NO993213L - Trykktransduktor og fremgangsmåte til fremstilling av denne - Google Patents

Trykktransduktor og fremgangsmåte til fremstilling av denne

Info

Publication number
NO993213L
NO993213L NO993213A NO993213A NO993213L NO 993213 L NO993213 L NO 993213L NO 993213 A NO993213 A NO 993213A NO 993213 A NO993213 A NO 993213A NO 993213 L NO993213 L NO 993213L
Authority
NO
Norway
Prior art keywords
manufacturing
pressure transducer
transducer
pressure
Prior art date
Application number
NO993213A
Other languages
English (en)
Other versions
NO322331B1 (no
NO993213D0 (no
Inventor
Masaharu Ikeda
Masayoshi Esashi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of NO993213D0 publication Critical patent/NO993213D0/no
Publication of NO993213L publication Critical patent/NO993213L/no
Publication of NO322331B1 publication Critical patent/NO322331B1/no

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
NO19993213A 1998-06-30 1999-06-28 Trykktransduser og fremgangsmate for fremstilling av derav NO322331B1 (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10198078A JP2000022172A (ja) 1998-06-30 1998-06-30 変換装置及びその製造方法

Publications (3)

Publication Number Publication Date
NO993213D0 NO993213D0 (no) 1999-06-28
NO993213L true NO993213L (no) 2000-01-04
NO322331B1 NO322331B1 (no) 2006-09-18

Family

ID=16385160

Family Applications (1)

Application Number Title Priority Date Filing Date
NO19993213A NO322331B1 (no) 1998-06-30 1999-06-28 Trykktransduser og fremgangsmate for fremstilling av derav

Country Status (7)

