PL2869963T3 - Urządzenie i sposób obróbki laserowej podłoży o dużej powierzchni z wykorzystaniem co najmniej dwóch mostków - Google Patents

Urządzenie i sposób obróbki laserowej podłoży o dużej powierzchni z wykorzystaniem co najmniej dwóch mostków

Info

Publication number
PL2869963T3
PL2869963T3 PL13723777T PL13723777T PL2869963T3 PL 2869963 T3 PL2869963 T3 PL 2869963T3 PL 13723777 T PL13723777 T PL 13723777T PL 13723777 T PL13723777 T PL 13723777T PL 2869963 T3 PL2869963 T3 PL 2869963T3
Authority
PL
Poland
Prior art keywords
portals
laser processing
scale substrates
substrates
scale
Prior art date
Application number
PL13723777T
Other languages
English (en)
Inventor
Li-Ya Yeh
Original Assignee
Saint-Gobain Glass France
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint-Gobain Glass France filed Critical Saint-Gobain Glass France
Publication of PL2869963T3 publication Critical patent/PL2869963T3/pl

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/02Carriages for supporting the welding or cutting element
    • B23K37/0211Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • B23K37/0235Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • B23K26/0738Shaping the laser spot into a linear shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58After-treatment
    • C23C14/5806Thermal treatment
    • C23C14/5813Thermal treatment using lasers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices
PL13723777T 2012-07-04 2013-05-17 Urządzenie i sposób obróbki laserowej podłoży o dużej powierzchni z wykorzystaniem co najmniej dwóch mostków PL2869963T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP12174902 2012-07-04
EP13723777.2A EP2869963B1 (de) 2012-07-04 2013-05-17 Vorrichtung und verfahren zur laserbearbeitung grossflächiger substrate unter verwendung von mindestens zwei brücken

Publications (1)

Publication Number Publication Date
PL2869963T3 true PL2869963T3 (pl) 2017-05-31

Family

ID=48468305

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13723777T PL2869963T3 (pl) 2012-07-04 2013-05-17 Urządzenie i sposób obróbki laserowej podłoży o dużej powierzchni z wykorzystaniem co najmniej dwóch mostków

Country Status (9)

Country Link
US (1) US9656346B2 (pl)
EP (1) EP2869963B1 (pl)
JP (1) JP6058131B2 (pl)
KR (2) KR101851111B1 (pl)
CN (1) CN104395033B (pl)
ES (1) ES2609481T3 (pl)
PL (1) PL2869963T3 (pl)
PT (1) PT2869963T (pl)
WO (1) WO2014005755A1 (pl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015036426A1 (en) * 2013-09-10 2015-03-19 Saint-Gobain Glass France Laser process for the implementation of metallic nanoparticles into the surface of large size glass substrates
FR3026404B1 (fr) * 2014-09-30 2016-11-25 Saint Gobain Substrat muni d'un empilement a proprietes thermiques et a couche intermediaire sous stoechiometrique
KR102110016B1 (ko) * 2017-09-26 2020-05-12 주식회사 포스코아이씨티 산세공정용 레이저 시스템 및 이를 이용한 산세공정 수행 방법
US10822270B2 (en) 2018-08-01 2020-11-03 Guardian Glass, LLC Coated article including ultra-fast laser treated silver-inclusive layer in low-emissivity thin film coating, and/or method of making the same
FR3105045B1 (fr) * 2019-12-20 2022-08-12 Saint Gobain Gravure de substrat revetu
FR3105044B1 (fr) * 2019-12-20 2022-08-12 Saint Gobain Dispositif de traitement d’un substrat

