PL3216329T3 - Sposób wytwarzania układu z elementem obudowy i co najmniej dwiema ścieżkami przewodzącymi - Google Patents

Sposób wytwarzania układu z elementem obudowy i co najmniej dwiema ścieżkami przewodzącymi

Info

Publication number
PL3216329T3
PL3216329T3 PL15787982T PL15787982T PL3216329T3 PL 3216329 T3 PL3216329 T3 PL 3216329T3 PL 15787982 T PL15787982 T PL 15787982T PL 15787982 T PL15787982 T PL 15787982T PL 3216329 T3 PL3216329 T3 PL 3216329T3
Authority
PL
Poland
Prior art keywords
arrangement
manufacturing
housing part
conductor paths
paths
Prior art date
Application number
PL15787982T
Other languages
English (en)
Inventor
Bernd VAN EICKELS
Peer NIEKAMP
Original Assignee
Mahle International Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mahle International Gmbh filed Critical Mahle International Gmbh
Publication of PL3216329T3 publication Critical patent/PL3216329T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14549—Coating rod-like, wire-like or belt-like articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C45/14221—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure by tools, e.g. cutting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
PL15787982T 2014-11-05 2015-10-28 Sposób wytwarzania układu z elementem obudowy i co najmniej dwiema ścieżkami przewodzącymi PL3216329T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014222597.3A DE102014222597A1 (de) 2014-11-05 2014-11-05 Verfahren zum Herstellen einer Anordnung mit einem Gehäuseteil und wenigstens zwei Leiterbahnen
PCT/EP2015/075013 WO2016071181A1 (de) 2014-11-05 2015-10-28 Verfahren zum herstellen einer anordnung mit einem gehäuseteil und wenigstens zwei leiterbahnen
EP15787982.6A EP3216329B1 (de) 2014-11-05 2015-10-28 Verfahren zum herstellen einer anordnung mit einem gehäuseteil und wenigstens zwei leiterbahnen

Publications (1)

Publication Number Publication Date
PL3216329T3 true PL3216329T3 (pl) 2018-11-30

Family

ID=54365235

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15787982T PL3216329T3 (pl) 2014-11-05 2015-10-28 Sposób wytwarzania układu z elementem obudowy i co najmniej dwiema ścieżkami przewodzącymi

Country Status (6)

Country Link
US (1) US10421225B2 (pl)
EP (1) EP3216329B1 (pl)
CN (1) CN107107414B (pl)
DE (1) DE102014222597A1 (pl)
PL (1) PL3216329T3 (pl)
WO (1) WO2016071181A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3544121B1 (en) * 2018-03-19 2022-05-04 Mahle International GmbH Electrical heating device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5067905A (en) * 1989-06-09 1991-11-26 Yazaki Corporation Electric connection box
DE4323827C1 (de) 1993-07-15 1994-12-08 Siemens Ag Steckbare Baugruppe
DE4432191C1 (de) * 1994-09-09 1996-01-18 Siemens Ag Verfahren zum Anschweißen von Bauteilanschlüssen an die Kontakte einer Leiterplatte und unter Anwendung dieses Verfahrens hergestellte Baugruppe
DE19713008C1 (de) * 1997-03-27 1998-06-04 Neumann Henneberg Wolf Zentralelektrik für ein Kraftfahrzeug und Verfahren zu ihrer Herstellung
JP4097392B2 (ja) * 2000-08-09 2008-06-11 住友電装株式会社 ジャンクションボックスおよびジャンクションボックスの組立方法
JP2002095134A (ja) 2000-09-08 2002-03-29 Sumitomo Wiring Syst Ltd バスバー回路および該バスバー回路を備えたジャンクションボックス
DE10154234A1 (de) * 2001-11-07 2003-05-22 Kostal Leopold Gmbh & Co Kg Anordnung bestehend aus einem paneelartig aufgebauten Modul und aus einer Anschlußeinheit, Anschlußeinheit für eine solche Anordnung, Verfahren zum Erstellen einer solchen Anordnung sowie Vorrichtung zum Herstellen einer solchen Anordnung
AT503029B1 (de) * 2006-03-03 2007-07-15 Pollmann Austria Ohg Fixierelement für elektrische leiter, leiterstruktur-bauteil und verfahren zu dessen herstellung
JP4939899B2 (ja) * 2006-10-30 2012-05-30 オムロンオートモーティブエレクトロニクス株式会社 導電端子の溶接方法、および導電端子構造
JP2011062723A (ja) * 2009-09-17 2011-03-31 Hitachi Automotive Systems Ltd 制御装置の端子と回路導体の溶接方法
JP5255577B2 (ja) * 2010-01-13 2013-08-07 古河電気工業株式会社 基板および基板の製造方法

Also Published As

Publication number Publication date
WO2016071181A1 (de) 2016-05-12
CN107107414B (zh) 2018-06-26
US20170312957A1 (en) 2017-11-02
CN107107414A (zh) 2017-08-29
US10421225B2 (en) 2019-09-24
DE102014222597A1 (de) 2016-05-12
EP3216329A1 (de) 2017-09-13
EP3216329B1 (de) 2018-07-11

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