NO348036B1 - Stud system to minimize thermal bridges in an external wall with hard insulation, insulation board and stud profile - Google Patents

Description

TECHNICAL AREA

The present invention relates to a stud system to minimize thermal bridges in external walls and enable the use of hard insulation.

STATE OF THE ART

In the known technique, almost exclusively wooden or steel studs are used in the construction of light exterior walls. Studs function both as trusses for the insulation, but also give the wall stability to withstand, among other things, wind loads. In the spaces formed between the studs, insulation is placed to achieve the desired degree of insulation in the wall.

Insulation is installed in the wall to provide good comfort in the building and meet the energy requirements that are set. The amount of insulation required to achieve a degree of insulation depends on the properties of the insulation material and the thickness of the insulation. Within the subject, the terms thermal conductivity (λ-value), thermal resistance (R-value) and heat transmission coefficient (U-value) are often used. The thermal conductivity, or lambda value, describes the material's ability to conduct heat through a surface. The lambda value is the heat flow through a 1 m <3 >uniform 1 x 1 x 1 meter body where the temperature difference between two of the sides is 1 Kelvin.

The lambda value is the number of watts that pass through the body.

Thermal resistance (the R-value) is calculated by dividing the material's thickness by the lambda value. R=d/lambda. (m<2>*K)/W ;;The value usually used for insulation is the U-value, which describes the heat transfer. The U-value is the inverse of the R-value and thus describes the actual heat transfer in a building element. The U-value is often specified for the entire building, but can also be specified for specific building elements, for example a window or a wall structure. The U value is measured in the unit watt per square meter and kelvin (W/m<2>*K). A lower U-value means higher resistance to heat transfer and thus more effective insulation.

For a wall construction, in addition to material properties and insulation thickness, thermal bridges are also relevant for the total U-value. A cold bridge is a part of a structure that has poorer insulation properties than the remaining part and thus allows cold to be transferred through the wall structure. Through a thermal bridge, heat travels from the warm side of the wall to the cold side. When using steel studs, air gaps are easily formed in the vicinity of the studs and especially in direct connection to the steel studs. These air gaps contribute to reducing the degree of insulation in the wall as a whole.

The problem of thermal bridges is particularly widespread in the construction of lightweight walls. It is not uncommon for steel studs to be used, which contributes to increased thermal bridges as steel conducts heat better than, for example, wood. This has meant that when the requirements for insulation value increase, the walls have become increasingly thicker to meet the new requirements.

Thicker walls mean an increased number of stud dimensions and a greater loss of area in relation to the building's total size.

SUMMARY

It would therefore have been advantageous to have a stud system that minimizes the above disadvantages by minimizing thermal bridges, improving the insulation value and standardizing the thickness of the studs. It would also have been advantageous to have a modular system that enables different heights with the same stud construction.

High performance insulation, such as PIR, PUR and similar products, have improved the material's insulation value in relation to thickness. This means that the ability to insulate walls but still keep them relatively thin has improved. However, as insulation improves, the relative impact of thermal bridges and their impact on a wall's overall U-value increases. A person skilled in the art will understand that what is referred to here as high-performance insulation is often also called hard insulation. The words are therefore used here interchangeably.

To understand the impact, it can be mentioned as an example that steel has a lambda value of approx. 50, three approx. 0.14 and mineral wool 0.037. This means that when steel studs are used, thermal bridges easily occur.

In general, thicker walls provide better insulation values than thinner walls. The thickness and construction of the walls can also be affected by the strength values needed to withstand loads that occur, such as wind and snow loads.

It is also common that the thickness of the studs can vary due to the height of the walls, as the studs' dimension must be increased to withstand the load in high walls. One problem is that steel posts and post works where steel posts are used conduct heat better than wooden posts. Thermal bridges occur when heat and cold can be transported through the wall.

In the prior art, it is still common to use steel studs because it entails other advantages. The uprights are often set up with perforated and folded spacers in steel to create strength. This creates air gaps, which in themselves constitute a cold bridge and reduce the degree of insulation. Furthermore, this makes it more difficult or impossible to use hard insulation in any effective way. The disadvantage of folded, bent or bent spacers in combination with hard insulation is that air gaps are formed.

