Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
  • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B3/00—Simple or compound lenses
  • G02B3/0006—Arrays
  • G02B3/0037—Arrays characterized by the distribution or form of lenses
  • G02B3/005—Arrays characterized by the distribution or form of lenses arranged along a single direction only, e.g. lenticular sheets
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
  • B41F—PRINTING MACHINES OR PRESSES
  • B41F23/00—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
  • B41F23/04—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing by heat drying, by cooling, by applying powders
  • B41F23/0403—Drying webs
  • B41F23/0406—Drying webs by radiation
  • B41F23/0409—Ultra-violet dryers
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
  • F21V13/02—Combinations of only two kinds of elements
  • F21V13/04—Combinations of only two kinds of elements the elements being reflectors and refractors
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V5/00—Refractors for light sources
  • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V5/00—Refractors for light sources
  • F21V5/04—Refractors for light sources of lens shape
  • F21V5/043—Refractors for light sources of lens shape the lens having cylindrical faces, e.g. rod lenses, toric lenses
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B3/00—Simple or compound lenses
  • G02B3/02—Simple or compound lenses with non-spherical faces
  • G02B3/06—Simple or compound lenses with non-spherical faces with cylindrical or toric faces
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
  • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
  • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
  • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
  • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/58—Optical field-shaping elements

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Family Applications Before (1)

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• 2012
  • 2012-05-02 DE DE201210008638 patent/DE102012008638A1/de not_active Ceased
• 2013
  • 2013-03-21 ES ES13715889.5T patent/ES2687696T3/es active Active
  • 2013-03-21 CN CN201380022921.1A patent/CN104396012B/zh active Active
  • 2013-03-21 BR BR112014027362A patent/BR112014027362A2/pt not_active Application Discontinuation
  • 2013-03-21 EP EP13715889.5A patent/EP2845225B1/de active Active
  • 2013-03-21 JP JP2015509318A patent/JP5855314B2/ja active Active
  • 2013-03-21 PL PL13715889T patent/PL2845225T3/pl unknown
  • 2013-03-21 CN CN201811582077.9A patent/CN109973840B/zh active Active
  • 2013-03-21 KR KR1020147030238A patent/KR101660621B1/ko active IP Right Grant
  • 2013-03-21 CA CA2872076A patent/CA2872076C/en not_active Expired - Fee Related
  • 2013-03-21 WO PCT/EP2013/000861 patent/WO2013164053A1/de active Application Filing
  • 2013-03-21 EP EP18178573.4A patent/EP3396713B1/de active Active
  • 2013-03-21 US US14/397,650 patent/US9695992B2/en active Active
  • 2013-03-21 DE DE202013012725.2U patent/DE202013012725U1/de not_active Expired - Lifetime
  • 2013-03-21 PL PL18178573T patent/PL3396713T3/pl unknown
  • 2013-04-18 TW TW102113843A patent/TWI495826B/zh not_active IP Right Cessation
• 2015
  • 2015-05-18 HK HK15104671.1A patent/HK1204147A1/xx not_active IP Right Cessation

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