NO761573L - - Google Patents
Info
- Publication number
- NO761573L NO761573L NO761573A NO761573A NO761573L NO 761573 L NO761573 L NO 761573L NO 761573 A NO761573 A NO 761573A NO 761573 A NO761573 A NO 761573A NO 761573 L NO761573 L NO 761573L
- Authority
- NO
- Norway
- Prior art keywords
- cross
- insulation
- shielding
- conductive
- semi
- Prior art date
Links
- 238000009413 insulation Methods 0.000 claims description 41
- 239000000203 mixture Substances 0.000 claims description 41
- 229920003020 cross-linked polyethylene Polymers 0.000 claims description 25
- 239000004703 cross-linked polyethylene Substances 0.000 claims description 25
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 23
- 239000003431 cross linking reagent Substances 0.000 claims description 13
- 229920001577 copolymer Polymers 0.000 claims description 12
- 238000004132 cross linking Methods 0.000 claims description 12
- -1 t-butylperoxy Chemical group 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 11
- 229920005638 polyethylene monopolymer Polymers 0.000 claims description 10
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 8
- 229920000800 acrylic rubber Polymers 0.000 claims description 8
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 8
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 7
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 6
- NOSXUFXBUISMPR-UHFFFAOYSA-N 1-tert-butylperoxyhexane Chemical compound CCCCCCOOC(C)(C)C NOSXUFXBUISMPR-UHFFFAOYSA-N 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- 125000005907 alkyl ester group Chemical group 0.000 claims description 3
- FPAZNLSVMWRGQB-UHFFFAOYSA-N 1,2-bis(tert-butylperoxy)-3,4-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=C(OOC(C)(C)C)C(OOC(C)(C)C)=C1C(C)C FPAZNLSVMWRGQB-UHFFFAOYSA-N 0.000 claims 1
- 238000012216 screening Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 28
- 150000001875 compounds Chemical class 0.000 description 10
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 8
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000004698 Polyethylene Substances 0.000 description 7
- 229920000573 polyethylene Polymers 0.000 description 7
- 238000000576 coating method Methods 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- ZNRLMGFXSPUZNR-UHFFFAOYSA-N 2,2,4-trimethyl-1h-quinoline Chemical compound C1=CC=C2C(C)=CC(C)(C)NC2=C1 ZNRLMGFXSPUZNR-UHFFFAOYSA-N 0.000 description 2
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000009533 lab test Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000006277 sulfonation reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/447—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
Description
Oppfinnelsen angår vulkaniserbare halvledende sammensetninger av etylen-akylakrylat-kopolymere som danner avtrekkbare halvledende skjermings-sammensetninger på ledere isiert ved tverrbundet polyetylen. The invention relates to vulcanizable semi-conductive compositions of ethylene-acrylic acrylate copolymers which form removable semi-conductive shielding compositions on conductors iced by cross-linked polyethylene.
Oppbygging av isolerte elektriske ledere som ledninger og kabler beregnet for middels spenning til hoyspenning er kjent på området og omfatter vanligvis en kjerne-leder som består av én eller flere tråder av ledende metall eller leger-ing som kobber eller aluminium, et lag av halvlydende skjerming, et isolasjonslag av f.eks. tverrbundet polyetylen og et lag halvledende isolerende skjerming ovenpå isolasjonen. Construction of insulated electrical conductors such as wires and cables intended for medium voltage to high voltage is known in the field and usually comprises a core conductor consisting of one or more strands of conductive metal or alloy such as copper or aluminum, a layer of semi-sound shielding , an insulation layer of e.g. cross-linked polyethylene and a layer of semi-conductive insulating shielding on top of the insulation.
Flere noytrale tråder som vanligvis er av kobber eller aluminium kan innleires i eller vikles omkring laget av halvledende isolasjonsskjerming, om bnsket, i form av en konsentrisk ring omkring den isolerte kabel. Several neutral wires which are usually of copper or aluminum can be embedded in or wrapped around the layer of semi-conductive insulation shielding, if desired, in the form of a concentric ring around the insulated cable.