The present invention relates to a stud system to minimize thermal bridges in the outer walls of buildings without weakening the construction against loads that occur. This purpose is achieved by replacing continuous studs with elongated stud profiles that are arranged in engagement with spacing devices and hard insulation. Thus, the stud system can comprise a stud arrangement, an insulation plate intended to be arranged in said stud arrangement as well as a stud profile intended to be arranged in said stud arrangement.

It is also a goal of the present invention to minimize thermal bridges in external walls without weakening the construction against loads that occur.

It is an aim of the present invention to enable the use of hard insulation to reduce thermal bridges.

It is an aim of the present invention to enable the use of thinner steel thickness in the uprights.

It is a goal of the present invention that the same studs should be able to be used regardless of the height of the wall and requirements for insulation value.

It is a further aim of the present invention to utilize properties of hard insulation to optimize studs.

The solution therefore concerns, according to a first aspect, a stud arrangement consisting of two elongated stud profiles intended to be arranged in pairs opposite each other in a wall, where the arrangement comprises a spacing device which is adapted to connect the stud profiles to each other. The stud profiles comprise protrusions which are adapted to engage with recesses in an insulation board. The distance device is arranged so that its entire material extent between the stud profiles rests against the insulation board to minimize air gaps.

According to one embodiment of the stud arrangement, the spacer device is arranged so that it rests against the insulation plate between the stud profiles to minimize air gaps.

It is an advantage of the solution that the spacer device is arranged to rest against the insulation board so that no air gaps are created. The insulation board runs along the entire room inside the wall, with the exception of any recesses in the spacer device.

According to one embodiment, the spacer device comprises at least one tab which is adapted to be arranged in engagement with the insulating plate.

It is an advantage of the solution that a tab on the spacer device can be arranged in engagement with the insulation plate. A tab may, for example, be a bent part of the spacer device. The tab can be arranged either in engagement with a recess in the insulation board or can alternatively be pressed into the board. In one embodiment, the tab can be made of a thin steel plate so that it can cut into the insulation plate. However, it should be noted that the tab can also be made of other materials.

According to one embodiment, the stud arrangement comprises two elongated stud profiles which are adapted to be arranged in pairs opposite each other in a wall. In such an embodiment, the arrangement comprises a spacer device which is arranged so that the stud profiles are connected to each other, where the spacer device consists of a flat steel plate which is adapted to be arranged perpendicular to a first surface of the stud profiles, and where the stud profiles comprise protrusions which are adapted to be arranged in engagement with recesses in an insulation board.

It is an advantage of the stud arrangement that the distance device consists of a flat steel plate. It minimizes the thermal bridge by minimizing the amount of material that extends through the wall in the transverse direction.

Minimization of thermal bridges can also be achieved when the spacer device comprises tabs which are arranged to engage with an insulating plate. The tabs then go into the insulation plate and the insulation plate rests against the spacer device, thereby minimizing the air gaps that would otherwise have been formed.

It is a further advantage of the stud arrangement that the spacing device can be designed so that there is even less material extending through the wall. This is achieved, for example, by designing the spacer device with several transverse struts [in the spacer device] which provides a robust construction without the spacer device consisting of more material than necessary.

According to one embodiment of the strut arrangement, the protrusions extend from the first surface towards the opposite strut profile when the strut profiles are in the mounted position.

According to one embodiment of the strut arrangement, the first surface is made up of a flat steel plate which extends between the two protrusions.

According to one embodiment of the stud arrangement, the first surface lies in a common plane with an outer and an inner wall.

According to one embodiment of the strut arrangement, the strut profiles are made up of a steel plate and the two projections are bent parts of the steel plate.

By producing the stud profiles in accordance with the above-mentioned embodiment, a simple construction is achieved which simplifies production and reduces costs. It is an advantage of the stud arrangement that the arrangement in engagement with an insulation board provides good strength but is still advantageous from a production perspective.

According to one embodiment of the stud arrangement, the protrusions on the stud profiles are adapted to be enclosed on three sides by an insulation plate per protrusion. The protrusions on each of the opposite stud profiles are adapted to be received in two recesses in the insulation plate which encloses the protrusion on three sides of the protrusion.

