 T PL19720766 T PL 19720766T PL 3756251 T3 PL3756251 T3 PL 3756251T3
Authority
PL
Poland
Prior art keywords
processing
electrical cabinet
cabinet
electrical
Prior art date
Application number
PL19720766.5T
Other languages
English (en)
Inventor
Markus Hain
Heiko Holighaus
Siegfried Boehme
Lars Martin
Original Assignee
Rittal Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rittal Gmbh & Co. Kg filed Critical Rittal Gmbh & Co. Kg
Publication of PL3756251T3 publication Critical patent/PL3756251T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B3/00—Apparatus specially adapted for the manufacture, assembly, or maintenance of boards or switchgear
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/26—Casings; Parts thereof or accessories therefor
    • H02B1/30—Cabinet-type casings; Parts thereof or accessories therefor
    • H02B1/301—Cabinet-type casings; Parts thereof or accessories therefor mainly consisting of a frame onto which plates are mounted
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/26—Casings; Parts thereof or accessories therefor
    • H02B1/40—Wall-mounted casings; Parts thereof or accessories therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Automatic Assembly (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • General Factory Administration (AREA)
PL19720766.5T 2018-04-20 2019-03-22 Sposób obróbki co najmniej jednej szafy sterowniczej PL3756251T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018109606.2A DE102018109606B3 (de) 2018-04-20 2018-04-20 Verfahren für die Bearbeitung mindestens eines Schaltschranks
PCT/DE2019/100274 WO2019201377A1 (de) 2018-04-20 2019-03-22 Verfahren für die bearbeitung mindestens eines schaltschranks

Publications (1)

Publication Number Publication Date
PL3756251T3 true PL3756251T3 (pl) 2023-09-25

Family

ID=66349213

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19720766.5T PL3756251T3 (pl) 2018-04-20 2019-03-22 Sposób obróbki co najmniej jednej szafy sterowniczej

Country Status (13)

Country Link
US (1) US20210135434A1 (pl)
EP (1) EP3756251B1 (pl)
JP (1) JP7009653B2 (pl)
CN (1) CN111989835B (pl)
BR (1) BR112020019917A2 (pl)
CA (1) CA3095110C (pl)
DE (1) DE102018109606B3 (pl)
ES (1) ES2950741T3 (pl)
IL (1) IL278038B2 (pl)
MX (1) MX2020011054A (pl)
PL (1) PL3756251T3 (pl)
RU (1) RU2754581C1 (pl)
WO (1) WO2019201377A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019123245B4 (de) * 2019-08-29 2021-06-24 Rittal Gmbh & Co. Kg Verfahren für die Bestückung einer Montageplatte mit Bestückungskomponenten einer Schalt- und/oder Steuerungsanlage

