NO142407B - CADMIUM-FREE WELDING METAL CONTAINING GOLD, SILVER AND COPPER - Google Patents
CADMIUM-FREE WELDING METAL CONTAINING GOLD, SILVER AND COPPER Download PDFInfo
- Publication number
- NO142407B NO142407B NO751858A NO751858A NO142407B NO 142407 B NO142407 B NO 142407B NO 751858 A NO751858 A NO 751858A NO 751858 A NO751858 A NO 751858A NO 142407 B NO142407 B NO 142407B
- Authority
- NO
- Norway
- Prior art keywords
- weight
- gold
- silver
- cadmium
- copper
- Prior art date
Links
- 229910052737 gold Inorganic materials 0.000 title claims description 32
- 239000010931 gold Substances 0.000 title claims description 32
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 27
- 239000002184 metal Substances 0.000 title claims description 16
- 229910052751 metal Inorganic materials 0.000 title claims description 16
- 229910052709 silver Inorganic materials 0.000 title claims description 16
- 239000004332 silver Substances 0.000 title claims description 16
- 238000003466 welding Methods 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 claims description 48
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 229910052725 zinc Inorganic materials 0.000 claims description 14
- 239000011701 zinc Substances 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 3
- 229910052793 cadmium Inorganic materials 0.000 description 15
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 15
- 239000000203 mixture Substances 0.000 description 7
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
Description
Den foreliggende oppfinnelse angår et loddemetall på gullbasis, nærmere bestemt et kadmiumfritt loddemetall inneholdende gull, sølv og kobber. The present invention relates to a gold-based solder, more specifically a cadmium-free solder containing gold, silver and copper.
Loddemetaller på gullbasis - såkalte "karat-gull-loddemetaller" - for generell industriell og dental anvendelse, inneholder, bortsett fra forurensninger og i tillegg til gull, typisk ett eller flere av følgende metaller: Sølv, kobber, zink og kadmium. Av disse metaller er kadmium tilstede i konsentrasjoner på opptil 20 vektprosent. Gold-based solders - so-called "karat gold solders" - for general industrial and dental use, apart from impurities and in addition to gold, typically contain one or more of the following metals: Silver, copper, zinc and cadmium. Of these metals, cadmium is present in concentrations of up to 20% by weight.
Kadmium er et av de giftigste kjente metaller, og dets nærvær i karat-gull-loddemetall medfører helserisikoer både ved frem-stilling og bruk av disse materialer. Cadmium is one of the most toxic known metals, and its presence in karat gold solder entails health risks both in the manufacture and use of these materials.
I visse tilfeller vil det derfor være en fordel å ha kadmiumfrie ekvivalenter til de eksisterende karat-gull-loddemetaller. In certain cases, it will therefore be an advantage to have cadmium-free equivalents to the existing carat-gold solders.
Noen typiske eksempler på kjente karat-gull-loddemetaller er gjengitt i den nedenstående tabell 1, hvor sammensetningen er gitt i vektprosent. Some typical examples of known karat-gold solders are reproduced in the following table 1, where the composition is given in percentage by weight.
Disse loddemetaller er representative eksempler på metaller innenfor et område. F.eks. finnes der "14 karat gull"-loddemetaller basert på et gullinnhold på 58,53 vektprosent. Der finnes også 9 karats-og -18 karats-loddemetaller med betegnelsen "Hard" og smelte-områder som er høyere enn for tilsvarende loddemetaller med betegnelsen "Medium". Dessuten finnes der et loddemetall med betegnelsen "9 Carat Extra Easy" som har et smelteområde på 640-652°C '.,«,ogt-r.inneholder 20 vektprosent kadmium. De tre loddemetaller som er. gjengitt i tabell 1, anses imidlertid å være representative for det nevnte område for sammensetningen, idet de inneholder både store og små mengder gull og store og små mengder kadmium. These solders are representative examples of metals within a range. E.g. there are "14 carat gold" solders based on a gold content of 58.53% by weight. There are also 9 carat and -18 carat solders with the designation "Hard" and melting ranges that are higher than for corresponding solders with the designation "Medium". There is also a solder with the designation "9 Carat Extra Easy" which has a melting range of 640-652°C and also contains 20% cadmium by weight. The three solders that are. reproduced in table 1, are, however, considered to be representative of the aforementioned range of composition, as they contain both large and small amounts of gold and large and small amounts of cadmium.
