NO160723C - Homogene kobberbaserte legeringer og loddefolie derav. - Google Patents

Homogene kobberbaserte legeringer og loddefolie derav.

Info

Publication number
NO160723C
NO160723C NO833374A NO833374A NO160723C NO 160723 C NO160723 C NO 160723C NO 833374 A NO833374 A NO 833374A NO 833374 A NO833374 A NO 833374A NO 160723 C NO160723 C NO 160723C
Authority
NO
Norway
Prior art keywords
powerful
wrap
based alloys
homogenous copper
homogenous
Prior art date
Application number
NO833374A
Other languages
English (en)
Other versions
NO160723B (no
NO833374L (no
Inventor
Debasis Bose
Amitava Datta
Nicholas John Decristofaro
Original Assignee
Allied Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/420,550 external-priority patent/US4448851A/en
Application filed by Allied Corp filed Critical Allied Corp
Publication of NO833374L publication Critical patent/NO833374L/no
Publication of NO160723B publication Critical patent/NO160723B/no
Publication of NO160723C publication Critical patent/NO160723C/no

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C45/00—Amorphous alloys
    • C22C45/001—Amorphous alloys with Cu as the major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils

Landscapes

  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Cookers (AREA)
  • Paper (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
NO833374A 1982-09-20 1983-09-19 Homogene kobberbaserte legeringer og loddefolie derav. NO160723C (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/420,550 US4448851A (en) 1982-09-20 1982-09-20 Homogeneous low melting point copper based alloys
US06/488,858 US4448852A (en) 1982-09-20 1983-04-26 Homogeneous low melting point copper based alloys

Publications (3)

Publication Number Publication Date
NO833374L NO833374L (no) 1984-03-21
NO160723B NO160723B (no) 1989-02-13
NO160723C true NO160723C (no) 1989-05-24

Family

ID=27024903

Family Applications (1)

Application Number Title Priority Date Filing Date
NO833374A NO160723C (no) 1982-09-20 1983-09-19 Homogene kobberbaserte legeringer og loddefolie derav.

Country Status (8)

Country Link
US (1) US4448852A (no)
EP (1) EP0103770B1 (no)
JP (1) JPH0665440B2 (no)
KR (1) KR900000400B1 (no)
AU (1) AU558029B2 (no)
CA (1) CA1216441A (no)
DE (1) DE3367182D1 (no)
NO (1) NO160723C (no)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4497430A (en) * 1982-09-20 1985-02-05 Allied Corporation Brazing method using homogeneous low melting point copper based alloys
US4549687A (en) * 1983-04-26 1985-10-29 Allied Corporation Homogeneous low melting point copper based alloys
US4522331A (en) * 1983-06-03 1985-06-11 Allied Corporation Method of brazing with low melting point copper-tin foils
US4517157A (en) * 1984-10-11 1985-05-14 Gte Products Corporation Copper based brazing alloy
US4732625A (en) * 1985-07-29 1988-03-22 Pfizer Inc. Copper-nickel-tin-cobalt spinodal alloy
JPH07113142B2 (ja) * 1987-02-10 1995-12-06 三菱電機株式会社 りん青銅薄板の製造方法
US4842955A (en) * 1987-09-14 1989-06-27 Allied-Signal Inc. Homogeneous, metastable BAg-group brazing alloys
DE10335947A1 (de) * 2003-08-04 2005-03-17 Vacuumschmelze Gmbh & Co. Kg Hartlotlegierung auf Kupferbasis sowie Verfahren zum Hartlöten
US7638966B1 (en) * 2008-09-03 2009-12-29 Alexander Pummer Voltage control and power factor correction in AC induction motors
US8783544B2 (en) * 2012-03-20 2014-07-22 Joseph W. Harris Brazing alloys and methods of brazing
CN106660176B (zh) * 2014-08-27 2020-11-10 贺利氏德国有限两合公司 用于制造焊接接头的方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US30854A (en) * 1860-12-04 Improvement in sewing-machines
US31180A (en) * 1861-01-22 Polishing-tool
US2117106A (en) * 1936-02-21 1938-05-10 American Brass Co Brazed article
US2195435A (en) * 1938-08-19 1940-04-02 American Brass Co Copper alloy
US2755182A (en) * 1955-07-29 1956-07-17 Superweld Corp Copper-base brazing alloy
US2946678A (en) * 1956-09-28 1960-07-26 Wall Colmonoy Corp Metallic composition
NL270684A (no) * 1960-11-01
US3392017A (en) * 1965-04-15 1968-07-09 Eutectic Welding Alloys Welding consumable products
US3856513A (en) * 1972-12-26 1974-12-24 Allied Chem Novel amorphous metals and amorphous metal articles
US4009027A (en) * 1974-11-21 1977-02-22 Jury Vladimirovich Naidich Alloy for metallization and brazing of abrasive materials
JPS524451A (en) * 1975-07-01 1977-01-13 Komatsu Mfg Co Ltd Copper base heat resisting brazing filler alloy
JPS5211124A (en) * 1975-07-18 1977-01-27 Furukawa Electric Co Ltd:The Electroconductive cu alloy of excellent soldering property
USRE31180E (en) 1976-05-11 1983-03-15 Bell Telephone Laboratories, Incorporated Quaternary spinodal copper alloys
US4071358A (en) * 1977-02-16 1978-01-31 Kabushiki Kaisha Komatsu Seisakusho Heat resisting copper base brazing filler metal
USRE30854E (en) 1977-12-30 1982-01-26 Bell Telephone Laboratories, Incorporated Free machining Cu--Ni--Sn alloys
JPS6043895B2 (ja) * 1978-02-23 1985-10-01 東北大学金属材料研究所長 銅基合金
US4209570A (en) * 1978-10-02 1980-06-24 Allied Chemical Corporation Homogeneous brazing foils of copper based metallic glasses
JPS6043903B2 (ja) * 1979-06-14 1985-10-01 三菱電機株式会社 Ｃｕ−Ｎｉ−Ｓｎ合金の強化法
JPS5690947A (en) * 1979-12-26 1981-07-23 Fujitsu Ltd Spring copper alloy for electric machinary
US4388270A (en) * 1982-09-16 1983-06-14 Handy & Harman Rhenium-bearing copper-nickel-tin alloys

Also Published As

Publication number Publication date
EP0103770A1 (en) 1984-03-28
US4448852A (en) 1984-05-15
JPS63212088A (ja) 1988-09-05
KR900000400B1 (ko) 1990-01-25
JPH0665440B2 (ja) 1994-08-24
KR840005987A (ko) 1984-11-21
NO160723B (no) 1989-02-13
AU1858683A (en) 1984-03-29
AU558029B2 (en) 1987-01-15
CA1216441A (en) 1987-01-13
DE3367182D1 (en) 1986-12-04
NO833374L (no) 1984-03-21
EP0103770B1 (en) 1986-10-29

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