PL2267765T3 - Urządzenie podpierające rezonator - Google Patents

Urządzenie podpierające rezonator

Info

Publication number
PL2267765T3
PL2267765T3 PL09731400T PL09731400T PL2267765T3 PL 2267765 T3 PL2267765 T3 PL 2267765T3 PL 09731400 T PL09731400 T PL 09731400T PL 09731400 T PL09731400 T PL 09731400T PL 2267765 T3 PL2267765 T3 PL 2267765T3
Authority
PL
Poland
Prior art keywords
supporting device
resonator supporting
resonator
supporting
Prior art date
Application number
PL09731400T
Other languages
English (en)
Inventor
Seiya Nakai
Original Assignee
Adwelds Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adwelds Corporation filed Critical Adwelds Corporation
Publication of PL2267765T3 publication Critical patent/PL2267765T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B3/00—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H10P72/0428—
    • H10P72/0446—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07173—
    • H10W72/07223—
    • H10W72/07233—
    • H10W72/07236—
    • H10W72/352—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
PL09731400T 2008-04-07 2009-04-06 Urządzenie podpierające rezonator PL2267765T3 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008099390 2008-04-07
JP2008220890A JP4311582B1 (ja) 2008-04-07 2008-08-29 共振器の支持装置
PCT/JP2009/057068 WO2009125748A1 (ja) 2008-04-07 2009-04-06 共振器の支持装置
EP09731400.9A EP2267765B1 (en) 2008-04-07 2009-04-06 Support device for resonator

Publications (1)

Publication Number Publication Date
PL2267765T3 true PL2267765T3 (pl) 2019-07-31

Family

ID=41036702

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09731400T PL2267765T3 (pl) 2008-04-07 2009-04-06 Urządzenie podpierające rezonator

Country Status (8)

Country Link
US (1) US8353442B2 (pl)
EP (1) EP2267765B1 (pl)
JP (1) JP4311582B1 (pl)
KR (1) KR101161724B1 (pl)
CN (1) CN101978484B (pl)
HU (1) HUE042957T2 (pl)
PL (1) PL2267765T3 (pl)
WO (1) WO2009125748A1 (pl)

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EP2327534A1 (de) * 2009-11-25 2011-06-01 Telsonic Holding AG Vorrichtung und Verfahren zum Verschweißen von Werkstücken
DE102010029395A1 (de) * 2010-05-07 2011-11-10 Telsonic Holding Ag Torsionssonotrode, Ultraschall-Schweißvorrichtung und Verfahren zur Herstellung einer Schweißverbindung mittels Ultraschall
JP5783811B2 (ja) * 2010-07-06 2015-09-24 キヤノン株式会社 成膜装置
JP5737562B2 (ja) * 2011-02-09 2015-06-17 株式会社アドウェルズ 共振器の支持装置
US8408445B1 (en) * 2011-09-30 2013-04-02 GM Global Technology Operations LLC Actively controlled vibration welding system and method
CN104303277B (zh) * 2012-12-21 2017-05-10 株式会社新川 覆晶黏晶机以及黏晶平台的平坦度与变形量补正方法
JP6063263B2 (ja) * 2013-01-15 2017-01-18 日産自動車株式会社 超音波接合装置
JP6236957B2 (ja) * 2013-07-23 2017-11-29 セイコーエプソン株式会社 電子部品搬送装置、電子部品検査装置および冷却システム
JP2015065328A (ja) * 2013-09-25 2015-04-09 東レエンジニアリング株式会社 ボンディング装置
US9136243B2 (en) 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
JP2015130414A (ja) * 2014-01-08 2015-07-16 東レエンジニアリング株式会社 自動ボンディング装置
DE102014101627A1 (de) * 2014-02-10 2015-08-13 Ms Spaichingen Gmbh Gestell für eine Maschine
US9573221B2 (en) * 2014-06-25 2017-02-21 GM Global Technology Operations LLC Elimination of tool adhesion in an ultrasonic welding process
CN107073639B (zh) * 2014-10-15 2019-08-23 远景Aesc日本有限公司 超声波接合装置和超声波接合方法
JP5950994B2 (ja) * 2014-12-26 2016-07-13 株式会社新川 実装装置
US9755105B2 (en) * 2015-01-30 2017-09-05 Nichia Corporation Method for producing light emitting device
US9929121B2 (en) * 2015-08-31 2018-03-27 Kulicke And Soffa Industries, Inc. Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
US10381321B2 (en) 2017-02-18 2019-08-13 Kulicke And Soffa Industries, Inc Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
DE102017107617A1 (de) * 2017-04-10 2018-10-11 Herrmann Ultraschalltechnik Gmbh & Co. Kg Verfahren zum intermittierenden Ultraschallbearbeiten einer Materialbahn
WO2020112635A1 (en) * 2018-11-28 2020-06-04 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems and methods of using the same
DE102018132838A1 (de) * 2018-12-19 2020-06-25 Herrmann Ultraschalltechnik Gmbh & Co. Kg Ultraschallschweißanlage mit Halterung
DE102018132837A1 (de) * 2018-12-19 2020-06-25 Herrmann Ultraschalltechnik Gmbh & Co. Kg Ultraschallschweißanlage
DE102018132839A1 (de) * 2018-12-19 2020-06-25 Herrmann Ultraschalltechnik Gmbh & Co. Kg Ultraschallschweißanlage mit Abstützelement
JP7370190B2 (ja) * 2019-08-14 2023-10-27 太陽誘電株式会社 パネル及び電子機器
CN210848776U (zh) * 2019-09-19 2020-06-26 东莞市新玛博创超声波科技有限公司 一种脉冲电流发热的超声焊接装置
KR20210101357A (ko) * 2020-02-07 2021-08-19 삼성전자주식회사 볼 배치 시스템 및 기판 상에 볼을 배치하는 방법
DE112021004721T5 (de) * 2020-09-11 2023-06-29 Alps Alpine Co., Ltd. Verbindungskonstruktion
KR20240009220A (ko) * 2022-07-13 2024-01-22 주식회사 엘지에너지솔루션 흡착 장치
US12317421B2 (en) * 2022-09-27 2025-05-27 Canon Kabushiki Kaisha Apparatus including a plurality of heads and a method of using the same