Isolasjonssjiktet og det overliggende halvleder-skjermingssjikt fremstilles vanligvis etter en metode som kalles tandem-ekstrudering hvorved disse lagene formes i rekke-folge ut fra tandemekstrudere og herdes samtidig i en enkelt operasjon for å redusere antall fremstillingstrinn. Imidlertid forer den samtidige herding av de to sjiktene ved varme og trykk til at sjiktene blander seg tilsynelatende i kontaktflaten og dannelse av tverrbindinger i denne kontaktflaten. Dette synes å være tilfelle selv ved den metoden som skal The insulating layer and the overlying semiconductor shielding layer are usually produced using a method called tandem extrusion, whereby these layers are formed in sequence from tandem extruders and hardened simultaneously in a single operation to reduce the number of manufacturing steps. However, the simultaneous hardening of the two layers by heat and pressure leads to the layers apparently mixing in the contact surface and the formation of cross-links in this contact surface. This seems to be the case even with the method that should
kalles totrinns hvor isolasjonen herdes i et forste trinn og det halvledende skjermingslaget derpå ekstruderes og herdes ovenpå isolasjonen. is called two-stage where the insulation is cured in a first step and the semi-conductive shielding layer is then extruded and cured on top of the insulation.
Dannelse av disse tverrbindinger mellom isolasjon og skjerming gjor senere atskillelse av de to lagene (Isolasjon og halvlederskjerming), hvilket forekommer ved skjoting eller endetilslutninger av ledninger og kabler, meget vanskelig og tidkrevende. En slik kraftig binding mellom lagene har også tendens til å gjore at det halvledende sjiktet etterlater en karbonrest på isolasjonen selv når laget trekkes av. Et halvleder-skjermingslag som lett og rent kan trekkes av fra isolasjonen på en isolert leder er derfor meget bnsket på området. Formation of these cross-links between insulation and shielding makes later separation of the two layers (Insulation and semiconductor shielding), which occurs when splicing or end connections of wires and cables, very difficult and time-consuming. Such a strong bond between the layers also tends to make the semi-conductive layer leave a carbon residue on the insulation even when the layer is pulled off. A semiconductor shielding layer that can be easily and cleanly removed from the insulation on an insulated conductor is therefore very much in demand in the area.
For å oppnå avtrekkbarhet mellom isolasjonssjiktet og det halvledende skjermingssjiktet har man hittil forsbkt flere fremgangsmåter med varierende hell, f.eks. sulfonering av isolasjonen eller belegging med slippmidler for påfbring av halvlederlaget. Andre metoder består i å bruke elastomere forbindelser som "Hypaåon" som basisharpiks for isolasjonssjiktet eller et halvledersjikt som beskrevet i U.S. patent nr. 3.719.769 og 3.769.085. In order to achieve removability between the insulating layer and the semi-conductive shielding layer, several methods have been tried so far with varying degrees of success, e.g. sulfonation of the insulation or coating with release agents for applying the semiconductor layer. Other methods consist of using elastomeric compounds such as "Hypaåon" as the base resin for the insulating layer or a semiconductor layer as described in U.S. Pat. Patent Nos. 3,719,769 and 3,769,085.
I foreliggende forbindelse defineres en lett avtrekkbar halvledende skjermingsbeskyttelse som et lag hvor adhesjonen mellom isolasjon og skjermingslag på en isolert elektrisk leder ikke er over 5,7 kg/cm. In the present context, an easily removable semi-conductive shielding protection is defined as a layer where the adhesion between insulation and shielding layer on an insulated electrical conductor is not more than 5.7 kg/cm.
