PL3278274T3 - Podwójny moduł dla podwójnej karty mikroukładu - Google Patents
Podwójny moduł dla podwójnej karty mikroukładuInfo
- Publication number
- PL3278274T3 PL3278274T3 PL16729298T PL16729298T PL3278274T3 PL 3278274 T3 PL3278274 T3 PL 3278274T3 PL 16729298 T PL16729298 T PL 16729298T PL 16729298 T PL16729298 T PL 16729298T PL 3278274 T3 PL3278274 T3 PL 3278274T3
- Authority
- PL
- Poland
- Prior art keywords
- dual
- chip card
- module
- dual chip
- dual module
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1552865A FR3034552B1 (fr) | 2015-04-02 | 2015-04-02 | Module dual pour carte duale a microcircuit |
PCT/FR2016/050744 WO2016156755A2 (fr) | 2015-04-02 | 2016-04-01 | Module dual pour carte duale à microcircuit |
EP16729298.6A EP3278274B1 (fr) | 2015-04-02 | 2016-04-01 | Module dual pour carte duale à microcircuit |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3278274T3 true PL3278274T3 (pl) | 2019-11-29 |
Family
ID=53274673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL16729298T PL3278274T3 (pl) | 2015-04-02 | 2016-04-01 | Podwójny moduł dla podwójnej karty mikroukładu |
Country Status (6)
Country | Link |
---|---|
US (1) | US10147670B2 (pl) |
EP (1) | EP3278274B1 (pl) |
ES (1) | ES2738988T3 (pl) |
FR (1) | FR3034552B1 (pl) |
PL (1) | PL3278274T3 (pl) |
WO (1) | WO2016156755A2 (pl) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
US12033017B2 (en) * | 2021-11-30 | 2024-07-09 | Capital One Services, Llc | Transaction card including removable chip |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19639025C2 (de) * | 1996-09-23 | 1999-10-28 | Siemens Ag | Chipmodul und Verfahren zur Herstellung eines Chipmoduls |
FR2769390B1 (fr) | 1997-10-08 | 2003-02-14 | Gemplus Card Int | Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact |
FR2794264B1 (fr) * | 1999-05-27 | 2001-11-02 | Gemplus Card Int | Adaptateur pour dispositif electronique portable a circuit integre, de type carte a puce, d'un format reduit par rapport au format standard d'une mini-carte |
FR2833736B1 (fr) * | 2001-12-18 | 2004-05-14 | Gemplus Card Int | Carte du type carte a puce |
FR2861201B1 (fr) | 2003-10-17 | 2006-01-27 | Oberthur Card Syst Sa | Procede de fabrication d'une carte a double interface, et carte a microcircuit ainsi obtenue. |
JP2005322109A (ja) * | 2004-05-11 | 2005-11-17 | Renesas Technology Corp | Icカードモジュール |
DE102013002536A1 (de) * | 2013-02-14 | 2014-08-14 | Colorplast Ag | Verfahren zur Herstellung einer Papierträgerkarte mit heraustrennbarer integrierter Chipmodulkarte und Papierträgerkarte aus Papier mit heraustrennbarer integrierter Chipmodulkarte |
FR3021145B1 (fr) * | 2014-05-14 | 2018-08-31 | Linxens Holding | Procede de fabrication d'un circuit pour module de carte a puce et circuit pour module de carte a puce |
-
2015
- 2015-04-02 FR FR1552865A patent/FR3034552B1/fr not_active Expired - Fee Related
-
2016
- 2016-04-01 PL PL16729298T patent/PL3278274T3/pl unknown
- 2016-04-01 ES ES16729298T patent/ES2738988T3/es active Active
- 2016-04-01 EP EP16729298.6A patent/EP3278274B1/fr active Active
- 2016-04-01 US US15/562,239 patent/US10147670B2/en active Active
- 2016-04-01 WO PCT/FR2016/050744 patent/WO2016156755A2/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2016156755A2 (fr) | 2016-10-06 |
FR3034552A1 (fr) | 2016-10-07 |
EP3278274B1 (fr) | 2019-06-05 |
WO2016156755A3 (fr) | 2016-11-24 |
ES2738988T3 (es) | 2020-01-28 |
US20180108595A1 (en) | 2018-04-19 |
EP3278274A2 (fr) | 2018-02-07 |
US10147670B2 (en) | 2018-12-04 |
FR3034552B1 (fr) | 2017-05-05 |
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