GB950737A - Improvements in or relating to methods of, and devices for assembling crystal diodes - Google Patents

Improvements in or relating to methods of, and devices for assembling crystal diodes

Info

Publication number
GB950737A
GB950737A GB16806/60A GB1680660A GB950737A GB 950737 A GB950737 A GB 950737A GB 16806/60 A GB16806/60 A GB 16806/60A GB 1680660 A GB1680660 A GB 1680660A GB 950737 A GB950737 A GB 950737A
Authority
GB
United Kingdom
Prior art keywords
zone
contact
pict
anode
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB16806/60A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB950737A publication Critical patent/GB950737A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/32—Sealing leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

<PICT:0950737/C1/1> <PICT:0950737/C1/2> <PICT:0950737/C1/3> <PICT:0950737/C1/4> In a method of assembling a crystal diode, Fig. 1, an anode portion (1, 3) is held, under the action of an automatically reproducible and automatically applied force P, with its whisker 3 against the semi-conductor crystal 4 of a cathode portion 2, 4, 5, the electrical properties of the contact are tested; and, if the result is favourable, the open end of the glass bulb 5 is sealed to the end of the wire 1 whilst the whisker is held against the crystal by that force. If the result is unfavourable, the anode portion is raised, rotated about its longitudinal axis and lowered to form a new contact which is tested as before. A device, Fig. 5, for carrying out this method has sealing heads located along, say, a straight line, Fig. 5, in a circle around which they are moved in synchronism with the motion of parts on guide tracks 42, 43. Anode and cathode portions are supplied by arms at s and t along paths 48, 49; and completed diodes are removed along paths 50, 51. A safety device in zone D prevents supply if any sealing head is not emptied. Each sealing head, Fig. 2, comprises tongs 7, which hold the cathode portion, and a holder 6, with a magnetic part 12, for the anode portion. A slidable rod 16 with a magnetic end 17 is movable vertically to displace the anode portion and is allowed to fall freely in the application of the force. The end 17 of rod 16 may be replaced by a weight 33, Fig. 3, in which a magnetic block is slidable under the action of a compression spring. An electrical heating coil 14 is movable vertically over the cathode portion. Electrical tests of the contact are made via leads 18, 19, in the adjusting zone A, Fig. 5, of the machine, the two portions being moved together at b, the electrical properties tested at c and readjustment and renewed testing carried out, if necessary, at e, f, g, h, electromagnetic means terminating adjustment when the contact is correct. If the contact is incorrect at k, the tongs open at m; and the cathode portion is released and falls out of the tongs. Heating coil 14 is energized to seal the diode in zone B and the diode is cooled in zone C before removal at n or r in zone D.
GB16806/60A 1959-05-12 1960-05-12 Improvements in or relating to methods of, and devices for assembling crystal diodes Expired GB950737A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL239128 1959-05-12

Publications (1)

Publication Number Publication Date
GB950737A true GB950737A (en) 1964-02-26

Family

ID=19751727

Family Applications (1)

Application Number Title Priority Date Filing Date
GB16806/60A Expired GB950737A (en) 1959-05-12 1960-05-12 Improvements in or relating to methods of, and devices for assembling crystal diodes

Country Status (6)

Country Link
US (1) US3178796A (en)
CH (1) CH382299A (en)
DE (1) DE1160110B (en)
GB (1) GB950737A (en)
NL (2) NL113612C (en)
OA (1) OA00795A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271124A (en) * 1963-09-16 1966-09-06 Bell Telephone Labor Inc Semiconductor encapsulation
US3360851A (en) * 1965-10-01 1968-01-02 Bell Telephone Labor Inc Small area semiconductor device
US3518753A (en) * 1967-08-22 1970-07-07 Motorola Inc Glass encapsulated semiconductor devices
US3521203A (en) * 1967-11-14 1970-07-21 Bell Telephone Labor Inc Magnetic mounting for pill-type diodes
US3577632A (en) * 1969-09-18 1971-05-04 Siemens Ag Method of producing semiconductor device in glass housing
FR2100997B1 (en) * 1970-08-04 1973-12-21 Silec Semi Conducteurs
US4074420A (en) * 1976-08-05 1978-02-21 Raychem Corporation Method and apparatus for the assembly of jacketed electronic devices
CA1160677A (en) * 1980-07-21 1984-01-17 Donald E. Armstrong Method of making electrically-activated photoflash lamp with improved sealed end portion
US4457700A (en) * 1980-07-21 1984-07-03 Gte Products Corporation Electrically-activated photoflash lamp excluding a press-sealed end portion
US4369556A (en) * 1980-07-21 1983-01-25 Gte Products Corporation Method of making a photoflash lamp having new lead seal structure

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1833660A (en) * 1926-07-31 1931-11-24 Western Electric Co Welding apparatus
US2677173A (en) * 1947-06-20 1954-05-04 Sylvania Electric Prod Automatic machine for forming and mounting crystal diode electrodes
US2697806A (en) * 1949-03-09 1954-12-21 Sylvania Electric Prod Glass enclosed electrical translator
NL160163B (en) * 1950-03-31 Staley Mfg Co A E METHOD OF MANUFACTURE OF TABLETS.
US2683205A (en) * 1951-02-07 1954-07-06 Gen Electric Machine for making crystal rectifiers and the like
US2693555A (en) * 1951-04-04 1954-11-02 Hughes Aircraft Co Method and apparatus for welding germanium diodes
US2649560A (en) * 1951-05-17 1953-08-18 Bell Telephone Labor Inc Motor system for controlling pressure
DE885755C (en) * 1951-08-16 Telefunken Gmbh Method and apparatus for the production of crystallodes, e.g. B. semiconductor diodes or transistors
US2757440A (en) * 1952-01-09 1956-08-07 Hughes Aircraft Co Apparatus for assembling semiconductor devices
US2823789A (en) * 1952-05-06 1958-02-18 Gilman Engineering & Mfg Corp Parts feeder ribbon
DE1020121B (en) * 1955-02-19 1957-11-28 Kieler Howaldtswerke Ag Process for the production of semiconductor devices of the smallest dimensions and device for practicing the process
US2984046A (en) * 1955-05-02 1961-05-16 Western Electric Co Apparatus for fabricating dry reed switches
US3047933A (en) * 1958-01-17 1962-08-07 Columbia Broadcasting Syst Inc Crystal diode assembly machine and method therefor

Also Published As

Publication number Publication date
OA00795A (en) 1967-11-15
NL113612C (en) 1900-01-01
US3178796A (en) 1965-04-20
NL239128A (en) 1900-01-01
CH382299A (en) 1964-09-30
DE1160110B (en) 1963-12-27

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