NO993213L - Trykktransduktor og fremgangsmåte til fremstilling av denne - Google Patents

Trykktransduktor og fremgangsmåte til fremstilling av denne

Info

Publication number
NO993213L
NO993213L NO993213A NO993213A NO993213L NO 993213 L NO993213 L NO 993213L NO 993213 A NO993213 A NO 993213A NO 993213 A NO993213 A NO 993213A NO 993213 L NO993213 L NO 993213L
Authority
NO
Norway
Prior art keywords
manufacturing
pressure transducer
transducer
pressure
Prior art date
Application number
NO993213A
Other languages
English (en)
Other versions
NO993213D0 (no
NO322331B1 (no
Inventor
Masaharu Ikeda
Masayoshi Esashi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of NO993213D0 publication Critical patent/NO993213D0/no
Publication of NO993213L publication Critical patent/NO993213L/no
Publication of NO322331B1 publication Critical patent/NO322331B1/no

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
NO19993213A 1998-06-30 1999-06-28 Trykktransduser og fremgangsmate for fremstilling av derav NO322331B1 (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10198078A JP2000022172A (ja) 1998-06-30 1998-06-30 変換装置及びその製造方法

Publications (3)

Publication Number Publication Date
NO993213D0 NO993213D0 (no) 1999-06-28
NO993213L true NO993213L (no) 2000-01-04
NO322331B1 NO322331B1 (no) 2006-09-18

Family

ID=16385160

Family Applications (1)

Application Number Title Priority Date Filing Date
NO19993213A NO322331B1 (no) 1998-06-30 1999-06-28 Trykktransduser og fremgangsmate for fremstilling av derav

Country Status (7)

Country Link
US (2) US6441451B1 (no)
EP (1) EP0969694B1 (no)
JP (1) JP2000022172A (no)
CN (1) CN1145219C (no)
DE (1) DE69934841T2 (no)
DK (1) DK0969694T3 (no)
NO (1) NO322331B1 (no)