Country Link
US (2) US6441451B1 (no)
EP (1) EP0969694B1 (no)
JP (1) JP2000022172A (no)
CN (1) CN1145219C (no)
DE (1) DE69934841T2 (no)
DK (1) DK0969694T3 (no)
NO (1) NO322331B1 (no)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4161493B2 (ja) * 1999-12-10 2008-10-08 ソニー株式会社 エッチング方法およびマイクロミラーの製造方法
US7008812B1 (en) * 2000-05-30 2006-03-07 Ic Mechanics, Inc. Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation
US7153717B2 (en) * 2000-05-30 2006-12-26 Ic Mechanics Inc. Encapsulation of MEMS devices using pillar-supported caps
JP2002257616A (ja) * 2001-03-06 2002-09-11 Seiko Epson Corp センサおよびセンサの製造方法
US6465280B1 (en) * 2001-03-07 2002-10-15 Analog Devices, Inc. In-situ cap and method of fabricating same for an integrated circuit device
WO2002101836A1 (fr) * 2001-06-12 2002-12-19 Hitachi, Ltd. Dispositif semiconducteur et procede de production associe
JP4296728B2 (ja) * 2001-07-06 2009-07-15 株式会社デンソー 静電容量型圧力センサおよびその製造方法並びに静電容量型圧力センサに用いるセンサ用構造体
JP4296731B2 (ja) 2001-07-18 2009-07-15 株式会社デンソー 静電容量型圧力センサの製造方法
US7298856B2 (en) 2001-09-05 2007-11-20 Nippon Hoso Kyokai Chip microphone and method of making same
US6677176B2 (en) * 2002-01-18 2004-01-13 The Hong Kong University Of Science And Technology Method of manufacturing an integrated electronic microphone having a floating gate electrode
US6952042B2 (en) * 2002-06-17 2005-10-04 Honeywell International, Inc. Microelectromechanical device with integrated conductive shield
US20060149168A1 (en) * 2002-08-19 2006-07-06 Robert Czarnek Capacitive uterine contraction sensor
JP2004177343A (ja) * 2002-11-28 2004-06-24 Fujikura Ltd 圧力センサ
US6983653B2 (en) * 2002-12-13 2006-01-10 Denso Corporation Flow sensor having thin film portion and method for manufacturing the same
CN100486359C (zh) * 2003-08-12 2009-05-06 中国科学院声学研究所 一种传声器芯片制备方法
CN1330952C (zh) * 2003-11-14 2007-08-08 中国科学院电子学研究所 聚合材料气压传感器芯片
JP4529431B2 (ja) * 2003-12-05 2010-08-25 株式会社豊田中央研究所 マイクロ構造体の製造方法
KR100517515B1 (ko) * 2004-01-20 2005-09-28 삼성전자주식회사 모놀리틱 잉크젯 프린트헤드의 제조방법
WO2005077816A1 (en) * 2004-02-09 2005-08-25 Analog Devices, Inc. Method of forming a device by removing a conductive layer of a wafer
JP4036866B2 (ja) * 2004-07-30 2008-01-23 三洋電機株式会社 音響センサ
US7231832B2 (en) * 2004-09-13 2007-06-19 United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration System and method for detecting cracks and their location
US6923069B1 (en) 2004-10-18 2005-08-02 Honeywell International Inc. Top side reference cavity for absolute pressure sensor
DE102005004877A1 (de) * 2005-02-03 2006-08-10 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
DE102005004878B4 (de) * 2005-02-03 2015-01-08 Robert Bosch Gmbh Mikromechanischer kapazitiver Drucksensor und entsprechendes Herstellungsverfahren
JP2006226756A (ja) * 2005-02-16 2006-08-31 Denso Corp 圧力センサ
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US7334484B2 (en) * 2005-05-27 2008-02-26 Rosemount Inc. Line pressure measurement using differential pressure sensor
US7562429B2 (en) * 2005-06-20 2009-07-21 Avago Technologies General Ip (Singapore) Pte. Ltd. Suspended device and method of making
US7961897B2 (en) * 2005-08-23 2011-06-14 Analog Devices, Inc. Microphone with irregular diaphragm
US7395719B2 (en) * 2006-01-13 2008-07-08 Custom Sensors & Technologies, Inc. Preformed sensor housings and methods to produce thin metal diaphragms
US20070163355A1 (en) * 2006-01-13 2007-07-19 Kavlico Corporation Preformed sensor housing and methods to produce thin metal diaphragms
DE102006002106B4 (de) * 2006-01-17 2016-03-03 Robert Bosch Gmbh Mikromechanischer Sensor mit perforationsoptimierter Membran sowie ein geeignetes Hestellungsverfahren
FR2897937B1 (fr) 2006-02-24 2008-05-23 Commissariat Energie Atomique Capteur de pression a jauges resistives
DE102006022378A1 (de) * 2006-05-12 2007-11-22 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelements und mikromechanisches Bauelement
FR2900869B1 (fr) * 2006-05-12 2009-03-13 Salomon Sa Roue a rayons
EP2275793A1 (en) * 2006-05-23 2011-01-19 Sensirion Holding AG A pressure sensor having a chamber and a method for fabricating the same
JP4244232B2 (ja) * 2006-07-19 2009-03-25 ヤマハ株式会社 コンデンサマイクロホン及びその製造方法
US7448277B2 (en) * 2006-08-31 2008-11-11 Evigia Systems, Inc. Capacitive pressure sensor and method therefor
JP2008101918A (ja) * 2006-10-17 2008-05-01 Alps Electric Co Ltd 圧力センサのパッケージ
JP2008132583A (ja) * 2006-10-24 2008-06-12 Seiko Epson Corp Ｍｅｍｓデバイス
DE102006055147B4 (de) 2006-11-03 2011-01-27 Infineon Technologies Ag Schallwandlerstruktur und Verfahren zur Herstellung einer Schallwandlerstruktur
EP1931173B1 (en) * 2006-12-06 2011-07-20 Electronics and Telecommunications Research Institute Condenser microphone having flexure hinge diaphragm and method of manufacturing the same
DE102008000128B4 (de) * 2007-01-30 2013-01-03 Denso Corporation Halbleitersensorvorrichtung und deren Herstellungsverfahren
US7412892B1 (en) 2007-06-06 2008-08-19 Measurement Specialties, Inc. Method of making pressure transducer and apparatus