Man har nå oppdaget at slike typer lett avtrekkbare halvleder-skjermings-masser for kombinasjon med tverrbundet polyetylenisolasjon kan lages av vulkaniserbare halvleder-skjermings-masser ifblge foreliggende oppfinnelse, som beskrives noyere i det folgende. It has now been discovered that such types of easily removable semiconductor shielding compounds for combination with cross-linked polyethylene insulation can be made from vulcanizable semiconductor shielding compounds according to the present invention, which is described in more detail below.
Det er således et trekk ved oppfinnelsen at det tilveiebringes et vulkaniserbart halvleder-skjermingslag som er særlig egnet som avtrekkbart lag i isolerte elektriske ledere, f.eks. ledninger og kabler, som inneholder som hovedisolasjon tverrbundet polyetylen^Det tilveiebringes således isolerte elektriske ledere som ledninger og kabler som er forsynt med, som hovedisolasjon, tverrbundet polyetylen og som skjermings-materiale for isolasjonen har et lag av lett avtrekkbart tverrbundet halvleder-preparat. It is thus a feature of the invention that a vulcanizable semiconductor shielding layer is provided which is particularly suitable as a removable layer in insulated electrical conductors, e.g. wires and cables, which contain as main insulation cross-linked polyethylene^There are thus provided insulated electrical conductors such as wires and cables which are provided with, as main insulation, cross-linked polyethylene and as shielding material for the insulation have a layer of easily removable cross-linked semiconductor preparation.
Mer spesielt kan foreliggende oppfinnelse beskrives som et avtrekkbart belegg av vulkaniserbar halvleder-skjer-mingssammensetning som på basis av blandingens totalvekt inneholder (A) ca.. 55 - 90 vektprosent etylen-alkylakrylat-kopolymer som inneholder fra ca. 27 - 45 vektprosent alkylakrylat basert på den kopolymeres totalvekt, og alkylakrylatet består av C-, til Cg alkylestere av akrylsyre eller metakrylsyre, (B) More particularly, the present invention can be described as a peelable coating of vulcanizable semiconductor shielding composition which, on the basis of the total weight of the mixture, contains (A) approx. 55 - 90 weight percent ethylene-alkyl acrylate copolymer containing from approx. 27 - 45 weight percent alkyl acrylate based on the total weight of the copolymer, and the alkyl acrylate consists of C-, to Cg alkyl esters of acrylic acid or methacrylic acid, (B)
ca. 10 - 45 vektprosent ledende sotsvart og (C) som tverrbindingsmiddel i sammensetningen fra 0,2 --5 vektprosent a,cc'-bis(t-butylperoksy)-diisopropylbenzen, 2,5-dimetyl-2',5'-di-(t-butylperoksy)-heksan, di-oc-cumyl-peroksyd, 2,5-dimetyl-2',5 di(t-butylperoksy)-hexin-3-, og blandinger av disse. about. 10 - 45 percent by weight conductive carbon black and (C) as a cross-linking agent in the composition from 0.2 to 5 percent by weight a,cc'-bis(t-butylperoxy)-diisopropylbenzene, 2,5-dimethyl-2',5'-di- (t-butylperoxy)-hexane, di-oc-cumyl-peroxide, 2,5-dimethyl-2',5-di(t-butylperoxy)-hexine-3-, and mixtures thereof.
Vulkaniserbare kopolymere av etylen-alkylakrylat samt fremgangsmåter for fremstilling av slike blandinger som kan brukes i henhold til oppfinnelsen er kjent på området. Man har imidlertid oppdaget at for fremstilling av en halvleder- Vulcanizable copolymers of ethylene-alkyl acrylate as well as methods for producing such mixtures which can be used according to the invention are known in the field. However, it has been discovered that for the production of a semiconductor
<->i <->i
skjerming som lett kan trekkes av fra det tverrbundne poly-etylenlaget er det viktig å benytte en etylen-alkylakrylat-kopolymer som ikke kan forenes med den tverrbundne. polyetylen-isolasjon. Denne uforenlighet betyr i denne forbindelsen at det ikke finnes fysikalskkjemisk binding eller affinitet mellom polyetylenet og etylen-alkylakrylatharpiksen under ekstrudering og herding. Uforenligheten gir en gjensidig frastot-ning mellom harpiksene som igjen hindrer blanding og bindings-dannelse mellom lagene. shielding that can be easily pulled off from the cross-linked polyethylene layer, it is important to use an ethylene-alkyl acrylate copolymer that cannot be combined with the cross-linked. polyethylene insulation. This incompatibility means in this connection that there is no physicochemical bond or affinity between the polyethylene and the ethylene alkyl acrylate resin during extrusion and curing. The incompatibility gives a mutual repulsion between the resins, which in turn prevents mixing and bond formation between the layers.