It is an advantage of the solution that the insulation board is enclosed by the protrusions on the stud profiles. This means that the whole looks like a unit with minimal air gaps between the insulation and stud profiles. Furthermore, the insulation material rests against the entire part of the stud profile that faces into the wall, which means that thermal bridges are minimized. Furthermore, this also means that the amount of insulation at the narrowest point in the wall increases, which contributes to improved insulation.

According to one embodiment of the stud arrangement, the insulation board is a self-supporting insulation board.

It is an advantage of the stud arrangement that it is adapted to be arranged with a self-supporting insulation board.

Another advantage of the stud arrangement is that the insulation board contributes to the strength of the wall.

According to one embodiment, the insulation plate engages with a projection in each stud profile and thereby reinforces the stud arrangement.

By arranging the insulation board in engagement with protrusions in each stud profile, stabilization of the wall is made possible. This in turn means that the dimensions of the stud profiles can be reduced as the insulation board contributes to the strength and the load-bearing construction.

According to one embodiment of the stud arrangement, the stud profiles have a U-shape.

According to one embodiment of the stud arrangement, the stud profiles have a substantially U-shaped cross-section.

According to one embodiment of the stud arrangement, each of the two elongated stud profiles comprises a second surface which is parallel to the first surface and is adapted to receive a wall plate.

According to one embodiment of the stud arrangement, the stud profiles and the spacer device are made of steel plate with homogeneous plate thickness.

According to one embodiment, the plate thickness is 1.5 mm or less.

According to one embodiment, the plate thickness is 1.25 mm or less.

According to one embodiment of the stud arrangement, the stud profiles are arranged between a roof rail and a floor rail.

According to one embodiment of the stud arrangement, the spacer device includes at least one recess which is designed to reduce the thermal conductivity of the spacer device.

According to one embodiment of the stud arrangement, the stud profiles are adapted to receive several spacers.

According to one embodiment of the stud arrangement, the spacer device has flanges which are adapted to be received in openings in the stud profiles.

According to one embodiment of the stud arrangement, the flanges are adapted to be bent in order to attach the spacer device to the stud profiles.

An advantage of the stud arrangement is that the flanges enable easy assembly.

It is an advantage of the stud arrangement that the flanges enable the spacer device to be attached to the stud profiles without additional fastening elements.

There is an advantage in that the fixing of the distance devices can be done from the outside of the stud arrangement, i.e. from the side where the insulation does not abut against the stud profile. This means that hard insulation can be used. When using soft insulation, the stud arrangement can be fitted before the insulation is placed in the wall as it is soft. This is not possible with hard insulation, where the insulation must instead be put in place before the second stud profile is attached to the spacer device.

According to one embodiment, the spacer device is attached to a stud profile by means of an engagement which extends through the stud profile.

It is an advantage that when the spacer device is attached to a stud profile by means of an engagement that extends through the stud profile or with a continuous attachment, then the spacer device can thus be attached after the stud profile has been mounted to the stud arrangement. This means that hard insulation can be used.

The intervention that extends through the stud profile can, for example, be fastening elements, flanges or another type of intervention that can be attached from the outside of the wall.

According to one embodiment of the stud arrangement, the number of spacers is determined by the strength of the stud arrangement.

It is an advantage of the stud arrangement that the number of spacers can be changed based on the height of the wall. For a high wall, better strength is required, which can be achieved with the solution by installing several spacers along the length of the stud profiles. This provides improved strength and means that stud profiles of the same dimensions can be used for many different wall heights.

Furthermore, according to a second aspect, the solution relates to an insulating plate which is intended to be arranged in the above-mentioned stud arrangement, where the insulating plate comprises a recess which is to receive a projection on a stud profile, and where the insulating plate is adapted to rest against a spacer device in the stud arrangement.

Furthermore, according to a third aspect, the solution relates to a stud profile intended to be arranged in the above-mentioned stud arrangement, where the stud profile includes recesses which are adapted to be arranged in engagement with recesses in an insulation board.

