OA00795A - Procédé et montage pour l'assemblage mécanique de diodes à cristal et pièces ainsi fabriquées. - Google Patents

Procédé et montage pour l'assemblage mécanique de diodes à cristal et pièces ainsi fabriquées.

Info

Publication number
OA00795A
OA00795A OA50886A OA50886A OA00795A OA 00795 A OA00795 A OA 00795A OA 50886 A OA50886 A OA 50886A OA 50886 A OA50886 A OA 50886A OA 00795 A OA00795 A OA 00795A
Authority
OA
OAPI
Prior art keywords
assembly
manufactured
parts
crystal diodes
mechanical
Prior art date
Application number
OA50886A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of OA00795A publication Critical patent/OA00795A/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/32—Sealing leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
OA50886A 1959-05-12 1964-12-16 Procédé et montage pour l'assemblage mécanique de diodes à cristal et pièces ainsi fabriquées. OA00795A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL239128 1959-05-12

Publications (1)

Publication Number Publication Date
OA00795A true OA00795A (fr) 1967-11-15

Family

ID=19751727

Family Applications (1)

Application Number Title Priority Date Filing Date
OA50886A OA00795A (fr) 1959-05-12 1964-12-16 Procédé et montage pour l'assemblage mécanique de diodes à cristal et pièces ainsi fabriquées.

Country Status (6)

Country Link
US (1) US3178796A (fr)
CH (1) CH382299A (fr)
DE (1) DE1160110B (fr)
GB (1) GB950737A (fr)
NL (2) NL239128A (fr)
OA (1) OA00795A (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271124A (en) * 1963-09-16 1966-09-06 Bell Telephone Labor Inc Semiconductor encapsulation
US3360851A (en) * 1965-10-01 1968-01-02 Bell Telephone Labor Inc Small area semiconductor device
US3518753A (en) * 1967-08-22 1970-07-07 Motorola Inc Glass encapsulated semiconductor devices
US3521203A (en) * 1967-11-14 1970-07-21 Bell Telephone Labor Inc Magnetic mounting for pill-type diodes
US3577632A (en) * 1969-09-18 1971-05-04 Siemens Ag Method of producing semiconductor device in glass housing
FR2100997B1 (fr) * 1970-08-04 1973-12-21 Silec Semi Conducteurs
US4074420A (en) * 1976-08-05 1978-02-21 Raychem Corporation Method and apparatus for the assembly of jacketed electronic devices
CA1160677A (fr) * 1980-07-21 1984-01-17 Donald E. Armstrong Methode de fabrication de lampes eclair a declenchement electrique avec extremite scellee amelioree
US4457700A (en) * 1980-07-21 1984-07-03 Gte Products Corporation Electrically-activated photoflash lamp excluding a press-sealed end portion
US4369556A (en) * 1980-07-21 1983-01-25 Gte Products Corporation Method of making a photoflash lamp having new lead seal structure

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1833660A (en) * 1926-07-31 1931-11-24 Western Electric Co Welding apparatus
US2677173A (en) * 1947-06-20 1954-05-04 Sylvania Electric Prod Automatic machine for forming and mounting crystal diode electrodes
US2697806A (en) * 1949-03-09 1954-12-21 Sylvania Electric Prod Glass enclosed electrical translator
BE502229A (fr) * 1950-03-31
US2683205A (en) * 1951-02-07 1954-07-06 Gen Electric Machine for making crystal rectifiers and the like
US2693555A (en) * 1951-04-04 1954-11-02 Hughes Aircraft Co Method and apparatus for welding germanium diodes
US2649560A (en) * 1951-05-17 1953-08-18 Bell Telephone Labor Inc Motor system for controlling pressure
DE885755C (de) * 1951-08-16 Telefunken Gmbh Verfahren und Vorrichtung zur Herstellung von Kristalloden, z. B. Halbleiter-Dioden oder Transistoren
US2757440A (en) * 1952-01-09 1956-08-07 Hughes Aircraft Co Apparatus for assembling semiconductor devices
US2823789A (en) * 1952-05-06 1958-02-18 Gilman Engineering & Mfg Corp Parts feeder ribbon
DE1020121B (de) * 1955-02-19 1957-11-28 Kieler Howaldtswerke Ag Verfahren zur Herstellung von Halbleitergeraeten kleinster Abmessungen und Vorrichtung zur Ausuebung des Verfahrens
US2984046A (en) * 1955-05-02 1961-05-16 Western Electric Co Apparatus for fabricating dry reed switches
US3047933A (en) * 1958-01-17 1962-08-07 Columbia Broadcasting Syst Inc Crystal diode assembly machine and method therefor

Also Published As

Publication number Publication date
GB950737A (en) 1964-02-26
CH382299A (de) 1964-09-30
DE1160110B (de) 1963-12-27
US3178796A (en) 1965-04-20
NL239128A (fr) 1900-01-01
NL113612C (fr) 1900-01-01

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