Det er nå funnet at der kan fremstilles nye karat-gull-loddemetaller som har det samme gullinnhold og lignende egenskaper som de karat-gull-loddemetaller som er gjengitt i tabell 1, men ikke inneholder noe kadmium. I tillegg til gull inneholder de nye karat-gull-loddemetaller ifølge oppfinnelsen sølv, kobber og minst ett annet metall valgt fra den gruppe som består av zink, tinn og indium. Loddemetallet ifølge den foreliggende oppfinnelse er nærmere bestemt karakterisert ved at det, bortsett fra forurensninger, består av 37-76 vektprosent gull, 11-56,5 vektprosent sølv, 3-30 vektprosent kobber og enten It has now been found that new karat-gold solders can be produced which have the same gold content and similar properties as the karat-gold solders given in Table 1, but do not contain any cadmium. In addition to gold, the new karat gold solders according to the invention contain silver, copper and at least one other metal selected from the group consisting of zinc, tin and indium. The solder metal according to the present invention is more precisely characterized in that, apart from impurities, it consists of 37-76 weight percent gold, 11-56.5 weight percent silver, 3-30 weight percent copper and either
a) zink eller a) zinc or
b) zink, tinn og indium eller b) zinc, tin and indium or
c) tinn og indium c) tin and indium
i en mengde på minst 0,5 vektprosent av hver og høyst 32,5 vektprosent tilsammen. in an amount of at least 0.5% by weight of each and a maximum of 32.5% by weight together.
Karatgull-loddemetallene i henhold til oppfinnelsen inneholder fortrinnsvis høyst 37 og helst høyst 19,5 vektprosent sølv og fortrinnsvis 5-21,5 vektprosent zink. The Karat gold solders according to the invention preferably contain no more than 37 and preferably no more than 19.5 weight percent silver and preferably 5-21.5 weight percent zinc.
I 18 karats loddemetall i henhold til den foreliggende oppfinnelse inneholdende minst 75 vektprosent gull og høyst 37, fortrinnsvis høyst 19,5 vektprosent sølv, foretrekkes det at kobber er tilstede i en mengde på 3-17 vektprosent. I et 14 karats loddemetall som inneholder minst 58 vektprosent gull, er sølv og kobber fortrinnsvis tilstede i mengder på henholdsvis 11-20 vektprosent og 5-15 vektprosent, og i et 9 karats loddemetall er sølv og kobber fortrinnsvis tilstede i mengder på henholdsvis 25-56,5 vektprosent og 5-30 vektprosent. In 18 carat solder according to the present invention containing at least 75 weight percent gold and at most 37, preferably at most 19.5 weight percent silver, it is preferred that copper is present in an amount of 3-17 weight percent. In a 14 carat solder containing at least 58% gold by weight, silver and copper are preferably present in amounts of 11-20% by weight and 5-15% by weight, respectively, and in a 9 carat solder, silver and copper are preferably present in amounts of 25- 56.5% by weight and 5-30% by weight.
Som et typisk eksempel har 9 karats loddemetaller med betegnelsene "Medium" og "Easy" og 18 karats loddemetaller med betegnelsen "Medium" i henhold til oppfinnelsen sammensetninger som ligger innenfor de områder som er gitt i de etterfølgende eksempler 1-3. As a typical example, 9 carat solders with the designations "Medium" and "Easy" and 18 carat solders with the designation "Medium" according to the invention have compositions that lie within the ranges given in the following examples 1-3.
Karat-gull-loddemetallene ifølge den foreliggende oppfinnelse svarer til sine kadmiumhoIdige motstykker ikke bare med hensyn til gullinnhold, men også med hensyn til smelteområde, farge, bear-beidhet og loddeegenskaper. The karat gold solders according to the present invention correspond to their cadmium-containing counterparts not only with regard to gold content, but also with regard to melting range, color, processability and soldering properties.
Kadmiumfrie ekvivalenter til karat-gull-loddemetaller spm inneholder mindre enn 7 vektprosent kadmium, hvilke ekvivalenter loddemetallene med betegnelsene "9 Carat Medium" og "18 Carat Medium" i tabell 1 er typiske eksempler på, idet disse eksempler inneholder henholdsvis 5,7 og 6,8 vektprosent kadmium, ble fremstilt ved økning av zinkinnholdet i de opprinnelige legeringer og justering av kobber-og sølvinnholdet. Cadmium-free equivalents to carat-gold solders spm contain less than 7% by weight of cadmium, of which equivalents the solders with the designations "9 Carat Medium" and "18 Carat Medium" in table 1 are typical examples, as these examples contain respectively 5,7 and 6 .8 weight percent cadmium, was produced by increasing the zinc content in the original alloys and adjusting the copper and silver content.
