PL2730682T3 - Alkaline, cyanide-free solution for electroplating of gold alloys, a method for electroplating and a substrate comprising a bright, corrosion-free deposit of a gold alloy - Google Patents

Alkaline, cyanide-free solution for electroplating of gold alloys, a method for electroplating and a substrate comprising a bright, corrosion-free deposit of a gold alloy

Info

Publication number
PL2730682T3
PL2730682T3 PL12192458T PL12192458T PL2730682T3 PL 2730682 T3 PL2730682 T3 PL 2730682T3 PL 12192458 T PL12192458 T PL 12192458T PL 12192458 T PL12192458 T PL 12192458T PL 2730682 T3 PL2730682 T3 PL 2730682T3
Authority
PL
Poland
Prior art keywords
electroplating
free
gold
cyanide
bright
Prior art date
Application number
PL12192458T
Other languages
Polish (pl)
Inventor
Coline Nelias
Nicolas Pommier
Jean-Jacques Duprat
Original Assignee
Coventya Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coventya Sas filed Critical Coventya Sas
Publication of PL2730682T3 publication Critical patent/PL2730682T3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PL12192458T 2012-11-13 2012-11-13 Alkaline, cyanide-free solution for electroplating of gold alloys, a method for electroplating and a substrate comprising a bright, corrosion-free deposit of a gold alloy PL2730682T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12192458.3A EP2730682B1 (en) 2012-11-13 2012-11-13 Alkaline, cyanide-free solution for electroplating of gold alloys, a method for electroplating and a substrate comprising a bright, corrosion-free deposit of a gold alloy

Publications (1)

Publication Number Publication Date
PL2730682T3 true PL2730682T3 (en) 2018-12-31

Family

ID=47189760

Family Applications (1)

Application Number Title Priority Date Filing Date
PL12192458T PL2730682T3 (en) 2012-11-13 2012-11-13 Alkaline, cyanide-free solution for electroplating of gold alloys, a method for electroplating and a substrate comprising a bright, corrosion-free deposit of a gold alloy

Country Status (5)

Country Link
EP (1) EP2730682B1 (en)
ES (1) ES2685317T3 (en)
PL (1) PL2730682T3 (en)
PT (1) PT2730682T (en)
TR (1) TR201811860T4 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105132973A (en) * 2015-09-22 2015-12-09 太原工业学院 Environment-friendly type non-cyanide electroplating copper-zinc alloy solution and electroplating copper-zinc alloy process thereof
CN110699721B (en) * 2019-11-20 2021-08-20 长春黄金研究院有限公司 Cyanide-free gold-copper alloy electroplating solution and application thereof
CN110699713A (en) * 2019-11-21 2020-01-17 长春黄金研究院有限公司 Cyanide-free gold alloy electroforming solution and using method thereof
CN114075680A (en) * 2020-08-21 2022-02-22 江苏澳光电子有限公司 Corrosion-resistant water-seal electroplating solution

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5340529A (en) * 1993-07-01 1994-08-23 Dewitt Troy C Gold jewelry alloy
US5750018A (en) * 1997-03-18 1998-05-12 Learonal, Inc. Cyanide-free monovalent copper electroplating solutions
US6511589B1 (en) * 2001-08-17 2003-01-28 Electroplating Engineers Of Japan Limited Gold plating solution and gold plating method using thereof
JP2003183258A (en) * 2001-12-19 2003-07-03 Tanaka Kikinzoku Kogyo Kk Gold complex
JP2005256072A (en) 2004-03-11 2005-09-22 Tanaka Kikinzoku Kogyo Kk Gold complex
SG127854A1 (en) * 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes

Also Published As

Publication number Publication date
TR201811860T4 (en) 2018-09-21
ES2685317T3 (en) 2018-10-08
EP2730682B1 (en) 2018-07-25
PT2730682T (en) 2018-11-09
EP2730682A1 (en) 2014-05-14

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