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US20040232503A1 (en) * 2001-06-12 2004-11-25 Shinya Sato Semiconductor device and method of producing the same
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JP4296731B2 (ja) 2001-07-18 2009-07-15 株式会社デンソー 静電容量型圧力センサの製造方法
US7298856B2 (en) 2001-09-05 2007-11-20 Nippon Hoso Kyokai Chip microphone and method of making same
US6677176B2 (en) * 2002-01-18 2004-01-13 The Hong Kong University Of Science And Technology Method of manufacturing an integrated electronic microphone having a floating gate electrode
US6952042B2 (en) * 2002-06-17 2005-10-04 Honeywell International, Inc. Microelectromechanical device with integrated conductive shield
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US6983653B2 (en) * 2002-12-13 2006-01-10 Denso Corporation Flow sensor having thin film portion and method for manufacturing the same
CN100486359C (zh) * 2003-08-12 2009-05-06 中国科学院声学研究所 一种传声器芯片制备方法
CN1330952C (zh) * 2003-11-14 2007-08-08 中国科学院电子学研究所 聚合材料气压传感器芯片
JP4529431B2 (ja) * 2003-12-05 2010-08-25 株式会社豊田中央研究所 マイクロ構造体の製造方法
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US6923069B1 (en) 2004-10-18 2005-08-02 Honeywell International Inc. Top side reference cavity for absolute pressure sensor
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JP2006226756A (ja) * 2005-02-16 2006-08-31 Denso Corp 圧力センサ
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
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US20070163355A1 (en) * 2006-01-13 2007-07-19 Kavlico Corporation Preformed sensor housing and methods to produce thin metal diaphragms
DE102006002106B4 (de) * 2006-01-17 2016-03-03 Robert Bosch Gmbh Mikromechanischer Sensor mit perforationsoptimierter Membran sowie ein geeignetes Hestellungsverfahren
FR2897937B1 (fr) 2006-02-24 2008-05-23 Commissariat Energie Atomique Capteur de pression a jauges resistives
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US7448277B2 (en) * 2006-08-31 2008-11-11 Evigia Systems, Inc. Capacitive pressure sensor and method therefor
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JP2008132583A (ja) * 2006-10-24 2008-06-12 Seiko Epson Corp Ｍｅｍｓデバイス
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EP1931173B1 (en) * 2006-12-06 2011-07-20 Electronics and Telecommunications Research Institute Condenser microphone having flexure hinge diaphragm and method of manufacturing the same
DE102008000128B4 (de) * 2007-01-30 2013-01-03 Denso Corporation Halbleitersensorvorrichtung und deren Herstellungsverfahren
US7412892B1 (en) 2007-06-06 2008-08-19 Measurement Specialties, Inc. Method of making pressure transducer and apparatus
US8240217B2 (en) * 2007-10-15 2012-08-14 Kavlico Corporation Diaphragm isolation forming through subtractive etching
US7677109B2 (en) 2008-02-27 2010-03-16 Honeywell International Inc. Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die
EP2452349A1 (en) 2009-07-06 2012-05-16 Imec Method for forming mems variable capacitors
US8322225B2 (en) * 2009-07-10 2012-12-04 Honeywell International Inc. Sensor package assembly having an unconstrained sense die
JP5400708B2 (ja) * 2010-05-27 2014-01-29 オムロン株式会社 音響センサ、音響トランスデューサ、該音響トランスデューサを利用したマイクロフォン、および音響トランスデューサの製造方法
US8230743B2 (en) 2010-08-23 2012-07-31 Honeywell International Inc. Pressure sensor
JP5875244B2 (ja) 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5875243B2 (ja) 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
US9409763B2 (en) * 2012-04-04 2016-08-09 Infineon Technologies Ag MEMS device and method of making a MEMS device
DE102012205921A1 (de) 2012-04-12 2013-10-17 Robert Bosch Gmbh Membrananordnung für einen mikro-elektromechanischen Messumformer und Verfahren zum Herstellen einer Membrananordnung
CN103011052A (zh) * 2012-12-21 2013-04-03 上海宏力半导体制造有限公司 Mems器件的牺牲层、mems器件及其制作方法
JP6127625B2 (ja) * 2013-03-19 2017-05-17 オムロン株式会社 静電容量型圧力センサ及び入力装置
CN104427456B (zh) * 2013-08-20 2017-12-05 无锡华润上华科技有限公司 一种减少微机电系统麦克风制作过程中产生的粘黏的方法
CN105492128B (zh) * 2013-08-26 2018-08-10 皇家飞利浦有限公司 超声换能器组件和用于制造超声换能器组件的方法
EP3367082A1 (en) 2013-11-06 2018-08-29 Invensense, Inc. Pressure sensor
EP2871455B1 (en) 2013-11-06 2020-03-04 Invensense, Inc. Pressure sensor
JP6399803B2 (ja) * 2014-05-14 2018-10-03 キヤノン株式会社 力覚センサおよび把持装置
EP3076146B1 (en) 2015-04-02 2020-05-06 Invensense, Inc. Pressure sensor
KR101776725B1 (ko) * 2015-12-11 2017-09-08 현대자동차 주식회사 멤스 마이크로폰 및 그 제조방법
US11243127B2 (en) 2016-02-03 2022-02-08 Hutchinson Technology Incorporated Miniature pressure/force sensor with integrated leads
CN108886655B (zh) * 2016-03-22 2021-10-15 奥音科技（镇江）有限公司 声学装置振膜和声学装置
US9900707B1 (en) * 2016-11-29 2018-02-20 Cirrus Logic, Inc. Biasing of electromechanical systems microphone with alternating-current voltage waveform
US9813831B1 (en) 2016-11-29 2017-11-07 Cirrus Logic, Inc. Microelectromechanical systems microphone with electrostatic force feedback to measure sound pressure
KR102397715B1 (ko) 2016-12-09 2022-05-13 더 리서치 파운데이션 포 더 스테이트 유니버시티 오브 뉴욕 섬유 마이크로폰
CN107337174B (zh) * 2017-06-27 2019-04-02 杭州电子科技大学 一种多晶硅振膜结构的制作方法
KR101995817B1 (ko) * 2017-07-18 2019-07-03 주식회사 하이딥 터치 입력 장치 제조 방법 및 터치 입력 장치
CN110366083B (zh) * 2018-04-11 2021-02-12 中芯国际集成电路制造(上海)有限公司 Mems器件及其制备方法
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JP7497800B2 (ja) 2020-07-08 2024-06-11 オー・エイチ・ティー株式会社 容量センサ及び容量センサの製造方法
WO2024103263A1 (zh) * 2022-11-15 2024-05-23 京东方科技集团股份有限公司 压力传感器及其制备方法、电子装置

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Also Published As

Publication number Publication date
DE69934841T2 (de) 2007-10-11
US6756248B2 (en) 2004-06-29
CN1145219C (zh) 2004-04-07
EP0969694A2 (en) 2000-01-05
NO993213D0 (no) 1999-06-28
JP2000022172A (ja) 2000-01-21
EP0969694A3 (en) 2005-06-01
EP0969694B1 (en) 2007-01-17
CN1247386A (zh) 2000-03-15
NO322331B1 (no) 2006-09-18
US20020093038A1 (en) 2002-07-18
US6441451B1 (en) 2002-08-27
DE69934841D1 (de) 2007-03-08
DK0969694T3 (da) 2007-05-14

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