PL2074560T3 - Sposób wytwarzania mozaiki transpondera do dokumentów osobistych - Google Patents
Sposób wytwarzania mozaiki transpondera do dokumentów osobistychInfo
- Publication number
- PL2074560T3 PL2074560T3 PL08785744T PL08785744T PL2074560T3 PL 2074560 T3 PL2074560 T3 PL 2074560T3 PL 08785744 T PL08785744 T PL 08785744T PL 08785744 T PL08785744 T PL 08785744T PL 2074560 T3 PL2074560 T3 PL 2074560T3
- Authority
- PL
- Poland
- Prior art keywords
- transponder
- substrate layer
- layered structure
- relates
- chip module
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
- G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Adornments (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/867,804 US20090091424A1 (en) | 2007-10-05 | 2007-10-05 | Transponder inlay for a personal document and method of manufacturing same |
| PCT/EP2008/007049 WO2009046791A1 (de) | 2007-10-05 | 2008-08-28 | Transponderinlay für ein personaldokument und verfahren zu dessen herstellung |
| EP08785744A EP2074560B1 (de) | 2007-10-05 | 2008-08-28 | Verfahren zur herstellung eines transponderinlays für ein personaldokument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2074560T3 true PL2074560T3 (pl) | 2012-03-30 |
Family
ID=40043959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL08785744T PL2074560T3 (pl) | 2007-10-05 | 2008-08-28 | Sposób wytwarzania mozaiki transpondera do dokumentów osobistych |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US20090091424A1 (pl) |
| EP (1) | EP2074560B1 (pl) |
| KR (1) | KR101035048B1 (pl) |
| AT (1) | ATE527627T1 (pl) |
| AU (1) | AU2008310104B2 (pl) |
| CA (1) | CA2669079C (pl) |
| EG (1) | EG26352A (pl) |
| ES (1) | ES2371694T3 (pl) |
| MX (1) | MX2009005695A (pl) |
| PL (1) | PL2074560T3 (pl) |
| WO (1) | WO2009046791A1 (pl) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8608080B2 (en) * | 2006-09-26 | 2013-12-17 | Feinics Amatech Teoranta | Inlays for security documents |
| WO2010132117A1 (en) * | 2009-05-13 | 2010-11-18 | American Bank Note Company | Cover and method of manufacturing the same |
| DE102009038802A1 (de) | 2009-08-25 | 2011-03-10 | Mühlbauer Ag | Wert- und Sicherheitsdokument in der Form eines Buches, Verfahren zur Herstellung eines derartigen Wert- und Sicherheitsdokumentes |
| DE102010011504A1 (de) | 2010-03-16 | 2012-06-14 | Mühlbauer Ag | Verfahren zur Herstellung einer Transponderantenne, Transponderinlay mit einer derartigen Transponderantenne |
| FR2959581B1 (fr) | 2010-04-28 | 2012-08-17 | Arjowiggins Security | Insert fibreux constitue en une seule couche et equipe d'un dispositif electronique a communication sans contact. |
| US8991712B2 (en) | 2010-08-12 | 2015-03-31 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
| US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
| US9112272B2 (en) | 2010-08-12 | 2015-08-18 | Feinics Amatech Teoranta | Antenna modules for dual interface smart cards, booster antenna configurations, and methods |
| US9033250B2 (en) | 2010-08-12 | 2015-05-19 | Féinics Amatech Teoranta | Dual interface smart cards, and methods of manufacturing |
| US9195932B2 (en) | 2010-08-12 | 2015-11-24 | Féinics Amatech Teoranta | Booster antenna configurations and methods |
| WO2012168106A1 (en) | 2011-06-04 | 2012-12-13 | Féinics Amatech Teoranta | Preparing a substrate for embedding wire |
| US8763914B2 (en) | 2012-01-17 | 2014-07-01 | On Track Innovations Ltd. | Decoupled contactless bi-directional systems and methods |
| DE102012010560B4 (de) | 2012-05-29 | 2020-07-09 | Mühlbauer Gmbh & Co. Kg | Transponder, Verfahren zur Herstellung eines Transponders und Vorrichtungzum Herstellen des Transponders |
| FR2995709A1 (fr) | 2012-09-18 | 2014-03-21 | Arjowiggins Security | Procede de fabrication d'une structure a puce electronique et structure ainsi fabriquee. |
| DE102018112476B4 (de) | 2017-06-02 | 2022-01-27 | Ulrich Lang | Verfahren und Fertigungsanlage zum Herstellen eines Foliensubstrats |
| WO2019224575A1 (en) | 2018-05-22 | 2019-11-28 | Tyco Fire & Security Gmbh | Elongate flexible tag |
| WO2019224364A1 (de) | 2018-05-24 | 2019-11-28 | Ulrich Lang | Verfahren und fertigungsanlage zum herstellen eines foliensubstrats |
