PL1680274T3 - Warstwowy system termiczny - Google Patents

Warstwowy system termiczny

Info

Publication number
PL1680274T3
PL1680274T3 PL04794219T PL04794219T PL1680274T3 PL 1680274 T3 PL1680274 T3 PL 1680274T3 PL 04794219 T PL04794219 T PL 04794219T PL 04794219 T PL04794219 T PL 04794219T PL 1680274 T3 PL1680274 T3 PL 1680274T3
Authority
PL
Poland
Prior art keywords
thermal system
layered thermal
layered
thermal
Prior art date
Application number
PL04794219T
Other languages
English (en)
Inventor
Kikuo Fujiwara
Masaaki Tozawa
Gary D. Shives
Julian Norley
Robert Anderson Reynolds Iii
Original Assignee
Neograf Solutions, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003382882A external-priority patent/JP2005150249A/ja
Priority claimed from JP2004017710A external-priority patent/JP2005210035A/ja
Application filed by Neograf Solutions, Llc filed Critical Neograf Solutions, Llc
Publication of PL1680274T3 publication Critical patent/PL1680274T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H10W40/25—

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Carbon And Carbon Compounds (AREA)
PL04794219T 2003-11-04 2004-10-06 Warstwowy system termiczny PL1680274T3 (pl)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2003375005 2003-11-04
JP2003382882A JP2005150249A (ja) 2003-11-12 2003-11-12 熱伝導部材とそれを用いた放熱用構造体
JP2004017710A JP2005210035A (ja) 2004-01-26 2004-01-26 グラファイト複合材
PCT/US2004/032803 WO2005048298A2 (en) 2003-11-04 2004-10-06 Sandwiched thermal solution
EP04794219.8A EP1680274B1 (en) 2003-11-04 2004-10-06 Sandwiched thermal solution

Publications (1)

Publication Number Publication Date
PL1680274T3 true PL1680274T3 (pl) 2019-03-29

Family

ID=34595694

Family Applications (1)

Application Number Title Priority Date Filing Date
PL04794219T PL1680274T3 (pl) 2003-11-04 2004-10-06 Warstwowy system termiczny

Country Status (7)

Country Link
EP (1) EP1680274B1 (pl)
KR (1) KR101168099B1 (pl)
CN (1) CN1874889B (pl)
ES (1) ES2690773T3 (pl)
HU (1) HUE040521T2 (pl)
PL (1) PL1680274T3 (pl)
WO (1) WO2005048298A2 (pl)

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JP5096010B2 (ja) 2007-02-01 2012-12-12 ポリマテック株式会社 熱拡散シート及び熱拡散シートの位置決め方法
EP2540085A1 (en) * 2010-02-26 2013-01-02 Graftech International Holdings Inc. Thermal management for handheld projectors
US20130065011A1 (en) * 2010-03-10 2013-03-14 Nitto Denko Corporation Heat insulation/heat dissipation sheet and intra-device structure
EP2901826B1 (en) * 2012-09-25 2020-12-16 Momentive Performance Materials Inc. Thermal management assembly comprising bulk graphene material
CN102917574B (zh) * 2012-10-24 2015-05-27 华为技术有限公司 导热垫、制造导热垫的方法、散热装置和电子设备
JP6379357B2 (ja) 2013-03-25 2018-08-29 パナソニックＩｐマネジメント株式会社 断熱シートおよびこれを用いた冷却構造
US9312580B2 (en) 2013-07-30 2016-04-12 Johnson Controls Technology Company Battery module with phase change material
US8861191B1 (en) 2013-09-30 2014-10-14 Google Inc. Apparatus related to a structure of a base portion of a computing device
US9430006B1 (en) 2013-09-30 2016-08-30 Google Inc. Computing device with heat spreader
WO2015059855A1 (ja) 2013-10-21 2015-04-30 パナソニックＩｐマネジメント株式会社 断熱シートおよびその製造方法
JP6307288B2 (ja) * 2014-01-29 2018-04-04 デクセリアルズ株式会社 熱伝導性部材、及び半導体装置
JP6682741B2 (ja) * 2014-06-23 2020-04-15 サムソン エレクトロ−メカニックス カンパニーリミテッド． 回路基板及び回路基板組立体
US9442514B1 (en) 2014-07-23 2016-09-13 Google Inc. Graphite layer between carbon layers
TWI700359B (zh) * 2015-05-15 2020-08-01 美商摩曼帝夫特性材料公司 用於熱管理之使用熱解石墨的發光二極體組件
US11125921B2 (en) 2015-07-24 2021-09-21 3M Innovative Properties Company Reflective stack with heat spreading layer
WO2017044712A1 (en) 2015-09-11 2017-03-16 Laird Technologies, Inc. Devices for absorbing energy from electronic components
US10389397B2 (en) 2016-07-26 2019-08-20 Laird Technologies, Inc. Small form-factor pluggable (SFP) transceivers
US10965333B2 (en) 2016-07-26 2021-03-30 Laird Technologies, Inc. Thermal management assemblies suitable for use with transceivers and other devices
JP2018107154A (ja) * 2016-12-22 2018-07-05 住友金属鉱山株式会社 放熱基板
JP7053579B2 (ja) 2017-03-29 2022-04-12 デンカ株式会社 伝熱部材及びこれを含む放熱構造体
US10427439B2 (en) 2017-09-11 2019-10-01 Apple Inc. Substrate marking for sealing surfaces
US10951053B2 (en) 2018-09-10 2021-03-16 Apple Inc. Portable electronic device
US11483948B2 (en) 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
CA3184137A1 (en) * 2020-06-24 2021-12-30 Jonathan Taylor A shielding article
EP4013203B1 (en) 2020-12-10 2024-07-31 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets
US12209664B2 (en) 2020-12-10 2025-01-28 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991581A (en) * 1962-03-21 1965-05-12 High Temperature Materials Inc Expanded pyrolytic graphite and process for producing the same
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
WO1996023399A1 (en) * 1995-01-25 1996-08-01 Aavid Engineering, Inc. Thermal management and rfi/emi shielding system
US5737187A (en) * 1996-08-26 1998-04-07 Compaq Computer Corporation Apparatus, method and system for thermal management of an unpackaged semiconductor device
US6131651A (en) * 1998-09-16 2000-10-17 Advanced Ceramics Corporation Flexible heat transfer device and method
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
JP2004518294A (ja) * 2001-01-22 2004-06-17 パーカー−ハニフイン・コーポレーシヨン クリーンなレリースの、相変化のターミナルインターフエース
US20020157819A1 (en) * 2001-04-04 2002-10-31 Julian Norley Graphite-based thermal dissipation component
JP2003008263A (ja) * 2001-06-27 2003-01-10 Sony Corp 熱伝導部材および熱伝導部材を有する電子機器

Also Published As

Publication number Publication date
WO2005048298A2 (en) 2005-05-26
WO2005048298A3 (en) 2006-03-30
HUE040521T2 (hu) 2019-03-28
CN1874889A (zh) 2006-12-06
KR101168099B1 (ko) 2012-07-27
ES2690773T3 (es) 2018-11-22
KR20060123260A (ko) 2006-12-01
CN1874889B (zh) 2012-09-19
EP1680274B1 (en) 2018-09-26
EP1680274A4 (en) 2007-12-19
EP1680274A2 (en) 2006-07-19

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