NO20064558L - Fremgangsmate for forming av en struktur. - Google Patents

Fremgangsmate for forming av en struktur.

Info

Publication number
NO20064558L
NO20064558L NO20064558A NO20064558A NO20064558L NO 20064558 L NO20064558 L NO 20064558L NO 20064558 A NO20064558 A NO 20064558A NO 20064558 A NO20064558 A NO 20064558A NO 20064558 L NO20064558 L NO 20064558L
Authority
NO
Norway
Prior art keywords
substance
carrier
forming
electrically conductive
solvent
Prior art date
Application number
NO20064558A
Other languages
English (en)
Norwegian (no)
Inventor
Ingo Schwirtlich
Hilmar Von Campe
Original Assignee
Rwe Schott Solar Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rwe Schott Solar Gmbh filed Critical Rwe Schott Solar Gmbh
Publication of NO20064558L publication Critical patent/NO20064558L/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photovoltaic Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Printing Methods (AREA)
NO20064558A 2004-03-09 2006-10-06 Fremgangsmate for forming av en struktur. NO20064558L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04005540A EP1575099A1 (fr) 2004-03-09 2004-03-09 Procédé de formation d'une structure
PCT/EP2005/002414 WO2005088730A2 (fr) 2004-03-09 2005-03-08 Procédé pour former une structure

Publications (1)

Publication Number Publication Date
NO20064558L true NO20064558L (no) 2006-12-06

Family

ID=34814274

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20064558A NO20064558L (no) 2004-03-09 2006-10-06 Fremgangsmate for forming av en struktur.

Country Status (5)

Country Link
US (1) US7790508B2 (fr)
EP (2) EP1575099A1 (fr)
JP (1) JP5335234B2 (fr)
NO (1) NO20064558L (fr)
WO (1) WO2005088730A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8344523B2 (en) * 2006-05-08 2013-01-01 Diemat, Inc. Conductive composition
JP4638382B2 (ja) * 2006-06-05 2011-02-23 田中貴金属工業株式会社 接合方法
DE102009043916A1 (de) * 2009-05-19 2010-12-16 Schott Solar Ag Verfahren zur Herstellung elektrischer Kontakte auf einem Halbleiterbauelement
KR101814014B1 (ko) * 2011-03-25 2018-01-03 삼성전자주식회사 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지
KR102100291B1 (ko) 2011-11-11 2020-04-13 삼성전자주식회사 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지
KR101985929B1 (ko) 2011-12-09 2019-06-05 삼성전자주식회사 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지

Family Cites Families (23)

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Publication number Priority date Publication date Assignee Title
US312864A (en) * 1885-02-24 Iseael kinney
US322620A (en) * 1885-07-21 Feiedeich maeqtjaet
US457861A (en) * 1891-08-18 Wheel
US653918A (en) * 1899-07-20 1900-07-17 Albert De Laski Flat-woven tubular fabric.
US4457861A (en) * 1979-12-13 1984-07-03 Additive Technology Corporation Method, materials and apparatus for manufacturing printed circuits
US4610808A (en) * 1982-07-19 1986-09-09 Mitech Corporation Conductive resinous composites
JPS63268773A (ja) * 1987-04-25 1988-11-07 Toyobo Co Ltd 光硬化型導電性焼成ペ−スト
JPH0332070A (ja) * 1989-06-29 1991-02-12 Sharp Corp 光電変換半導体装置の電極形成方法
GB9211500D0 (en) * 1992-05-30 1992-07-15 First Class Securities Pastes
US5722602A (en) * 1995-12-15 1998-03-03 Caterpillar Inc. Process for making flowable powders for coating applications
US5653918A (en) * 1996-01-11 1997-08-05 E. I. Du Pont De Nemours And Company Flexible thick film conductor composition
EP0905804A3 (fr) * 1997-08-08 1999-12-08 Japan Storage Battery Company Limited Electrode d'une batterie à électrolyte non-aqueux et procédé de production
JP3686749B2 (ja) * 1997-11-04 2005-08-24 太陽インキ製造株式会社 パターン状無機質焼成被膜及びプラズマディスプレイパネルの製造方法
US6071437A (en) * 1998-02-26 2000-06-06 Murata Manufacturing Co., Ltd. Electrically conductive composition for a solar cell
MY125159A (en) * 1998-09-14 2006-07-31 Mitsubishi Materials Corp Fine metal particle-dispersion solution and conductive film using the same
CA2312446C (fr) * 1999-06-21 2006-04-04 Honda Giken Kogyo Kabushiki Kaisha (Also Trading As Honda Motor Co., Ltd .) Membrane electrolyte, polymere, solide, active dans une pile a combustible de type polymere solide et procede pour sa production
US6387997B1 (en) * 1999-11-10 2002-05-14 Ppg Industries Ohio, Inc. Solvent-free film-forming compositions, coated substrates and method related thereto
KR100369565B1 (ko) * 1999-12-17 2003-01-29 대주정밀화학 주식회사 전기발열체용 저항 페이스트 조성물
JP2001202822A (ja) * 2000-01-21 2001-07-27 Murata Mfg Co Ltd 導電性ペースト
US6465550B1 (en) * 2000-08-08 2002-10-15 Dow Corning Corporation Silicone composition and electrically conductive, cured silicone product
JP3705344B2 (ja) * 2000-08-17 2005-10-12 信越化学工業株式会社 導電性シリコーンゴム組成物
US6322620B1 (en) * 2000-11-16 2001-11-27 National Starch And Chemical Investment Holding Corporation Conductive ink composition
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features

Also Published As

Publication number Publication date
JP5335234B2 (ja) 2013-11-06
EP1723681A2 (fr) 2006-11-22
JP2007528127A (ja) 2007-10-04
EP1723681B1 (fr) 2016-10-05
US20080146016A1 (en) 2008-06-19
WO2005088730A2 (fr) 2005-09-22
US7790508B2 (en) 2010-09-07
WO2005088730A3 (fr) 2005-10-27
EP1575099A1 (fr) 2005-09-14

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