| US12223814B2 (en) | 2019-09-16 | 2025-02-11 | Sensormatic Electronics, LLC | Security tag for textiles using conductive thread |
| US11443160B2 (en) | 2019-09-18 | 2022-09-13 | Sensormatic Electronics, LLC | Systems and methods for laser tuning and attaching RFID tags to products |
| US10970613B1 (en) | 2019-09-18 | 2021-04-06 | Sensormatic Electronics, LLC | Systems and methods for providing tags adapted to be incorporated with or in items |
| US11055588B2 (en) | 2019-11-27 | 2021-07-06 | Sensormatic Electronics, LLC | Flexible water-resistant sensor tag |
| US11755874B2 (en) | 2021-03-03 | 2023-09-12 | Sensormatic Electronics, LLC | Methods and systems for heat applied sensor tag |
| US11869324B2 (en) | 2021-12-23 | 2024-01-09 | Sensormatic Electronics, LLC | Securing a security tag into an article |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4483067A (en) * | 1981-09-11 | 1984-11-20 | U.S. Philips Corporation | Method of manufacturing an identification card and an identification manufactured, for example, by this method |
| EP0128822B1 (fr) * | 1983-06-09 | 1987-09-09 | Flonic S.A. | Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé |
| FR2579799B1 (fr) * | 1985-03-28 | 1990-06-22 | Flonic Sa | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
| CH672285A5 (pl) * | 1987-04-14 | 1989-11-15 | Landis & Gyr Ag | |
| DE4241482A1 (de) * | 1992-12-09 | 1994-06-16 | Siemens Ag | Verfahren und Einrichtung zur Herstellung von IC-Karten |
| DE4410732C2 (de) * | 1994-03-28 | 1997-05-07 | Amatech Gmbh & Co Kg | Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit |
| US6492717B1 (en) * | 1999-08-03 | 2002-12-10 | Motorola, Inc. | Smart card module and method of assembling the same |
| DE10328776B3 (de) * | 2003-06-25 | 2005-01-27 | Groz-Beckert Kg | Stanzvorrichtung für flächige Gegenstände |
| DE102004004469A1 (de) * | 2003-12-22 | 2005-08-18 | Smartrac Technology Ltd. | Verfahren zur Herstellung eines Sicherheitslagenaufbaus sowie Sicherheitslagenaufbau und einen solchen enthaltende Identifikationsdokumente |
| US7612677B2 (en) * | 2005-01-28 | 2009-11-03 | Smartrac Ip B.V. | Method for producing a security layered construction and security layered construction and identification documents containing such a construction |
| FR2881252A1 (fr) * | 2005-01-24 | 2006-07-28 | Ask Sa | Dispositif d'idenfication radiofrequence resistant aux milieux et son procede de fabrication |
| US8067253B2 (en) * | 2005-12-21 | 2011-11-29 | Avery Dennison Corporation | Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film |
| US20080186186A1 (en) * | 2007-02-06 | 2008-08-07 | Opsec Security Group, Inc. | Apparatus and method for selectively permitting and resisting reading of radio frequency chips |
-
2007
- 2007-10-05 US US11/867,804 patent/US20090091424A1/en not_active Abandoned
- 2007-11-21 KR KR1020070119104A patent/KR101035048B1/ko not_active Expired - Fee Related
-
2008
- 2008-08-28 AU AU2008310104A patent/AU2008310104B2/en not_active Ceased
- 2008-08-28 AT AT08785744T patent/ATE527627T1/de active
- 2008-08-28 ES ES08785744T patent/ES2371694T3/es active Active
- 2008-08-28 EP EP08785744A patent/EP2074560B1/de not_active Not-in-force
- 2008-08-28 PL PL08785744T patent/PL2074560T3/pl unknown
- 2008-08-28 MX MX2009005695A patent/MX2009005695A/es active IP Right Grant
- 2008-08-28 WO PCT/EP2008/007049 patent/WO2009046791A1/de not_active Ceased
- 2008-08-28 CA CA2669079A patent/CA2669079C/en active Active
-
2009
- 2009-06-22 EG EG2009060958A patent/EG26352A/en active
-
2011
- 2011-03-09 US US13/043,718 patent/US8188867B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2074560A1 (de) | 2009-07-01 |
| KR101035048B1 (ko) | 2011-05-19 |
| AU2008310104B2 (en) | 2012-09-20 |
| CA2669079C (en) | 2012-05-01 |
| WO2009046791A1 (de) | 2009-04-16 |
| EP2074560B1 (de) | 2011-10-05 |
| AU2008310104A1 (en) | 2009-04-16 |
| EG26352A (en) | 2013-08-26 |
| US20090091424A1 (en) | 2009-04-09 |
| ES2371694T3 (es) | 2012-01-09 |
| MX2009005695A (es) | 2009-06-08 |
| CA2669079A1 (en) | 2009-04-16 |
| KR20090035406A (ko) | 2009-04-09 |
| US8188867B2 (en) | 2012-05-29 |
| US20110155811A1 (en) | 2011-06-30 |
| ATE527627T1 (de) | 2011-10-15 |
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