PL363969A1 - Mikrostopowy stop miedzi beztlenowej i jego zastosowanie - Google Patents

Mikrostopowy stop miedzi beztlenowej i jego zastosowanie

Info

Publication number
PL363969A1
PL363969A1 PL02363969A PL36396902A PL363969A1 PL 363969 A1 PL363969 A1 PL 363969A1 PL 02363969 A PL02363969 A PL 02363969A PL 36396902 A PL36396902 A PL 36396902A PL 363969 A1 PL363969 A1 PL 363969A1
Authority
PL
Poland
Prior art keywords
micro
copper alloy
free copper
alloyed
alloyed oxygen
Prior art date
Application number
PL02363969A
Other languages
English (en)
Inventor
Timo Salonen
Antti Kilpinen
Original Assignee
Outokumpu Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oyj filed Critical Outokumpu Oyj
Publication of PL363969A1 publication Critical patent/PL363969A1/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Arc Welding In General (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
PL02363969A 2001-03-09 2002-03-08 Mikrostopowy stop miedzi beztlenowej i jego zastosowanie PL363969A1 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20010473A FI113061B (fi) 2001-03-09 2001-03-09 Kupariseos
PCT/FI2002/000184 WO2002072901A1 (en) 2001-03-09 2002-03-08 Micro-alloyed oxygen-free copper alloy and its use

Publications (1)

Publication Number Publication Date
PL363969A1 true PL363969A1 (pl) 2004-11-29

Family

ID=8560689

Family Applications (1)

Application Number Title Priority Date Filing Date
PL02363969A PL363969A1 (pl) 2001-03-09 2002-03-08 Mikrostopowy stop miedzi beztlenowej i jego zastosowanie

Country Status (11)

Country Link
US (1) US20040096353A1 (pl)
EP (1) EP1373588A1 (pl)
JP (1) JP2004538362A (pl)
CN (1) CN1496416A (pl)
BR (1) BR0207879A (pl)
CZ (1) CZ20032372A3 (pl)
FI (1) FI113061B (pl)
HU (1) HUP0303470A3 (pl)
PL (1) PL363969A1 (pl)
SK (1) SK11512003A3 (pl)
WO (1) WO2002072901A1 (pl)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009024132A2 (de) * 2007-08-21 2009-02-26 Prymetall Gmbh & Co. Kg Kabel mit koaxialen aufbau zur übertragung von hochfrequenzsignalen sowie verfahren zur herstellung eines derartigen kabels
ITUA20163211A1 (it) * 2016-05-06 2017-11-06 De Angeli Prod S R L Conduttore elettrico per avvolgimenti elettrici, specialmente per cavo trasposto continuo
EP3622094B1 (en) 2017-05-10 2021-07-28 Haldor Topsøe A/S A process for reducing the content of oxygen in metallic copper
CN111549254A (zh) * 2020-04-29 2020-08-18 铜陵有色金属集团股份有限公司金威铜业分公司 一种无氧铜基微合金及其制备方法和应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI40237B (pl) * 1966-05-04 1968-07-31 Outokumpu Oy
US4059437A (en) * 1975-07-02 1977-11-22 Phelps Dodge Industries, Inc. Oxygen-free copper product and process
US4233067A (en) * 1978-01-19 1980-11-11 Sumitomo Electric Industries, Ltd. Soft copper alloy conductors
US4311522A (en) * 1980-04-09 1982-01-19 Amax Inc. Copper alloys with small amounts of manganese and selenium
JP2726939B2 (ja) * 1989-03-06 1998-03-11 日鉱金属 株式会社 加工性，耐熱性の優れた高導電性銅合金

Also Published As

Publication number Publication date
CZ20032372A3 (cs) 2003-12-17
CN1496416A (zh) 2004-05-12
WO2002072901A1 (en) 2002-09-19
FI20010473A0 (fi) 2001-03-09
JP2004538362A (ja) 2004-12-24
HUP0303470A2 (hu) 2004-01-28
EP1373588A1 (en) 2004-01-02
SK11512003A3 (sk) 2004-04-06
US20040096353A1 (en) 2004-05-20
FI20010473A (fi) 2002-09-10
FI113061B (fi) 2004-02-27
HUP0303470A3 (en) 2005-10-28
BR0207879A (pt) 2004-03-02

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Legal Events

Date Code Title Description
REFS Decisions on refusal to grant patents (taken after the publication of the particulars of the applications)