PL2426575T3 - Urządzenie rozpraszania ciepła - Google Patents

Urządzenie rozpraszania ciepła

Info

Publication number
PL2426575T3
PL2426575T3 PL11152326T PL11152326T PL2426575T3 PL 2426575 T3 PL2426575 T3 PL 2426575T3 PL 11152326 T PL11152326 T PL 11152326T PL 11152326 T PL11152326 T PL 11152326T PL 2426575 T3 PL2426575 T3 PL 2426575T3
Authority
PL
Poland
Prior art keywords
heat
dissipation device
dissipation
Prior art date
Application number
PL11152326T
Other languages
English (en)
Inventor
Shun-Shih Huang
Tai-Chuan Mao
Original Assignee
Giga Byte Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giga Byte Tech Co Ltd filed Critical Giga Byte Tech Co Ltd
Publication of PL2426575T3 publication Critical patent/PL2426575T3/pl

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PL11152326T 2010-05-28 2011-01-27 Urządzenie rozpraszania ciepła PL2426575T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW99117299 2010-05-28
EP11152326.2A EP2426575B1 (en) 2010-05-28 2011-01-27 Heat-dissipation device

Publications (1)

Publication Number Publication Date
PL2426575T3 true PL2426575T3 (pl) 2019-04-30

Family

ID=45444364

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11152326T PL2426575T3 (pl) 2010-05-28 2011-01-27 Urządzenie rozpraszania ciepła

Country Status (4)

Country Link
EP (1) EP2426575B1 (pl)
ES (1) ES2699482T3 (pl)
PL (1) PL2426575T3 (pl)
TW (1) TWI421025B (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI557326B (zh) * 2013-02-22 2016-11-11 技嘉科技股份有限公司 顯示卡模組及其風扇裝置
CN108932040B (zh) * 2017-05-26 2021-09-14 技嘉科技股份有限公司 显示卡散热模块
CN109413956A (zh) * 2018-11-29 2019-03-01 武汉精能电子技术有限公司 电子负载散热器
US11304331B1 (en) * 2020-09-30 2022-04-12 Taiwan Microloops Corp. Heat dissipating module having auxiliary fan
US20220381508A1 (en) * 2021-05-28 2022-12-01 Grad Aps Apparatus for beverage container temperature control

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US587769A (en) 1897-08-10 Electric motor
US592347A (en) 1897-10-26 Milo g
US545104A (en) 1895-08-27 Apparatus for retarding congelation of fluids
US577582A (en) 1897-02-23 mitchell
US585305A (en) 1897-06-29 Tooth-crown holder
US245506A (en) 1881-08-09 jones
US1220704A (en) 1915-06-24 1917-03-27 Robert Swimmer Sanitary curtainless soap and water spray.
US1251460A (en) 1916-03-10 1918-01-01 Scott & Williams Inc Defective-needle detector for knitting-machines.
US5997266A (en) 1999-05-26 1999-12-07 3Com Corp. Apparatus for housing fans
US6450251B1 (en) * 2000-12-28 2002-09-17 Foxconn Precision Components Co., Ltd. Heat removal system
US20020185259A1 (en) * 2001-05-15 2002-12-12 Gateway, Inc. Angle mounted fan-sink
US20040010626A1 (en) 2002-07-11 2004-01-15 Gillam Richard James System and method of processing transactions off-line
CN2672865Y (zh) * 2003-11-14 2005-01-19 鸿富锦精密工业(深圳)有限公司 散热器
US7085134B2 (en) * 2004-06-30 2006-08-01 International Business Machines Corporation Dual fan heat sink
KR101075593B1 (ko) 2004-08-27 2011-10-20 삼성전자주식회사 백라이트 어셈블리 및 이를 갖는 액정표시장치
US7535708B2 (en) 2006-09-19 2009-05-19 Intel Corporation Fan integrated thermal management device
US7443680B1 (en) * 2007-04-04 2008-10-28 Fu Zhun Precision Industry (Shen Zhen) Co., Lts. Heat dissipation apparatus for heat producing device
TWI332143B (en) * 2007-04-27 2010-10-21 Foxconn Tech Co Ltd Heat dissipation module
TWM341976U (en) * 2007-10-26 2008-10-01 Lin Ya Ling Improved holder structure for fluorescent lamp

Also Published As

Publication number Publication date
EP2426575A2 (en) 2012-03-07
TWI421025B (zh) 2013-12-21
EP2426575B1 (en) 2018-09-05
EP2426575A3 (en) 2015-03-18
ES2699482T3 (es) 2019-02-11
TW201143592A (en) 2011-12-01

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