Om en spesiell vulkaniserbar halvledermasse vil ha Whether a special vulcanizable semiconductor compound will have
en slik uforenlighet og vil gi en elektrisk leder isolert med tverrbundet polyetylen som har lett avtrekkbar halvleder-skjerming kan finnes ved å måle adhesjonen mellom et laminat av tverrbundet polyetylen og det tverrbundne produkt av den vulkaniserbare halvledermasse, i henhold til ASTM-D903. For å godtas som lett avtrekkbar halvleder-skjerming må bindingskraften mellom halvlederblandingen og det tverrbundne polyetylen ikke overstige 5,7 kg/cm når kraften måles i henhold til den angitte forsbksmetode. such incompatibility and will provide an electrical conductor insulated with cross-linked polyethylene having easily peelable semiconductor shielding can be found by measuring the adhesion between a laminate of cross-linked polyethylene and the cross-linked product of the vulcanizable semiconductor compound, according to ASTM-D903. To be accepted as easily removable semiconductor shielding, the bonding force between the semiconductor mixture and the cross-linked polyethylene must not exceed 5.7 kg/cm when the force is measured according to the specified test method.
Således bor etylen-aåkylakrylat-kopolymere i denne forbindelse ha fra 27-45, og fortrinnsvis 29 - 35, vektprosent : alkyl akryl at basert på den kopolymeres totalvekt idet man antar at kopolymere med under 27 vektprosent alkylakrylat vil gi halvleder-skjermingslag som har for kraftig binding til isolasjonen av tverrbundet polyetylen mens kopolymere med over 45 vektprosent alkylakrylat kan gi for svak adhesjon til tverrbundet polyetylen. Mengden etylen-alkylakrylat-kopolymer som finnes i den vulkaniserbare halvleder-skjermingsmasse ifblge oppfinnelsen kan ligge på fra 55 - 90 vektprosent, og fortrinnsvis 60 - 75 vektprosent, basert på totalvekten av vulkaniserbar blanding. Thus, ethylene-alkyl acrylate copolymers in this connection should have from 27-45, and preferably 29 - 35, percent by weight: alkyl acrylic based on the copolymer's total weight, assuming that copolymers with less than 27 percent by weight alkyl acrylate will provide semiconductor shielding layers that have strong bond to the insulation of cross-linked polyethylene, while copolymers with more than 45% by weight alkyl acrylate can give too weak adhesion to cross-linked polyethylene. The amount of ethylene-alkyl acrylate copolymer contained in the vulcanizable semiconductor shielding compound according to the invention can be from 55 to 90 percent by weight, and preferably 60 to 75 percent by weight, based on the total weight of the vulcanizable mixture.
Slike etylen-alkylakrylat-kopolymere og/eller fremgangsmåter for deres fremstilling er vel kjent på området og omfatter kopolymere av etylen og C-^-Cg-alkylestere av akrylsyre eller metakrylsyre som metylakrylat, etylakrylat, metyl-metakrylat, butylmetakrylat, 2-etyl-heksylakrylat og lignende, og den mest foretrukne kopolymere er etylen-etylakrylat-kopolymer. Such ethylene-alkyl acrylate copolymers and/or methods for their preparation are well known in the field and include copolymers of ethylene and C-^-Cg alkyl esters of acrylic acid or methacrylic acid such as methyl acrylate, ethyl acrylate, methyl methacrylate, butyl methacrylate, 2-ethyl- hexyl acrylate and the like, and the most preferred copolymer is ethylene-ethyl acrylate copolymer.