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JP2583398B2 (ja) 1994-07-06 1997-02-19 日立化成商事株式会社 超音波接合装置
JP3410628B2 (ja) * 1997-04-21 2003-05-26 日本碍子株式会社 除塵装置のフィルタエレメントの保持構造
JP3487162B2 (ja) 1998-03-17 2004-01-13 松下電器産業株式会社 ボンディングツールおよびボンディング装置
JP3215084B2 (ja) 1998-04-28 2001-10-02 株式会社アルテクス 超音波振動接合用共振器
JP4270729B2 (ja) 2000-08-29 2009-06-03 株式会社カイジョー ボンディングヘッド及びこれを備えたボンディング装置
JP2002118152A (ja) * 2000-10-06 2002-04-19 Kaijo Corp ボンディングヘッド及びこれを備えたボンディング装置
JP2002222834A (ja) 2001-01-26 2002-08-09 Arutekusu:Kk 超音波振動接合装置
JP2002343831A (ja) 2001-05-16 2002-11-29 Kaijo Corp ボンディングヘッド及びこれを備えたボンディング装置
US7926180B2 (en) * 2001-06-29 2011-04-19 Mccrink Edward J Method for manufacturing gas and liquid storage tanks
US6970327B2 (en) * 2002-10-03 2005-11-29 Seagate Technology Llc Data storage device with damped load arm formed from Mn-Cu alloy composition
JP2005138181A (ja) 2003-10-14 2005-06-02 Bondotekku:Kk 超音波振動制御方法及び装置
JP4645229B2 (ja) 2005-02-28 2011-03-09 コニカミノルタオプト株式会社 駆動装置
US7508115B2 (en) 2005-12-28 2009-03-24 Tdk Corporation Horn, horn unit, and bonding apparatus using same
JP4213711B2 (ja) 2005-12-28 2009-01-21 Ｔｄｋ株式会社 ホーン、ホーンユニット及びそれを用いたボンディング装置
US7757926B2 (en) * 2006-02-28 2010-07-20 Asm Assembly Automation Ltd Transducer assembly for a bonding apparatus
JP4762934B2 (ja) * 2007-02-28 2011-08-31 株式会社新川 ホーン取付用アーム
JP2010188489A (ja) * 2009-02-20 2010-09-02 Covalent Materials Corp 接合ウェーハの製造方法

Also Published As

Publication number Publication date
KR101161724B1 (ko) 2012-07-04
CN101978484A (zh) 2011-02-16
JP2009272599A (ja) 2009-11-19
HUE042957T2 (hu) 2019-07-29
CN101978484B (zh) 2012-07-25
US20110036897A1 (en) 2011-02-17
EP2267765A1 (en) 2010-12-29
EP2267765B1 (en) 2019-01-16
WO2009125748A1 (ja) 2009-10-15
KR20100135869A (ko) 2010-12-27
JP4311582B1 (ja) 2009-08-12
US8353442B2 (en) 2013-01-15
EP2267765A4 (en) 2016-09-14

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