PL3321980T3 - System urządzeń wykorzystujący odkształcalny fotokonwerter z organicznej żywicy silikonowej do pakowania wiązanego LED - Google Patents
System urządzeń wykorzystujący odkształcalny fotokonwerter z organicznej żywicy silikonowej do pakowania wiązanego LEDInfo
- Publication number
- PL3321980T3 PL3321980T3 PL15901622T PL15901622T PL3321980T3 PL 3321980 T3 PL3321980 T3 PL 3321980T3 PL 15901622 T PL15901622 T PL 15901622T PL 15901622 T PL15901622 T PL 15901622T PL 3321980 T3 PL3321980 T3 PL 3321980T3
- Authority
- PL
- Poland
- Prior art keywords
- package
- bond
- led
- silicone resin
- equipment system
- Prior art date
Links
- 229920002050 silicone resin Polymers 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
- H01L2224/95115—Supplying the plurality of semiconductor or solid-state bodies using a roll-to-roll transfer technique
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1811—Structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510509528.6A CN106469768B (zh) | 2015-08-18 | 2015-08-18 | 一种异形有机硅树脂光转换体贴合封装led的装备系统 |
EP15901622.9A EP3321980B1 (en) | 2015-08-18 | 2015-12-16 | Equipment system using deformable organic silicone resin photoconverter to bond-package an led |
PCT/CN2015/097634 WO2017028420A1 (zh) | 2015-08-18 | 2015-12-16 | 一种异形有机硅树脂光转换体贴合封装led的装备系统 |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3321980T3 true PL3321980T3 (pl) | 2020-03-31 |
Family
ID=58051673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL15901622T PL3321980T3 (pl) | 2015-08-18 | 2015-12-16 | System urządzeń wykorzystujący odkształcalny fotokonwerter z organicznej żywicy silikonowej do pakowania wiązanego LED |
Country Status (7)
Country | Link |
---|---|
US (1) | US10103294B2 (pl) |
EP (1) | EP3321980B1 (pl) |
JP (1) | JP6630372B2 (pl) |
KR (1) | KR101989043B1 (pl) |
CN (1) | CN106469768B (pl) |
PL (1) | PL3321980T3 (pl) |
WO (1) | WO2017028420A1 (pl) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106469768B (zh) | 2015-08-18 | 2018-02-02 | 江苏诚睿达光电有限公司 | 一种异形有机硅树脂光转换体贴合封装led的装备系统 |
CN109236820B (zh) * | 2018-09-19 | 2023-11-28 | 苏州富强科技有限公司 | 用于对l形零件进行保压的机构 |
CN112309948A (zh) * | 2019-08-01 | 2021-02-02 | 陕西坤同半导体科技有限公司 | 一种芯片转移装置及芯片转移方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3698749B2 (ja) * | 1995-01-11 | 2005-09-21 | 株式会社半導体エネルギー研究所 | 液晶セルの作製方法およびその作製装置、液晶セルの生産システム |
US7259030B2 (en) * | 2004-03-29 | 2007-08-21 | Articulated Technologies, Llc | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
CN101789378B (zh) * | 2004-06-02 | 2012-07-04 | 株式会社半导体能源研究所 | 用于制造半导体器件的方法 |
US7591863B2 (en) * | 2004-07-16 | 2009-09-22 | Semiconductor Energy Laboratory Co., Ltd. | Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip |
JP4749062B2 (ja) * | 2004-07-16 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 薄膜集積回路を封止する装置及びicチップの作製方法 |
US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
JP5327042B2 (ja) * | 2009-03-26 | 2013-10-30 | 豊田合成株式会社 | Ledランプの製造方法 |
WO2011105185A1 (ja) * | 2010-02-26 | 2011-09-01 | コニカミノルタオプト株式会社 | 光学半導体素子モジュールの製造方法 |
TW201216526A (en) * | 2010-08-20 | 2012-04-16 | Koninkl Philips Electronics Nv | Lamination process for LEDs |
JP2012142364A (ja) * | 2010-12-28 | 2012-07-26 | Nitto Denko Corp | 封止部材、封止方法、および、光半導体装置の製造方法 |
CN102163657B (zh) * | 2010-12-31 | 2013-05-15 | 东莞市万丰纳米材料有限公司 | 一种led芯片图形衬底的制备方法 |
KR20120109737A (ko) * | 2011-03-25 | 2012-10-09 | 삼성전자주식회사 | 발광 소자 패키지 및 그 제조 방법 |
KR101769356B1 (ko) * | 2011-03-25 | 2017-08-18 | 삼성전자주식회사 | 발광소자에 형광체층을 형성하는 방법 및 장치 |
WO2013085731A2 (en) * | 2011-12-06 | 2013-06-13 | Cooledge Lighting, Inc. | Formation of uniform phosphor regions for broad-area lighting systems |
KR20160150657A (ko) * | 2012-04-12 | 2016-12-30 | 생-고뱅 퍼포먼스 플라스틱스 코포레이션 | 발광장치 제조방법 |
US20150171287A1 (en) * | 2012-06-28 | 2015-06-18 | Toray Industrieis, Inc. | Resin sheet laminate and process for producing semiconductor light-emitting element using same |
JP6066054B2 (ja) * | 2012-12-06 | 2017-01-25 | Aiメカテック株式会社 | 有機el封止装置、封止ロールフィルム製作装置及び有機el封止システム |
US20160185074A1 (en) | 2013-08-12 | 2016-06-30 | Seiji Kagawa | Heat-dissipating film, and its production method and apparatus |
JP2015082580A (ja) * | 2013-10-23 | 2015-04-27 | 日東電工株式会社 | 半導体装置およびその製造方法 |
JP6275471B2 (ja) | 2013-12-17 | 2018-02-07 | 日本山村硝子株式会社 | 固体発光装置および蛍光体分散有機−無機ハイブリッドプレポリマー組成物 |
CN106469768B (zh) | 2015-08-18 | 2018-02-02 | 江苏诚睿达光电有限公司 | 一种异形有机硅树脂光转换体贴合封装led的装备系统 |
-
2015
- 2015-08-18 CN CN201510509528.6A patent/CN106469768B/zh active Active
- 2015-12-16 KR KR1020187002435A patent/KR101989043B1/ko active IP Right Grant
- 2015-12-16 US US15/749,859 patent/US10103294B2/en active Active
- 2015-12-16 JP JP2017567794A patent/JP6630372B2/ja active Active
- 2015-12-16 PL PL15901622T patent/PL3321980T3/pl unknown
- 2015-12-16 EP EP15901622.9A patent/EP3321980B1/en active Active
- 2015-12-16 WO PCT/CN2015/097634 patent/WO2017028420A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2017028420A1 (zh) | 2017-02-23 |
KR20180022861A (ko) | 2018-03-06 |
US10103294B2 (en) | 2018-10-16 |
EP3321980A4 (en) | 2018-05-16 |
US20180233636A1 (en) | 2018-08-16 |
CN106469768A (zh) | 2017-03-01 |
CN106469768B (zh) | 2018-02-02 |
JP6630372B2 (ja) | 2020-01-15 |
EP3321980B1 (en) | 2019-07-31 |
EP3321980A1 (en) | 2018-05-16 |
JP2018530901A (ja) | 2018-10-18 |
KR101989043B1 (ko) | 2019-06-13 |
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