NO164506C - Strippemiddel og anvendelse derav. - Google Patents

Strippemiddel og anvendelse derav.

Info

Publication number
NO164506C
NO164506C NO823204A NO823204A NO164506C NO 164506 C NO164506 C NO 164506C NO 823204 A NO823204 A NO 823204A NO 823204 A NO823204 A NO 823204A NO 164506 C NO164506 C NO 164506C
Authority
NO
Norway
Application number
NO823204A
Other languages
English (en)
Norwegian (no)
Other versions
NO164506B (no
NO823204L (no
Inventor
Irl Eugene Ward Jr
Lisa Gail Hallquist
Thomas Joseph Hurley
Original Assignee
Baker J T Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baker J T Inc filed Critical Baker J T Inc
Publication of NO823204L publication Critical patent/NO823204L/no
Publication of NO164506B publication Critical patent/NO164506B/no
Publication of NO164506C publication Critical patent/NO164506C/no

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
NO823204A 1981-09-23 1982-09-22 Strippemiddel og anvendelse derav. NO164506C (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US30478781A 1981-09-23 1981-09-23
US06/408,051 US4395479A (en) 1981-09-23 1982-08-17 Stripping compositions and methods of stripping resists

Publications (3)

Publication Number Publication Date
NO823204L NO823204L (no) 1983-03-24
NO164506B NO164506B (no) 1990-07-02
NO164506C true NO164506C (no) 1990-10-10

Family

ID=26974225

Family Applications (1)

Application Number Title Priority Date Filing Date
NO823204A NO164506C (no) 1981-09-23 1982-09-22 Strippemiddel og anvendelse derav.

Country Status (13)

