PL1681527T3 - Sposób wytwarzania zespołu płytki izotermicznej o określonym kształcie - Google Patents

Sposób wytwarzania zespołu płytki izotermicznej o określonym kształcie

Info

Publication number
PL1681527T3
PL1681527T3 PL05000861T PL05000861T PL1681527T3 PL 1681527 T3 PL1681527 T3 PL 1681527T3 PL 05000861 T PL05000861 T PL 05000861T PL 05000861 T PL05000861 T PL 05000861T PL 1681527 T3 PL1681527 T3 PL 1681527T3
Authority
PL
Poland
Prior art keywords
shape
manufacturing
plate assembly
predetemined
plate
Prior art date
Application number
PL05000861T
Other languages
English (en)
Inventor
Kuo-Len Lin
Hui-Min Tsui
Ken Hsu
Original Assignee
Cpumate Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cpumate Inc filed Critical Cpumate Inc
Publication of PL1681527T3 publication Critical patent/PL1681527T3/pl

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Landscapes

  • Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Adornments (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Tunnel Furnaces (AREA)
PL05000861T 2005-01-17 2005-01-17 Sposób wytwarzania zespołu płytki izotermicznej o określonym kształcie PL1681527T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05000861A EP1681527B1 (en) 2005-01-17 2005-01-17 Method for manufacturing an isothermal plate assembly with predetemined shape

Publications (1)

Publication Number Publication Date
PL1681527T3 true PL1681527T3 (pl) 2007-10-31

Family

ID=34933339

Family Applications (1)

Application Number Title Priority Date Filing Date
PL05000861T PL1681527T3 (pl) 2005-01-17 2005-01-17 Sposób wytwarzania zespołu płytki izotermicznej o określonym kształcie

Country Status (6)

Country Link
EP (1) EP1681527B1 (pl)
AT (1) ATE362604T1 (pl)
DE (1) DE602005001153T2 (pl)
DK (1) DK1681527T3 (pl)
ES (1) ES2287814T3 (pl)
PL (1) PL1681527T3 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2657338B2 (es) * 2016-09-02 2019-01-29 Eidopia S L Sistema opto-térmico basado en pletinas térmicas bidimensionales
CN115917238A (zh) * 2020-06-11 2023-04-04 昕诺飞控股有限公司 均温板组件
CN114346021A (zh) * 2021-12-16 2022-04-15 南京航空航天大学 一种难变形材料管材的差温自由弯曲成形装置和方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2947000C2 (de) * 1978-11-22 1985-04-18 Pioneer Electronic Corp., Tokio/Tokyo Gehäuse für elektronische Vorrichtungen
US4461343A (en) * 1982-01-28 1984-07-24 Mcdonnell Douglas Corporation Plated heat pipe
DE3543673A1 (de) * 1985-12-11 1987-06-19 Sueddeutsche Kuehler Behr Einrichtung zum heizen
US4880052A (en) * 1989-02-27 1989-11-14 Thermacore, Inc. Heat pipe cooling plate
JPH04366394A (ja) * 1991-06-11 1992-12-18 Akutoronikusu Kk ハイブリッド型ヒートパイプ平板構造体
US6133631A (en) * 1997-05-30 2000-10-17 Hewlett-Packard Company Semiconductor package lid with internal heat pipe
JP2981505B2 (ja) * 1998-04-10 1999-11-22 ダイヤモンド電機株式会社 ヒートパイプの加工方法
JP2001165584A (ja) * 1999-12-02 2001-06-22 Tokai Rubber Ind Ltd シート状ヒートパイプ
JP2001241869A (ja) * 2000-02-24 2001-09-07 Toshiba Corp ヒートパイプ構造
US6679318B2 (en) * 2002-01-19 2004-01-20 Allan P Bakke Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability

Also Published As

Publication number Publication date
DE602005001153D1 (de) 2007-06-28
DE602005001153T2 (de) 2008-01-24
ES2287814T3 (es) 2007-12-16
ATE362604T1 (de) 2007-06-15
EP1681527B1 (en) 2007-05-16
EP1681527A1 (en) 2006-07-19
DK1681527T3 (da) 2007-09-10

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