Anvendelsen av ledende sotsvart i skjermings-halvledersjikt er vel kjent på området og alle typer ledende sotsvart i egnet form kan brukes inklusive roykkanalsot, olje-ovnssot eller acetylensot, forutsatt at soten er ledende. Mengden ledende sotsvart i den vulkaniserbare halvledermasse The use of conductive carbon black in a shielding semiconductor layer is well known in the field and all types of conductive carbon black in suitable form can be used including smoke duct black, oil furnace black or acetylene black, provided that the carbon black is conductive. The amount of conductive carbon black in the vulcanizable semiconductor compound
i henhold til foreliggende oppfinnelse kan ligge mellom ca. according to the present invention can lie between approx.
10 og 45 vektprosent, fortrinnsvis 30-40 vektprosent, basert på den vulkaniserbare sammensetningens totalvekt. 10 and 45 percent by weight, preferably 30-40 percent by weight, based on the total weight of the vulcanizable composition.
Tverrbindingsmidlene som benyttes til halvleder-blandinger i henhold til foreliggende oppfinnelse omfatter a, o^-bis-Ct-butylperoksyJ-diisopropylbenzen, ("Vulcup"), 2,5-dimetyl-2<1>,5<!->di(t-butylperoksy)-heksan ("Varox"), di-a-r-cumyl-peroksyd (Dicup), 2,5-dimetyl-2',5'-di(t-butylperoksy)-heksin-3, ("Lupersol-130^ og blandinger av disse. Selv om den foretrukne mengde tverrbindingsmiddel vil variere avhengig av den spesielle etylen-alkylakrylat-.kopolymer som brukes og andre slike åpenbare forhold, antar man generelt at mengden tverrbindingsmiddel normalt vil være 0,2 - 5 og fortrinnsvis 0,6 - 2 vektprosent, basert på totalvekten av den vulkaniserbare halvledende blanding. Mån vil naturligvis forstå at disse grense-områder eventuelt ikke vil være egnet for alle mulig halv-ledersammensetninger i henhold til foreliggende>oppfinnelse, The cross-linking agents used for semiconductor compositions according to the present invention comprise a,o^-bis-Ct-butylperoxyJ-diisopropylbenzene, ("Vulcup"), 2,5-dimethyl-2<1>,5<!->di( t-butylperoxy)-hexane ("Varox"), di-a-r-cumyl-peroxide (Dicup), 2,5-dimethyl-2',5'-di(t-butylperoxy)-hexine-3, ("Lupersol- 130^ and mixtures thereof. Although the preferred amount of crosslinking agent will vary depending on the particular ethylene alkyl acrylate copolymer used and other such obvious factors, it is generally assumed that the amount of crosslinking agent will normally be 0.2 - 5 and preferably 0 .6 - 2 percent by weight, based on the total weight of the vulcanizable semi-conducting mixture. It will of course be understood that these limit ranges will not possibly be suitable for all possible semi-conductor compositions according to the present invention.
og at for en bestemt vulkaniserbar halvlederblanding vil an-vendelse av tverrbingingsmidler som gir et tverrbundet halv-lederprodukt med adhesjonskraft på over 5,7 kg/cm målt som de-finert ovenfor, til tverrbundet polyetylen, ikke være egnet, og at de aktuelle mengder da må bestemmes ved rutineeksperimenter. and that for a specific vulcanizable semiconductor mixture, the use of cross-linking agents that give a cross-linked semiconductor product with an adhesion force of more than 5.7 kg/cm measured as defined above, to cross-linked polyethylene, will not be suitable, and that the quantities in question then must be determined by routine experiments.
