PL2547484T3 - Złącze kondensator – płytka drukowana dla komponentów systemu spawalniczego - Google Patents

Złącze kondensator – płytka drukowana dla komponentów systemu spawalniczego

Info

Publication number
PL2547484T3
PL2547484T3 PL11731060T PL11731060T PL2547484T3 PL 2547484 T3 PL2547484 T3 PL 2547484T3 PL 11731060 T PL11731060 T PL 11731060T PL 11731060 T PL11731060 T PL 11731060T PL 2547484 T3 PL2547484 T3 PL 2547484T3
Authority
PL
Poland
Prior art keywords
capacitor
circuit board
system components
welding system
board interface
Prior art date
Application number
PL11731060T
Other languages
English (en)
Inventor
George B Koprivnak
Robert L Dodge
Jeremie Buday
David W Perrin
Original Assignee
Lincoln Global Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lincoln Global Inc filed Critical Lincoln Global Inc
Publication of PL2547484T3 publication Critical patent/PL2547484T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/10—Other electric circuits therefor; Protective circuits; Remote controls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.
    • Y10T29/49195—Assembling elongated conductors, e.g., splicing, etc. with end-to-end orienting
    • Y10T29/49199—Assembling elongated conductors, e.g., splicing, etc. with end-to-end orienting including deforming of joining bridge

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)
  • Generation Of Surge Voltage And Current (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Arc Welding Control (AREA)
PL11731060T 2010-03-15 2011-03-15 Złącze kondensator – płytka drukowana dla komponentów systemu spawalniczego PL2547484T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/724,075 US8604355B2 (en) 2010-03-15 2010-03-15 Capacitor-circuit board interface for welding system components
EP11731060.7A EP2547484B1 (en) 2010-03-15 2011-03-15 Capacitor-circuit board interface for welding system components
PCT/IB2011/000546 WO2011114216A1 (en) 2010-03-15 2011-03-15 Capacitor-circuit board interface for welding system components

Publications (1)

Publication Number Publication Date
PL2547484T3 true PL2547484T3 (pl) 2014-04-30

Family

ID=44317731

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11731060T PL2547484T3 (pl) 2010-03-15 2011-03-15 Złącze kondensator – płytka drukowana dla komponentów systemu spawalniczego

Country Status (9)

Country Link
US (2) US8604355B2 (pl)
EP (1) EP2547484B1 (pl)
JP (1) JP5566479B2 (pl)
CN (1) CN102791416A (pl)
BR (1) BR112012019466A2 (pl)
CA (1) CA2785091A1 (pl)
MX (1) MX2012010525A (pl)
PL (1) PL2547484T3 (pl)
WO (1) WO2011114216A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8604355B2 (en) * 2010-03-15 2013-12-10 Lincoln Global, Inc. Capacitor-circuit board interface for welding system components

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200296A (en) * 1962-10-26 1965-08-10 Rca Corp Combined mounting-bracket and heat-sink
US3681664A (en) 1971-08-19 1972-08-01 Jfd Electronics Corp Trimmer capacitor for printed circuit board
US3790860A (en) 1972-07-17 1974-02-05 Trygen Electronics Inc Power supply chassis assembly for electronic circuit with cooling
JPS633129U (pl) * 1986-06-23 1988-01-11
JPH01189991A (ja) 1988-01-26 1989-07-31 Nec Corp プリント配線板への部品実装方法
JPH0340894U (pl) * 1989-08-30 1991-04-19
US5420745A (en) 1991-09-30 1995-05-30 Matsushita Electric Industrial Co., Ltd. Surface-mount type ceramic capacitor
US5214564A (en) * 1992-04-23 1993-05-25 Sunstrand Corporation Capacitor assembly with integral cooling apparatus
US5747773A (en) * 1995-12-18 1998-05-05 The Esab Group, Inc. Arc welder power source
US5760361A (en) * 1996-05-24 1998-06-02 Square D Company Multiple single phase weld control systems from a polyphase power source
DE19953594A1 (de) 1998-11-20 2000-05-25 Matsushita Electric Industrial Co Ltd Oberflächenmontierte elektronische Komponente
AU1198700A (en) * 1999-03-16 2000-10-04 Maxwell Energy Products Low inductance four terminal capacitor lead frame
US6418029B1 (en) 2000-02-28 2002-07-09 Mckee James S. Interconnect system having vertically mounted passive components on an underside of a substrate
JP3589174B2 (ja) 2000-10-24 2004-11-17 株式会社村田製作所 表面実装型正特性サーミスタおよびその実装方法
US6532157B1 (en) * 2000-11-16 2003-03-11 Amkor Technology, Inc. Angulated semiconductor packages
JP2005050962A (ja) 2003-07-31 2005-02-24 Taiyo Yuden Co Ltd コンデンサ実装構造，コンデンサ実装基板及びコンデンサ実装用配線基板
US8530789B2 (en) 2004-12-13 2013-09-10 Lincoln Global, Inc. Power module cartridge
WO2008076428A1 (en) 2006-12-19 2008-06-26 Tessera Interconnect Materials, Inc. Chip capacitor embedded pwb
US20090111294A1 (en) * 2007-10-25 2009-04-30 Gm Global Technology Operations, Inc. Bus bar to printed circuit board interface for electric and hybrid electric vehicles
US8373084B2 (en) * 2007-12-19 2013-02-12 Illinois Tool Works Inc. Plasma cutter having high power density
IL190329A (en) * 2008-03-20 2014-11-30 Celem Passive Components Ltd Get high-powered cooled by side-by-side transmission
JP4634498B2 (ja) * 2008-11-28 2011-02-16 三菱電機株式会社 電力用半導体モジュール
US8604355B2 (en) * 2010-03-15 2013-12-10 Lincoln Global, Inc. Capacitor-circuit board interface for welding system components

Also Published As

Publication number Publication date
CA2785091A1 (en) 2011-09-22
AU2011228803A1 (en) 2012-07-05
US20130185933A1 (en) 2013-07-25
WO2011114216A1 (en) 2011-09-22
US20110220400A1 (en) 2011-09-15
EP2547484A1 (en) 2013-01-23
US8898894B2 (en) 2014-12-02
MX2012010525A (es) 2012-10-15
JP2013520322A (ja) 2013-06-06
JP5566479B2 (ja) 2014-08-06
EP2547484B1 (en) 2013-08-21
CN102791416A (zh) 2012-11-21
BR112012019466A2 (pt) 2016-05-03
US8604355B2 (en) 2013-12-10

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