US8240217B2 (en) * 2007-10-15 2012-08-14 Kavlico Corporation Diaphragm isolation forming through subtractive etching
US7677109B2 (en) 2008-02-27 2010-03-16 Honeywell International Inc. Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die
WO2011003803A1 (en) * 2009-07-06 2011-01-13 Imec Method for forming mems variable capacitors
US8322225B2 (en) * 2009-07-10 2012-12-04 Honeywell International Inc. Sensor package assembly having an unconstrained sense die
JP5400708B2 (ja) * 2010-05-27 2014-01-29 オムロン株式会社 音響センサ、音響トランスデューサ、該音響トランスデューサを利用したマイクロフォン、および音響トランスデューサの製造方法
US8230743B2 (en) 2010-08-23 2012-07-31 Honeywell International Inc. Pressure sensor
JP5875244B2 (ja) 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5875243B2 (ja) 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
US9409763B2 (en) * 2012-04-04 2016-08-09 Infineon Technologies Ag MEMS device and method of making a MEMS device
DE102012205921A1 (de) * 2012-04-12 2013-10-17 Robert Bosch Gmbh Membrananordnung für einen mikro-elektromechanischen Messumformer und Verfahren zum Herstellen einer Membrananordnung
CN103011052A (zh) * 2012-12-21 2013-04-03 上海宏力半导体制造有限公司 Mems器件的牺牲层、mems器件及其制作方法
JP6127625B2 (ja) * 2013-03-19 2017-05-17 オムロン株式会社 静電容量型圧力センサ及び入力装置
CN104427456B (zh) * 2013-08-20 2017-12-05 无锡华润上华科技有限公司 一种减少微机电系统麦克风制作过程中产生的粘黏的方法
WO2015028311A1 (en) * 2013-08-26 2015-03-05 Koninklijke Philips N.V. Ultrasound transducer assembly and method for manufacturing an ultrasound transducer assembly
EP2871456B1 (en) 2013-11-06 2018-10-10 Invensense, Inc. Pressure sensor and method for manufacturing a pressure sensor
EP2871455B1 (en) 2013-11-06 2020-03-04 Invensense, Inc. Pressure sensor
JP6399803B2 (ja) 2014-05-14 2018-10-03 キヤノン株式会社 力覚センサおよび把持装置
EP3614115A1 (en) 2015-04-02 2020-02-26 InvenSense, Inc. Pressure sensor
KR101776725B1 (ko) * 2015-12-11 2017-09-08 현대자동차 주식회사 멤스 마이크로폰 및 그 제조방법
WO2017136719A1 (en) 2016-02-03 2017-08-10 Hutchinson Technology Incorporated Miniature pressure/force sensor with integrated leads
CN108886655B (zh) * 2016-03-22 2021-10-15 奥音科技（镇江）有限公司 声学装置振膜和声学装置
US9900707B1 (en) * 2016-11-29 2018-02-20 Cirrus Logic, Inc. Biasing of electromechanical systems microphone with alternating-current voltage waveform
US9813831B1 (en) 2016-11-29 2017-11-07 Cirrus Logic, Inc. Microelectromechanical systems microphone with electrostatic force feedback to measure sound pressure
CN110235453B (zh) 2016-12-09 2021-10-15 纽约州立大学研究基金会 纤维传声器
CN107337174B (zh) * 2017-06-27 2019-04-02 杭州电子科技大学 一种多晶硅振膜结构的制作方法
KR101995817B1 (ko) * 2017-07-18 2019-07-03 주식회사 하이딥 터치 입력 장치 제조 방법 및 터치 입력 장치
CN110366083B (zh) * 2018-04-11 2021-02-12 中芯国际集成电路制造(上海)有限公司 Mems器件及其制备方法
US11225409B2 (en) 2018-09-17 2022-01-18 Invensense, Inc. Sensor with integrated heater
EP3969868A1 (en) 2019-05-17 2022-03-23 InvenSense, Inc. A pressure sensor with improve hermeticity
JP7497800B2 (ja) 2020-07-08 2024-06-11 オー・エイチ・ティー株式会社 容量センサ及び容量センサの製造方法
WO2024103263A1 (zh) * 2022-11-15 2024-05-23 京东方科技集团股份有限公司 压力传感器及其制备方法、电子装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4236137A (en) * 1979-03-19 1980-11-25 Kulite Semiconductor Products, Inc. Semiconductor transducers employing flexure frames
US4467656A (en) * 1983-03-07 1984-08-28 Kulite Semiconductor Products, Inc. Transducer apparatus employing convoluted semiconductor diaphragms
US5177579A (en) * 1989-04-07 1993-01-05 Ic Sensors, Inc. Semiconductor transducer or actuator utilizing corrugated supports
US5189777A (en) * 1990-12-07 1993-03-02 Wisconsin Alumni Research Foundation Method of producing micromachined differential pressure transducers
DE69325732T2 (de) * 1992-03-18 2000-04-27 Knowles Electronics Inc Festkörper-Kondensatormikrofon
US5616514A (en) * 1993-06-03 1997-04-01 Robert Bosch Gmbh Method of fabricating a micromechanical sensor
US5452268A (en) * 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
US5578843A (en) * 1994-10-06 1996-11-26 Kavlico Corporation Semiconductor sensor with a fusion bonded flexible structure
US5573679A (en) * 1995-06-19 1996-11-12 Alberta Microelectronic Centre Fabrication of a surface micromachined capacitive microphone using a dry-etch process
JPH09257618A (ja) 1996-03-26 1997-10-03 Toyota Central Res & Dev Lab Inc 静電容量型圧力センサおよびその製造方法
US6472244B1 (en) * 1996-07-31 2002-10-29 Sgs-Thomson Microelectronics S.R.L. Manufacturing method and integrated microstructures of semiconductor material and integrated piezoresistive pressure sensor having a diaphragm of polycrystalline semiconductor material

Also Published As

Publication number Publication date
US6756248B2 (en) 2004-06-29
NO322331B1 (no) 2006-09-18
US6441451B1 (en) 2002-08-27
CN1247386A (zh) 2000-03-15
DE69934841D1 (de) 2007-03-08
EP0969694A2 (en) 2000-01-05
DE69934841T2 (de) 2007-10-11
EP0969694A3 (en) 2005-06-01
CN1145219C (zh) 2004-04-07
NO993213D0 (no) 1999-06-28
US20020093038A1 (en) 2002-07-18
EP0969694B1 (en) 2007-01-17
DK0969694T3 (da) 2007-05-14
JP2000022172A (ja) 2000-01-21

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