Country Link
US (1) US4395479A (de)
EP (1) EP0075328B1 (de)
KR (1) KR880002246B1 (de)
AU (1) AU552507B2 (de)
CA (1) CA1177373A (de)
DE (1) DE3270443D1 (de)
DK (1) DK162729C (de)
HK (1) HK98086A (de)
IE (1) IE53780B1 (de)
IL (1) IL66737A (de)
MY (1) MY8700157A (de)
NO (1) NO164506C (de)
NZ (1) NZ201771A (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4453984A (en) * 1982-06-30 1984-06-12 International Business Machines Corporation Method for removing electrically conductive paste from a screening mask
US4403029A (en) * 1982-09-02 1983-09-06 J. T. Baker Chemical Company Stripping compositions and methods of stripping resists
US4401747A (en) * 1982-09-02 1983-08-30 J. T. Baker Chemical Company Stripping compositions and methods of stripping resists
JPS60131535A (ja) * 1983-12-20 1985-07-13 エッチエムシー・パテンツ・ホールディング・カンパニー・インコーポレーテッド ポジのホトレジスト用のストリツピング組成物
US4791043A (en) * 1983-12-20 1988-12-13 Hmc Patents Holding Co., Inc. Positive photoresist stripping composition
DE3581659D1 (de) * 1984-05-21 1991-03-14 Shipley Co Photolackentferner und verfahren zum entfernen von photolacken.
US4617251A (en) * 1985-04-11 1986-10-14 Olin Hunt Specialty Products, Inc. Stripping composition and method of using the same
ZA87922B (en) * 1986-02-28 1987-09-30 Macdermid Inc Photoresist stripper composition
JPH0721638B2 (ja) * 1986-07-18 1995-03-08 東京応化工業株式会社 基板の処理方法
IE59971B1 (en) * 1986-11-10 1994-05-04 Baker J T Inc Stripping compositions and their use for stripping resists from substrates
WO1988008445A1 (en) * 1987-04-29 1988-11-03 Coroman Industries, Inc. Graffiti removal composition and method
US20040018949A1 (en) * 1990-11-05 2004-01-29 Wai Mun Lee Semiconductor process residue removal composition and process
US7205265B2 (en) * 1990-11-05 2007-04-17 Ekc Technology, Inc. Cleaning compositions and methods of use thereof
US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US5308745A (en) * 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
US7144849B2 (en) * 1993-06-21 2006-12-05 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US5759973A (en) * 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
US5817610A (en) * 1996-09-06 1998-10-06 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6030932A (en) * 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US5939371A (en) * 1997-10-14 1999-08-17 Martin, Ii; Richard P. Stripping composition for urethane conformal coatings
US7579308B2 (en) * 1998-07-06 2009-08-25 Ekc/Dupont Electronics Technologies Compositions and processes for photoresist stripping and residue removal in wafer level packaging
US7135445B2 (en) * 2001-12-04 2006-11-14 Ekc Technology, Inc. Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials
US6368421B1 (en) 1998-07-10 2002-04-09 Clariant Finance (Bvi) Limited Composition for stripping photoresist and organic materials from substrate surfaces
US6413923B2 (en) * 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US7456140B2 (en) * 2000-07-10 2008-11-25 Ekc Technology, Inc. Compositions for cleaning organic and plasma etched residues for semiconductor devices
AU2001278890A1 (en) 2000-07-10 2002-01-21 Ekc Technology, Inc. Compositions for cleaning organic and plasma etched residues for semiconductor devices
US7543592B2 (en) * 2001-12-04 2009-06-09 Ekc Technology, Inc. Compositions and processes for photoresist stripping and residue removal in wafer level packaging
US20030171239A1 (en) * 2002-01-28 2003-09-11 Patel Bakul P. Methods and compositions for chemically treating a substrate using foam technology
AU2003225178A1 (en) * 2002-04-24 2003-11-10 Ekc Technology, Inc. Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces
US20050089489A1 (en) * 2003-10-22 2005-04-28 Carter Melvin K. Composition for exfoliation agent effective in removing resist residues
US20060094612A1 (en) * 2004-11-04 2006-05-04 Mayumi Kimura Post etch cleaning composition for use with substrates having aluminum
US8026201B2 (en) 2007-01-03 2011-09-27 Az Electronic Materials Usa Corp. Stripper for coating layer
FR2912151B1 (fr) * 2007-02-05 2009-05-08 Arkema France Formulation de dimethylsulfoxyde en melange avec un additif permettant d'abaisser le point de cristallisation de ce dernier, et applications de ce melange
US8518865B2 (en) 2009-08-31 2013-08-27 Air Products And Chemicals, Inc. Water-rich stripping and cleaning formulation and method for using same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1099416A (en) * 1965-01-25 1968-01-17 Agfa Gevaert Nv Method of incorporating photographic ingredients into a photographic colloid
US3673099A (en) * 1970-10-19 1972-06-27 Bell Telephone Labor Inc Process and composition for stripping cured resins from substrates
US3932317A (en) * 1973-09-17 1976-01-13 Phillips Petroleum Company Compositions for removing acrylic based coatings
GB1523877A (en) * 1974-09-19 1978-09-06 Vickers Ltd Processing fo printing plates
US4276186A (en) * 1979-06-26 1981-06-30 International Business Machines Corporation Cleaning composition and use thereof
US4304681A (en) * 1980-09-15 1981-12-08 Shipley Company, Inc. Novel stripping composition for positive photoresists and method of using same

Also Published As

Publication number Publication date
HK98086A (en) 1986-12-19
AU552507B2 (en) 1986-06-05
IL66737A0 (en) 1982-12-31
MY8700157A (en) 1987-12-31
DK162729B (da) 1991-12-02
EP0075328A1 (de) 1983-03-30
CA1177373A (en) 1984-11-06
AU8819482A (en) 1983-03-31
DK162729C (da) 1992-04-21
NO164506B (no) 1990-07-02
DK421882A (da) 1983-03-24
NZ201771A (en) 1986-01-24
NO823204L (no) 1983-03-24
IE822119L (en) 1983-03-23
EP0075328B1 (de) 1986-04-09
IE53780B1 (en) 1989-02-15
DE3270443D1 (en) 1986-05-15
US4395479A (en) 1983-07-26
KR880002246B1 (ko) 1988-10-20
IL66737A (en) 1985-09-29

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Legal Events

Date Code Title Description
MK1K Patent expired

Free format text: EXPIRED IN SEPTEMBER 2002