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1163485B (it) 1982-07-06 1987-04-08 Hauni Werke Koerber & Co Kg Dispositivo per perforare articoli dell'industria di lavorazione del tabacco
JPH03138092A (ja) * 1989-10-24 1991-06-12 Toshiba Corp レーザ加工機
US4987286A (en) * 1989-10-30 1991-01-22 University Of Iowa Research Foundation Method and apparatus for removing minute particles from a surface
JPH06124913A (ja) 1992-06-26 1994-05-06 Semiconductor Energy Lab Co Ltd レーザー処理方法
DE4314601C2 (de) * 1993-05-04 1996-08-08 Fraunhofer Ges Forschung Vorrichtung und Verfahren zum mit fokussiertem Licht erfolgenden Behandeln von kornorientierten Werkstücken
DE19620391C2 (de) * 1996-05-21 2001-12-13 Carl Ingolf Lange Bearbeitungsvorrichtung für flache Gegenstände
US6231999B1 (en) 1996-06-21 2001-05-15 Cardinal Ig Company Heat temperable transparent coated glass article
JP3343492B2 (ja) * 1997-04-02 2002-11-11 シャープ株式会社 薄膜半導体装置の製造方法
WO1999020428A1 (de) * 1997-10-22 1999-04-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und vorrichtung zum bearbeiten von werkstücken mit laserstrahlung
DE19927683C1 (de) 1999-06-17 2001-01-25 Sekurit Saint Gobain Deutsch Sonnen- und Wärmestrahlen reflektierende Verbundglasscheibe
FR2799005B1 (fr) 1999-09-23 2003-01-17 Saint Gobain Vitrage Vitrage muni d'un empilement de couches minces agissant sur le rayonnement solaire
KR100473245B1 (ko) * 2000-10-06 2005-03-10 미쓰비시덴키 가부시키가이샤 다결정 실리콘막의 제조 방법, 제조 장치 및 반도체장치의 제조 방법
US6396616B1 (en) * 2000-10-10 2002-05-28 3M Innovative Properties Company Direct laser imaging system
US6955956B2 (en) * 2000-12-26 2005-10-18 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
US7005601B2 (en) * 2002-04-18 2006-02-28 Applied Materials, Inc. Thermal flux processing by scanning
US7259082B2 (en) 2002-10-03 2007-08-21 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
JP4498716B2 (ja) 2002-10-03 2010-07-07 株式会社半導体エネルギー研究所 レーザ照射装置及び前記レーザ照射装置を用いた半導体装置の作製方法
US7304005B2 (en) * 2003-03-17 2007-12-04 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, laser irradiation method, and method for manufacturing a semiconductor device
JP2005129769A (ja) 2003-10-24 2005-05-19 Hitachi Ltd 半導体薄膜の改質方法、改質した半導体薄膜とその評価方法、およびこの半導体薄膜で形成した薄膜トランジスタ、並びにこの薄膜トランジスタを用いて構成した回路を有する画像表示装置
KR100514996B1 (ko) * 2004-04-19 2005-09-15 주식회사 이오테크닉스 레이저 가공 장치
KR101123753B1 (ko) * 2005-03-29 2012-03-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 레이저 조사 장치 및 반도체 장치의 제조 방법
DE102005039707B4 (de) 2005-08-23 2009-12-03 Saint-Gobain Glass Deutschland Gmbh Thermisch hoch belastbares Low-E-Schichtsystem für transparente Substrate, insbesondere für Glasscheiben
KR101371265B1 (ko) * 2005-12-16 2014-03-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 레이저 조사 장치, 레이저 조사 방법, 및 반도체 장치 제조방법
FR2898123B1 (fr) 2006-03-06 2008-12-05 Saint Gobain Substrat muni d'un empilement a proprietes thermiques
KR100754146B1 (ko) 2006-03-08 2007-08-31 삼성에스디아이 주식회사 레이저 조사장치
FR2911130B1 (fr) 2007-01-05 2009-11-27 Saint Gobain Procede de depot de couche mince et produit obtenu
WO2009105608A1 (en) * 2008-02-20 2009-08-27 Automatic Feed Company Progressive laser blanking device for high speed cutting
WO2010059595A2 (en) * 2008-11-19 2010-05-27 Applied Materials, Inc. Laser-scribing tool architecture
DE102009006062A1 (de) 2009-01-24 2010-07-29 Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg Infrarotstrahlung abschirmendes, für sichtbares Licht transparentes Laminat mit einem für Infrarotstrahlung durchlässigen optischen Fenster, Verfahren zu seiner Herstellung und seiner Verwendung
JP5230495B2 (ja) * 2009-03-17 2013-07-10 三菱電機株式会社 レーザ加工装置
EP2408586A1 (en) * 2009-03-17 2012-01-25 Wuxi Suntech Power Co., Ltd. Irradiating a plate using multiple co-located radiation sources
TW201103681A (en) * 2009-06-12 2011-02-01 Applied Materials Inc Methods and systems for laser-scribed line alignment
US20110139755A1 (en) * 2009-11-03 2011-06-16 Applied Materials, Inc. Multi-wavelength laser-scribing tool
US8598488B2 (en) * 2011-12-23 2013-12-03 Electro Scientific Industries, Inc. Method and apparatus for adjusting radiation spot size

Also Published As

Publication number Publication date
ES2609481T3 (es) 2017-04-20
JP2015528781A (ja) 2015-10-01
US9656346B2 (en) 2017-05-23
KR101851111B1 (ko) 2018-04-20
KR20170082646A (ko) 2017-07-14
CN104395033B (zh) 2017-06-23
EP2869963A1 (de) 2015-05-13
KR20150028339A (ko) 2015-03-13
PT2869963T (pt) 2017-01-03
EP2869963B1 (de) 2016-09-28
JP6058131B2 (ja) 2017-01-11
US20150290740A1 (en) 2015-10-15
CN104395033A (zh) 2015-03-04
WO2014005755A1 (de) 2014-01-09

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