ledere ifblge oppfinnelsen kan også fremstilles på vanlig måte ved f.eks. tandem-ekstrudering hvorved isolasjonslaget ekstruderes over lederen som på forhånd er belagit med et vanlig ekstrudert halvleder-skjermingsskjold fulgt av det vulkaniserbare sjiktet hvorpå isolasjons-- og skjermings-sjiktet herdes (tverrbindes) samtidig under trykk. En annen vanlig metode består i å herde isolasjonssjiktet for kontakt med den vulkaniserbare halvleder-skjermingsmassen som derpå selv herdes mens sjiktet er i kontakt under trykk med nevnte herdede isolasjonssjikt. Det antas å være gunstig å hindre enhver for-blanding av isolasjons-massen og den vulkaniserbare halvleder^skjermingsmasse for blandingene herdes siden eventuell slik blanding vil kunne gjore at tverrbindingsmidlet påvirker.adhesjonen mellom de to lagene ved innbyrdes tverrbinding mellom overflatene på de to sjikt. Andre spesielle sider ved isolerte elektriske ledere ifblge foreliggende oppfinnelse kan også være som for vanlige isolerte elektriske ledere og er ikke avgjorende i det de for storstedelen avhenger av onsket bruksområde for produktet. conductors according to the invention can also be produced in the usual way by e.g. tandem extrusion whereby the insulating layer is extruded over the conductor which is previously coated with a conventional extruded semiconductor shield followed by the vulcanizable layer whereon the insulating and shielding layers are cured (cross-linked) simultaneously under pressure. Another common method consists in hardening the insulating layer for contact with the vulcanizable semiconductor shielding mass which is then itself hardened while the layer is in contact under pressure with said hardened insulating layer. It is believed to be beneficial to prevent any pre-mixing of the insulating compound and the vulcanizable semiconductor shielding compound before the mixtures are cured, since any such mixture could cause the cross-linking agent to affect the adhesion between the two layers by mutual cross-linking between the surfaces of the two layers. Other special aspects of insulated electrical conductors according to the present invention may also be the same as for ordinary insulated electrical conductors and are not decisive in that they largely depend on the desired area of use for the product.
De isolerte elektriske ledere ifblge foreliggende oppfinnelse er enestående på.grunn av at den tverrbudne isolasjons-skjermingsmasse lett og rent kan trekkes av, vanligvis i ett stykke, fra tverrbundet polyetylen-isolasjon. The insulated electrical conductors according to the present invention are unique in that the cross-linked insulation-shielding compound can be easily and cleanly pulled off, usually in one piece, from the cross-linked polyethylene insulation.
De fblgende eksempler illustrerer oppfinnelsen. Alle mengdeangivelser, prosentforhold og relative forhold som an-fbres er på vektbasis hvor intet annet er angitt. The following examples illustrate the invention. All quantities, percentages and relative ratios given are on a weight basis where nothing else is stated.
ÉEA = etylen-etylakrylat-kopolymer ÉEA = ethylene-ethyl acrylate copolymer
EA = vektprosent etylakrylat i den kopolymere EA = weight percent ethyl acrylate in the copolymer
MI = smelteindeks MI = melting index
"Dicup" = di-cc-cumyl-peroksyd "Lupersol-130" = 2,5-dimetyl-2,!5 '-di(t-butylperoksy)-heksin-3 "Dicup" = di-cc-cumyl peroxide "Lupersol-130" = 2,5-dimethyl-2,15'-di(t-butylperoxy)-hexine-3
"Vulcup" = cc,a'-bis-(t-butylperoksy)-diisopropyl-benzen "Vulcup" = cc,α'-bis-(t-butylperoxy)-diisopropylbenzene
"Varox" = 2,5-dimetyl-2',5,-di(t-butylperoksy)-heksan "Varox" = 2,5-dimethyl-2',5,-di(t-butylperoxy)-hexane
Eksempel 1- 5 Example 1-5
Man fremstilte en ærie vulkaniserbare halvleder- An array of vulcanizable semiconductors was produced
1 1
sammensetninger hvor vektprosenten etylakrylat i den kopolymere etylen-etylakrylat ble variert i likhet med type tverrbindingsmiddel. Bestanddelene i hver sammensetning er oppfort i tabell I og blandingene inneholdt i tillegg til de anfbrte bestanddeler 40 vektprosent ledende sotsvart og 0,4 vektprosent polymerisert 1,2-dihydro-2,2,4-trimetylkinolin, et antioksydasjonsmiddel, hvor mengdene av alle bestanddeler i sammensetningene er basert på totalvekten hvis intet annet er angitt. compositions where the weight percentage of ethyl acrylate in the copolymer ethylene-ethyl acrylate was varied in the same way as the type of cross-linking agent. The ingredients in each composition are listed in Table I and the mixtures contained, in addition to the listed ingredients, 40% by weight of conductive carbon black and 0.4% by weight of polymerized 1,2-dihydro-2,2,4-trimethylquinoline, an antioxidant, where the amounts of all ingredients in the compositions are based on the total weight if nothing else is stated.