BRIEF DESCRIPTION OF THE FIGURES

The invention must now be described with examples with reference to the attached drawings, where:

Fig. 1 is a top view of a cross-section of a wall comprising a stud arrangement according to embodiments described herein.

Fig. 2 shows a distance device intended to be arranged in stud profiles in a stud arrangement according to embodiments described herein.

Fig. 3 is a side view of a cross-section of a wall comprising a stud arrangement according to embodiments described herein.

Fig. 4 is a front view of stud profiles according to embodiments described herein.

Fig. 5 is a view from above of a cross-section of a wall comprising a stud arrangement and insulation board according to embodiments described herein.

Fig. 6a shows an embodiment of the cross-section A-A' where two tabs extend in the same direction.

Fig. 6b shows an embodiment of the cross-section A-A' where two tabs extend in opposite directions.

DETAILED DESCRIPTION

The references in the detailed description of embodiments below refer to the attached figures. Please note that the figures are intended solely as illustrations and should not be considered to limit the scope of protection.

Figure 1 shows a cross-section of a wall comprising a stud arrangement according to embodiments described herein.

Examples of stud profiles 2 and how the spacer device 3 can be placed in relation to the stud profiles 2 are illustrated. The elongated stud profiles 2 can be placed upright with the center at different distances along the wall depending on insulation, overlying boards and/or desired strength. According to fig. 1, the stud profiles 2 are designed with a mainly u-profile or u-shape, but the example should not be considered limiting, as several other similar designs of the stud profiles 2 are also possible. The stud profiles 2 can, for example, consist of a flat steel plate or another material. For example, in one embodiment, the stud profiles can be made of a composite material or a polymer. Here it should be stated that the expression "plane" does not imply that the plate must be of uniform thickness, but that it can also have different thicknesses at different ends. It should also be stated that the steel plate can of course have minor deviations in the plane and still be covered by what is meant here by plane.

The stud profiles 2 are adapted to be arranged in pairs opposite each other in a wall. The wall can consist of an outer wall 10 and an inner wall 11. Each of the stud profiles 2 can comprise a first surface 8 and a second surface 9. The first surface 8 of the stud profiles 2 can be arranged to perpendicularly receive one or more distance devices 3. the second surface 9 of the stud profiles 2, which is parallel to the first surface 8 of the stud profiles 2, can be adapted to receive a wall plate so that an outer wall and an inner wall are formed respectively. Between the stud profiles 2 and the spacers 3 in fig. 1, insulation can be installed in the form of an insulation board.

The stud profiles 2 also comprise protrusions 2a, 2b which are adapted to engage with recesses in an insulation board. This is described and shown in more detail in relation to fig. 5 below. The projections 2a, 2b can be arranged to extend from the first surface 8 of one of the stud profiles 2 towards the first surface 8 of the opposite stud profile 2 when both stud profiles 2 are in the mounted position. The first surface 8 of the stud profiles 2 can be made up of a flat steel plate or the like which extends between the two projections 2a, 2b in a common plane with an outer wall 10 and an inner wall 11 respectively. The first surface can also be made up of a flat surface of another material, for example composite or a polymer. In those cases where the upright profiles 2 are made up of a steel plate, the two projections 2a, 2b can be bent parts of the same steel plate.

Figure 2 shows a spacer device 3 intended to be arranged in a stud arrangement as well as stud profiles 2 according to embodiments described herein.

A spacer device 3 is adapted to connect the stud profiles 2 to each other. The spacer device 3 can be made of a flat steel plate which is adapted to be arranged perpendicular to a first surface 8 of the stud profiles 2. The stud profiles 2 and the spacer device 3 can be made of steel plate with homogeneous plate thickness. The plate thickness is preferably 1.5 mm or less. However, it should be stated that thicker plate thicknesses can be used when installing at or around windows and doors.

The spacer device 3 can also display at least one recess which is designed to reduce the thermal conductivity of the spacer device 3. For example, the design of the spacer device 3 can include a cross part 6 in order to be able to withstand loads that occur, as well as forming as small a thermal bridge as possible. In other words, the spacer device 3 according to Figure 2 is designed to maximize the strength of the wall and at the same time minimize the thermal bridge that occurs. This is thus achieved by constructing recesses in the spacer device 3 in order to minimize the continuous amount of material in the wall. When designing the spacer device 3, for example by the recesses in one embodiment forming a cross 6 in the spacer device 3, maximum strength is achieved. Furthermore, it should be stated that by not connecting the stud profiles 2 other than through only the spacers 3, a very small thermal bridge is formed.