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4438525A1 (de) 1994-10-31 1996-05-02 Peter Sonntag Verfahren und Vorrichtung zur Bearbeitung und Verdrahtung von Schaltschränken und ihren Komponenten
DE19804901C2 (de) * 1998-02-07 2003-04-17 Rittal Gmbh & Co Kg Schaltschrank
DE102005046762A1 (de) * 2005-09-29 2007-04-05 Siemens Ag System und Verfahren zur Darstellung von Benutzerinformationen, insbesondere von Augmented-Reality-Informationen, mit Hilfe von in RFID-Datenspeichern hinterlegten Trackinginformationen
DE102006010686B4 (de) 2006-03-08 2010-04-01 Rittal Gmbh & Co. Kg Anordnung mit mindestens einem Schaltschrank und/oder Rack
DE202007004904U1 (de) 2007-04-03 2007-07-19 Schönrock, Jens Dokumentationszentrum für anlagenspezifische Aufzeichnungen zum Einbau in Verteilungen und Schaltanlagen
JP2009053934A (ja) 2007-08-27 2009-03-12 Toshiba Corp 配電盤、ｉｃタグリーダおよびメンテナンスサーバ
DE502007005976D1 (de) 2007-10-25 2011-01-27 Iie Ges Fuer Innovative Industrieelektronik Mbh Montagearbeitsplatz
DE102007052125A1 (de) 2007-10-31 2009-05-07 Siemens Aktiengesellschaft Prüfsystem für einen Baugruppenträger, Baugruppenträger mit einem Prüfsystem sowie Verfahren zum Prüfen eines Baugruppenträgers
CN201402561Y (zh) * 2009-04-10 2010-02-10 吴胜贤 插装式组合标识箱
US20110187503A1 (en) * 2010-02-01 2011-08-04 Mario Costa Method and System for Data Center Rack Brackets For Automatic Location Tracking of Information Technology Components
DE102011121664A1 (de) * 2011-12-20 2013-06-20 Abb Ag Vorgeprägter Flanschausbruch, Bau- oder Gehäuseteil mit einem solchen Flanschausbruch, Schalt- oder Verteilerschrank mit einem derartigen Bau- oder Gehäuseteil sowie ein System und Verfahren zum Vorprägen von Flanschausbrüchen
CN202930771U (zh) * 2012-09-29 2013-05-08 安徽德信电气有限公司 一种开关柜的眉头结构
US20140253289A1 (en) * 2013-03-08 2014-09-11 Noah Groth Data center server location and monitoring system
JP6851134B2 (ja) 2015-05-20 2021-03-31 日東工業株式会社 キャビネット選定システム
CN204597251U (zh) * 2015-05-22 2015-08-26 杭州万洲电气有限公司 一种标记牌以及带有该标记牌的mns型开关柜
CN109074414B (zh) * 2016-05-02 2023-06-20 维纳尔电气系统有限公司 用于配置配电箱的方法及系统
CN206461257U (zh) * 2017-02-16 2017-09-01 张家港市鑫昱翔金属制品有限公司 模块式电器配置箱

Also Published As

Publication number Publication date
MX2020011054A (es) 2020-11-06
IL278038B1 (en) 2023-05-01
US20210135434A1 (en) 2021-05-06
CN111989835B (zh) 2022-11-01
DE102018109606B3 (de) 2019-07-11
IL278038B2 (en) 2023-09-01
ES2950741T3 (es) 2023-10-13
EP3756251A1 (de) 2020-12-30
CA3095110A1 (en) 2019-10-24
CA3095110C (en) 2022-10-18
BR112020019917A2 (pt) 2021-01-05
EP3756251B1 (de) 2023-05-10
RU2754581C1 (ru) 2021-09-03
JP2021519056A (ja) 2021-08-05
IL278038A (en) 2020-11-30
CN111989835A (zh) 2020-11-24
WO2019201377A1 (de) 2019-10-24
JP7009653B2 (ja) 2022-01-25

Similar Documents

Publication Publication Date Title
PL3384568T3 (pl) Profil ramowy do stelaża ramowego szafy sterowniczej i odpowiedni stelaż ramowy
SG10201905294RA (en) Wafer processing method
SG10201904699RA (en) Wafer processing method
SG10202009275VA (en) Processing apparatus
SG10201913764UA (en) Processing apparatus
SG10201905935VA (en) Wafer processing method
EP3732774C0 (en) METHOD FOR PRODUCING AN ELECTRICAL MACHINE
GB201701906D0 (en) Processing method
SG10201911116YA (en) Wafer processing method
SG10201909522RA (en) Wafer processing method
SG10201906678TA (en) Wafer processing method
SG10201905936RA (en) Wafer processing method
SG10201904719TA (en) Wafer processing method
GB201709540D0 (en) Processing method
SG10201910165QA (en) Wafer processing method
SG10201910032WA (en) Wafer processing method
SG10201906897SA (en) Wafer processing method
SG10201906896QA (en) Wafer processing method
SG10201904710UA (en) Wafer processing method
PL3756251T3 (pl) Sposób obróbki co najmniej jednej szafy sterowniczej
SG10202011113WA (en) Processing apparatus
SG10202007416QA (en) Processing apparatus
SG10201911118XA (en) Wafer processing method
SG10201909755QA (en) Wafer processing method
SG10201909524PA (en) Wafer processing method