Sammenseiringene ble fremstilt ved jevn blanding av bestanddelene i en laboratoriemblle av Banbury-typen og ca. 1300 g av hver blanding ble bearbeidet. The compositions were prepared by evenly mixing the ingredients in a Banbury-type laboratory flask and approx. 1300 g of each mixture was processed.
For å kunne bedbmme avtrekkbarhets-egenskapene hos polymersammensetningene som halvledende isolasjonsskjerming, ble hver sammensetning brukt for fremstilling av et polyetylen/- etylen-etylakrylat-laminat. Disse laminater ble laget fra laboratorie-forsbksplater hvor polyetylenplaten i alle tilfeller ble fremstilt fra en tverrbundet polyetylen-homopolymer som inneholdt polyetylen-homopolymer (98%), di-a-cumyl-peroksyd (2:%) og bis-(2-metyl-5-t-butyl-4-hydroksyfenyl)-sulfid (0,2%) som antioksydasjonsmiddel. In order to assess the peelability properties of the polymer compositions as semi-conductive insulation shielding, each composition was used to produce a polyethylene/ethylene-ethyl acrylate laminate. These laminates were made from laboratory test plates where the polyethylene plate was in all cases made from a cross-linked polyethylene homopolymer containing polyethylene homopolymer (98%), di-a-cumyl peroxide (2:%) and bis-(2-methyl -5-t-butyl-4-hydroxyphenyl)-sulphide (0.2%) as antioxidant.
I eksempel 1-5 fremstilte man polyetylen/etylen-etylakrylat-laminatene ved forst å utstbpe"polyetylenplaten (med målene 20 x 20 cm x 6,3 mm i tykkelse) ved 175°C i 5 minutter og tverrbinde denne, derpå ble de vulkaniserbare etylen-etylakrylatplatene stbpt separat med målene 20 x 20 cm x 3,2 mm i tykkelse, men ikke tverrbundet, og det ble fremstilt laminater av disse platene ved å presse en vulkaniserbar etylen-etylakrylatplate med en tverrbundet polyetylenplate ved 200°C og 14 kg/cm 2trykk i 20 minutter hvorunder de vulkaniserbare etylen-etylakrylatblandingene ble tverrbundet. In examples 1-5, the polyethylene/ethylene-ethyl acrylate laminates were produced by first extruding the polyethylene sheet (with dimensions 20 x 20 cm x 6.3 mm in thickness) at 175°C for 5 minutes and cross-linking this, then the vulcanizable the ethylene-ethyl acrylate sheets were separately stamped with dimensions of 20 x 20 cm x 3.2 mm in thickness but not cross-linked, and laminates were made from these sheets by pressing a vulcanizable ethylene-ethyl acrylate sheet with a cross-linked polyethylene sheet at 200°C and 14 kg /cm 2 pressure for 20 minutes during which the vulcanizable ethylene-ethyl acrylate mixtures were cross-linked.
