PL3374173T3 - Modyfikacja strukturalna kartonu wywołana laserem - Google Patents

Modyfikacja strukturalna kartonu wywołana laserem

Info

Publication number
PL3374173T3
PL3374173T3 PL16795234T PL16795234T PL3374173T3 PL 3374173 T3 PL3374173 T3 PL 3374173T3 PL 16795234 T PL16795234 T PL 16795234T PL 16795234 T PL16795234 T PL 16795234T PL 3374173 T3 PL3374173 T3 PL 3374173T3
Authority
PL
Poland
Prior art keywords
paperboards
laser induced
structural modification
induced structural
modification
Prior art date
Application number
PL16795234T
Other languages
English (en)
Inventor
Sébastien EQUIS
Patrik Hoffmann
Gilles PILLONEL
Sébastien VAUCHER
Kilian WASMER
Original Assignee
Bobst Mex Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bobst Mex Sa filed Critical Bobst Mex Sa
Publication of PL3374173T3 publication Critical patent/PL3374173T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B50/00—Making rigid or semi-rigid containers, e.g. boxes or cartons
    • B31B50/25—Surface scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B50/00—Making rigid or semi-rigid containers, e.g. boxes or cartons
    • B31B50/74—Auxiliary operations
    • B31B50/741—Moistening; Drying; Cooling; Heating; Sterilizing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31F—MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31F1/00—Mechanical deformation without removing material, e.g. in combination with laminating
    • B31F1/08—Creasing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/40—Paper
PL16795234T 2015-11-11 2016-11-10 Modyfikacja strukturalna kartonu wywołana laserem PL3374173T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15020225 2015-11-11
EP16795234.0A EP3374173B1 (en) 2015-11-11 2016-11-10 Laser induced structural modification of paperboards
PCT/EP2016/025141 WO2017080677A1 (en) 2015-11-11 2016-11-10 Laser induced structural modification of paperboards

Publications (1)

Publication Number Publication Date
PL3374173T3 true PL3374173T3 (pl) 2020-11-30

Family

ID=54544874

Family Applications (1)

Application Number Title Priority Date Filing Date
PL16795234T PL3374173T3 (pl) 2015-11-11 2016-11-10 Modyfikacja strukturalna kartonu wywołana laserem

Country Status (6)

Country Link
US (1) US20180318958A1 (pl)
EP (1) EP3374173B1 (pl)
CN (1) CN108349189B (pl)
ES (1) ES2820379T3 (pl)
PL (1) PL3374173T3 (pl)
WO (1) WO2017080677A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2020010479A (es) 2018-04-10 2021-01-20 Talens Systems S L U Aparato y método para procesar cartón.

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909582A (en) * 1971-07-19 1975-09-30 American Can Co Method of forming a line of weakness in a multilayer laminate
EP0357841B1 (en) * 1988-09-07 1994-03-02 Leeuwarder Papierwarenfabriek B.V. A method of providing score lines in packaging material
DE19646331C2 (de) * 1996-11-09 2000-08-10 Fraunhofer Ges Forschung Verfahren zur lokalen plastischen Verformung durch einen Laser
WO1999029496A1 (de) * 1997-12-12 1999-06-17 Karl Marbach Gmbh & Co. Verfahren zur herstellung von mit faltlinien versehenen zuschnitten
US7872211B2 (en) * 2005-06-10 2011-01-18 Igor Troitski Laser-dynamic system for using in games
US8916416B2 (en) * 2007-09-25 2014-12-23 Stats Chippac, Ltd. Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface
ES2549984T3 (es) * 2010-02-23 2015-11-03 Kraft Foods R & D, Inc. Método de envoltura y envoltorio que comprende un material flexible con líneas de pliegue formadas por láser
RU2554603C2 (ru) * 2010-09-30 2015-06-27 Уэйвлайт Гмбх Способ тестирования лазерного устройства
WO2014079478A1 (en) * 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US20160023304A1 (en) * 2014-07-28 2016-01-28 Siemens Energy, Inc. Method for forming three-dimensional anchoring structures on a surface
JP6390898B2 (ja) * 2014-08-22 2018-09-19 アイシン精機株式会社 基板の製造方法、加工対象物の切断方法、及び、レーザ加工装置
CN104439715A (zh) * 2014-11-14 2015-03-25 镭射谷科技(深圳)有限公司 透明材料的激光切割装置及其应用的激光切割工艺

Also Published As

Publication number Publication date
EP3374173B1 (en) 2020-08-19
ES2820379T3 (es) 2021-04-20
CN108349189A (zh) 2018-07-31
CN108349189B (zh) 2020-01-03
WO2017080677A1 (en) 2017-05-18
EP3374173A1 (en) 2018-09-19
US20180318958A1 (en) 2018-11-08

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