The spacers 3 are also designed to enable rational assembly in the standing upright profiles 2.

Furthermore, the spacer device 3 can be arranged with flanges 5 which are adapted to be received in holes or openings 7 in the stud profiles 2. In certain embodiments, the flanges can be adapted to bend in order to attach the spacer device 3 to the stud profiles 2.

Figure 3 is a side view of a cut-through of a wall comprising a stud arrangement and stud profiles according to embodiments described herein.

Figure 3 illustrates how one or more spacers 3 can be placed vertically between the stud profiles 2. Here it can be stated that the number of spacers 3 used to connect the stud profiles 2 can be determined based on the strength the stud arrangement requires. Furthermore, it can also be mentioned that the location and number of distance devices 3 can also depend on the height of the wall. A higher wall with longer stud profiles 2 can advantageously have several distance devices 3.

Furthermore, figure 3 also shows how flanges 5 on the spacer devices can be passed through the hole roofs or openings 7 in the stud profiles 2 and then bent to attach the spacer devices 3 to the stud profiles 2. Figure 3 also shows how the stud profiles 2 can be anchored, for example, in a roof rail 1a and a floor rail 1b.

Figure 4 shows an outline of the upright profiles 2 according to the embodiments described herein. An example is shown here of how the stud profiles 2 can advantageously be arranged with holes or openings 7 which are adapted to receive the flanges 5 on an appropriate number of spacer devices 3.

Figure 5 is a view from above of a cross-section of a wall comprising a stud arrangement and insulation board according to embodiments described herein. The insulating plate 12 comprises recesses which are to receive protrusions 2a, 2b on the stud profiles 2. The insulating plate 12 is further adapted to rest against at least one spacer device 3. This means that when the insulating plate 12 is mounted so that the recesses in the insulating plate 12 have received the protrusions 2a, 2b on the stud profiles 2, the insulation plate 12 rests mainly against one or more spacer devices 3 mounted between the stud profiles 2. It should be noted that as the insulation plate 12 engages via the recesses and includes the protrusions 2a, 2b on three sides of the stud profiles 2 as shown in figure 3, the stud arrangement is reinforced.

The insulation plate 12 can, for example, consist of a high-performance insulation, for example PIR insulation. The insulation plate 12 should preferably consist of a rigid and hard insulation which preferably has a lambda value below 0.025. The insulating plate 12 can preferably also be a self-supporting insulating plate.

It should be stated that the stud arrangement and the insulation plate 12 after assembly constitute a stable construction in the form of solid, torsionally rigid wall parts with good U-values.

By adding one or more spacer devices, such as the above spacer device 3, between two stud profiles that are opposite each other, such as the above stud profiles 2, a stable anchoring is created between the separated stud profiles and thus a stable stud arrangement. This stud arrangement arranged together with a self-supporting insulation board, such as the above insulation board 12, thus together form a cohesive wall which is arranged to withstand loads that arise and affect the finished wall.

By enabling the use of standardised, similar profile types as wall studs, regardless of wall thickness and energy requirements, the stud arrangement further entails significant production advantages and cost savings for the overall wall construction.

It should also be stated that because a wall construction with the above stud arrangement does not have continuous standing wall studs, a so-called hard insulation can be advantageously used in the construction. This is usually not possible with traditional studs for wall panels due to their shape.

Another advantage of the stud arrangement is that stud profiles of the same type and with the same dimensions can be used for all different wall heights, simply by using several spacing devices.

Figure 6a shows an embodiment of the spacer device 3 as shown with cross section A-A' according to Figure 2. Cross section A-A' shows the profile of the spacer device 3, and in this embodiment the spacer device 3 comprises a first tab 3a and a second tab 3b. The first 3a and the second 3b tab extend in the same direction and are adapted to engage with an insulating plate. The material thickness of the spacer device 3 is thin, as described herein, and the tabs 3a, 3b can therefore cut into the insulation board. In another embodiment, the insulating plate is adapted through recesses to receive the tabs 3a, 3b. As the tabs 3a, 3b engage with the insulating plate, the arrangement becomes more stable while allowing the insulating plate to rest against the entire spacer device 3, which minimizes air gaps and thermal bridges.