Bindingskraften eller adhesjonen mellom forsbks-laminatene (skåret i strimler på 20 x 2,5 cm) ble derpå målt i henhold til ASTM metode D903 som måler avtrekksstyrken mellom to plater av laminatet uttrykt i kg pr. cm strimmel og som benyttes her som et mål på avtrekksevnen for et halvledende belegg av etylen-etylakrylat-skjerming på en isolasjon av tverrbundet polyetylen. Forsbksresultatene for hver laminat av polyetylen/etylen-etylakrylat-skjerming fremstilt som ovenfor er også oppfort i tabell I. The bond force or adhesion between the forsbks laminates (cut into strips of 20 x 2.5 cm) was then measured according to ASTM method D903 which measures the pull-off strength between two sheets of the laminate expressed in kg per cm strip and which is used here as a measure of the pull-off capability for a semi-conductive coating of ethylene-ethyl acrylate shielding on an insulation of cross-linked polyethylene. The test results for each laminate of polyethylene/ethylene-ethyl acrylate shielding prepared as above are also listed in Table I.
Eksemplene 2-5 som representerer oppfinnelsen viser den fremragende avtrekksevne for isolasjons-skjermings-blandinger idet skjermingsbeleggene i alle tilfeller er truk-ket fra isolasjonen helt rent og i ett stykke. Examples 2-5 which represent the invention show the excellent pull-off capability for insulation-shielding mixtures, as the shielding coatings are in all cases pulled from the insulation completely cleanly and in one piece.
Det kan tenkes forskjellige modifikasjonser av den foreliggende oppfinnelse for fagfolk på området, men slike omfattes av oppfinnelsen innenfor dens ramme og idé... Different modifications of the present invention can be imagined for professionals in the field, but such are covered by the invention within its scope and idea...
Claims (20)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US57519275A | 1975-05-07 | 1975-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO761573L true NO761573L (en) | 1976-11-09 |
Family
ID=24299307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO761573A NO761573L (en) | 1975-05-07 | 1976-05-06 |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS51138893A (en) |
| AU (1) | AU1359976A (en) |
| BE (1) | BE841519A (en) |
| DE (1) | DE2620079A1 (en) |
| FR (1) | FR2310617A1 (en) |
| NO (1) | NO761573L (en) |
| SE (1) | SE7605206L (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5632545A (en) * | 1979-08-27 | 1981-04-02 | Mitsubishi Rayon Co Ltd | Electrically-conductive and antistatic resin composition |
| US4351926A (en) * | 1979-12-26 | 1982-09-28 | Union Carbide Corporation | Heat curable polymer |
| SE515111C2 (en) | 1998-10-23 | 2001-06-11 | Borealis As | Electronic cable and methods for making them |
| FR2937041B1 (en) * | 2008-10-09 | 2012-07-20 | Arkema France | SEMICONDUCTOR COMPOSITION FOR ELECTRIC CABLES |
-
1976
- 1976-05-04 AU AU13599/76A patent/AU1359976A/en not_active Expired
- 1976-05-06 BE BE166781A patent/BE841519A/en unknown
- 1976-05-06 SE SE7605206A patent/SE7605206L/en unknown
- 1976-05-06 FR FR7613581A patent/FR2310617A1/en active Granted
- 1976-05-06 NO NO761573A patent/NO761573L/no unknown
- 1976-05-06 DE DE19762620079 patent/DE2620079A1/en active Pending
- 1976-05-06 JP JP51050972A patent/JPS51138893A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2620079A1 (en) | 1976-11-18 |
| SE7605206L (en) | 1976-11-08 |
| FR2310617B3 (en) | 1979-07-13 |
| JPS51138893A (en) | 1976-11-30 |
| FR2310617A1 (en) | 1976-12-03 |
| BE841519A (en) | 1976-11-08 |
| AU1359976A (en) | 1977-11-10 |
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