PL2384108T3 - Usuwające kurz urządzenie rozpraszające ciepło z dwoma wentylatorami chłodzącymi - Google Patents
Usuwające kurz urządzenie rozpraszające ciepło z dwoma wentylatorami chłodzącymiInfo
- Publication number
- PL2384108T3 PL2384108T3 PL10161155T PL10161155T PL2384108T3 PL 2384108 T3 PL2384108 T3 PL 2384108T3 PL 10161155 T PL10161155 T PL 10161155T PL 10161155 T PL10161155 T PL 10161155T PL 2384108 T3 PL2384108 T3 PL 2384108T3
- Authority
- PL
- Poland
- Prior art keywords
- dust
- dissipation device
- cooling fans
- double cooling
- disposal heat
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10161155.6A EP2384108B1 (en) | 2010-04-27 | 2010-04-27 | Dust-disposal heat-dissipation device with double cooling fans |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2384108T3 true PL2384108T3 (pl) | 2014-06-30 |
Family
ID=44303345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL10161155T PL2384108T3 (pl) | 2010-04-27 | 2010-04-27 | Usuwające kurz urządzenie rozpraszające ciepło z dwoma wentylatorami chłodzącymi |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP2384108B1 (pl) |
| PL (1) | PL2384108T3 (pl) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6701732B2 (ja) * | 2015-12-29 | 2020-05-27 | セイコーエプソン株式会社 | 光源装置、照明装置及びプロジェクター |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6101459A (en) * | 1997-08-15 | 2000-08-08 | Compaq Computer Corporation | System and associated method for cooling components within a computer system |
| US5953209A (en) * | 1997-12-15 | 1999-09-14 | Intel Corporation | Push and pull dual-fan heat sink design |
| TWM254653U (en) * | 2004-03-26 | 2005-01-01 | Chia Cherne Industry Co Ltd | Novel tilted heat sink structure of composite type |
| JP4554503B2 (ja) * | 2005-12-14 | 2010-09-29 | 富士通株式会社 | 放熱装置および電子機器 |
| US20090009960A1 (en) * | 2007-07-05 | 2009-01-08 | Melanson Ronald J | Method and apparatus for mitigating dust-fouling problems |
| CN101641003B (zh) * | 2008-07-30 | 2011-08-31 | 富准精密工业(深圳)有限公司 | 散热装置 |
| US7684187B1 (en) * | 2008-09-17 | 2010-03-23 | Celsia Technologies Taiwan, Inc. | Heat dissipation device |
-
2010
- 2010-04-27 EP EP10161155.6A patent/EP2384108B1/en active Active
- 2010-04-27 PL PL10161155T patent/PL2384108T3/pl unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP2384108B1 (en) | 2014-01-15 |
| EP2384108A3 (en) | 2011-12-14 |
| EP2384108A2 (en) | 2011-11-02 |
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