Figure 6b shows another embodiment of the spacer device 3 as shown with cross section A-A' according to Figure 2. In one embodiment, the first tab 3a and the second tab 3b extend in different directions. This means that the first tab 3a is adapted to engage with an insulating plate on one side of the spacer device 3 while the second tab 3b is adapted to engage with another insulating plate arranged on the other side of the spacer device 3.

Claims (19)

PATENT CLAIMS 1. Stud arrangement comprising two elongated stud profiles (2) which are to be arranged in pairs opposite each other in a wall, where the arrangement comprises a spacer device (3) to connect the stud profiles (2) to each other, characterized in that the stud profiles (2) comprise projections (2a, 2b) which are arranged in engagement with recesses in a hard insulation plate, and in that the spacer device (3) consists of a flat steel plate arranged so that it rests against the hard insulation plate between the stud profiles. 2. Stand arrangement according to claim 1, where the spacer device (3) is attached to a stud profile (2) by means of an engagement which extends through the stud profile (2). 3. Stand arrangement according to one of claims 1 or 2, where the spacer device (3) comprises at least one tab (3a, 3b) which is arranged in engagement with the insulation plate. 4. Stand arrangement according to one of claims 1-3, where the spacer device (3) is arranged perpendicular to a first surface (8) and the protrusions (2a, 2b) extend from the first surface (8) towards the opposite stud profile (2) when the stud profiles (2) are in the mounted position. 5. Stand arrangement according to one of claims 1-4, where the first surface consists of a flat surface that extends between the two projections (2a, 2b) in a common plane with an outer (10) and an inner wall (11). 6. Stand arrangement according to one of claims 1-5, where the upright profiles (2) are made up of a steel plate and the two projections (2a, 2b) are bent parts of the steel plate. 7. Stand arrangement according to one of claims 1-6, where the stud profiles (2) have a U-shape consisting of two projections (2a, 2b), and the spacer device (3) is placed on the stud profiles (2) between the projections (2a, 2b) and attached to the stud profiles (2) from the side of the U -the shape opposite the projections (2a, 2b). 8. Stand arrangement according to one of claims 1-7, where each of the two elongated stud profiles (2) comprises a second surface (9) which is parallel to the first surface (8) to receive a wall plate. 9. Stand arrangement according to one of claims 1-8, where the stud profiles (2) and the spacer device (3) have a homogeneous thickness. 10. Stand arrangement according to one of claims 5-9, where the plate thickness is 1.5 mm or less. 11. Stand arrangement according to one of claims 1-10, where the stud profiles (2) are arranged between a roof rail (1a) and a floor rail (1b). 12. Stender arrangement according to one of claims 1-11, where the spacer device (3) comprises at least one recess. 13. Stand arrangement according to one of claims 1-12, where the upright profiles (2) comprise several openings (7) to receive several distance devices (3). 14. Stender arrangement according to one of claims 1-13, where the spacer device (3) has flanges (5) which are to be received in openings (7) in the stud profiles (2). 15. Stand arrangement according to claim 14, where the flanges (5) are arranged to be bent to attach the spacer device (3) to the stud profiles (2). 16. Stender arrangement according to one of claims 1-13, where the spacer device (3) is installed on the stud profiles (2) with a continuous attachment that is attached to a second surface (9) on the stud profiles (2). 17. Stand arrangement according to claims 1-15, where more than one distance device (3) is arranged along the length of the stud profiles (2). 18. Insulating plate for a device in a stud arrangement according to one of claims 1-17, where the insulating plate comprises recesses to receive a projection (2a, 2b) to lie in engagement with a spacer device (3). 19. Stud profile (2) for arrangement in a stud arrangement according to one of claims 1-17, where the stud profiles (2) comprise projections (2a, 2b) which are arranged in engagement with recesses in an insulation board.