Derimot var det ikke mulig rett og slett å øke zinkinnholdet og regulere egenskapene av de øvrige metaller utenom gull for å fremstille tilfredsstillende kadmiumfrie motstykker til loddemetaller som inneholder mer enn ca. 7 vektprosent kadmium, hvilke motstykker loddemetallet med betegnelsen "9 Carat Easy" i tabell 1 er et eksempel på, idet dette eksempel inneholder 12,0 vektprosent kadmium. Det ble funnet at en stor økning i andelen av zink førte til et loddemetall som var så vanskelig å bearbeide at det var umulig å fremstille tynne strimmelprøver som kreves for fastlegging av solidus-punktet. En reduksjon av zinkinnholdet forbedret bearbeidbarheten av loddemetallet, men dets smeltepunkt ble for høyt. In contrast, it was not possible to simply increase the zinc content and regulate the properties of the other metals apart from gold in order to produce satisfactory cadmium-free counterparts to solders containing more than approx. 7 weight percent cadmium, of which counterparts the solder metal with the designation "9 Carat Easy" in table 1 is an example, as this example contains 12.0 weight percent cadmium. It was found that a large increase in the proportion of zinc resulted in a solder which was so difficult to process that it was impossible to prepare thin strip samples required for determination of the solidus point. A reduction of the zinc content improved the workability of the solder metal, but its melting point became too high.
Det er funnet at et loddemetall som inneholder den samme mengde gull som loddemetallet "9 Carat Easy" i tabell 1 og dessuten sølv, kobber, zink, tinn og indium, har lignende egenskaper som loddemetallet "9 Carat Easy". It has been found that a solder containing the same amount of gold as the "9 Carat Easy" solder in Table 1 and in addition silver, copper, zinc, tin and indium has similar properties to the "9 Carat Easy" solder.
Spesielle eksempler på karat-gull-loddemetaller i henhold Special examples of karat gold solders according to
til den foreliggende oppfinnelse er gitt i eksemplene 4-14 i tabell 2, hvor betegnelsen på legeringene svarer til betegnelsen på disses kadmiumholdige ekvivalenter, idet sammensetningene er angitt i vektprosent og smelteområdet eventuelt i °C. to the present invention is given in examples 4-14 in table 2, where the designation of the alloys corresponds to the designation of their cadmium-containing equivalents, the compositions being indicated in weight percent and the melting range possibly in °C.
Når det gjelder eksemplene 4-14, ble solidus-punktet for hvert loddemetall bestemt ved differensialbrometoden (differential bridge method), mens< liquidus-punktet ble bestemt ved den vanlige varmeanalysemetode, idet et "Easy-flo"-fluksmiddelbelegg ble anvendt for å redusere endringene i den nominelle sammensetning av loddemetallet som følge av oksydasjon og fordampning tii et minimum. In the case of Examples 4-14, the solidus point for each solder was determined by the differential bridge method, while the liquidus point was determined by the usual heat analysis method, using an "Easy-flo" flux coating to reduce the changes in the nominal composition of the solder metal as a result of oxidation and evaporation to a minimum.
Eksemplene 4, 5 og 11 er beregnet som kadmiumfrie erstat- Examples 4, 5 and 11 are calculated as cadmium-free substitutes
ninger for de tre loddemetaller i tabell 1. Det vil lett ses at de sammensetninger som er gjengitt i tabell 2, avviker fra de tilsvarende sammensetninger i tabell 1 med samme betegnelse. nings for the three solder metals in table 1. It will be easily seen that the compositions reproduced in table 2 deviate from the corresponding compositions in table 1 with the same designation.
"Bearbeidbarheten" er angitt som den prosentuelle tykkelses-reduksjon som hvert loddemetall- i ubearbeidet støpt tilstand kunne motstå ved kald-flatvalsing uten sprekkdannelse. The "workability" is stated as the percentage reduction in thickness that each solder - in the unworked cast state - could withstand by cold flat rolling without cracking.
Loddemetallprøvene i eksemplene 4, 5 og 11 ble underkastet loddeforsøk hvor deres kapillarflyteevne ble sammenlignet med den tilsvarende evne hos deres kadmiumholdige motstykker i tabell 1. The solder samples in Examples 4, 5 and 11 were subjected to soldering tests where their capillary flow ability was compared to the corresponding ability of their cadmium containing counterparts in Table 1.
De nye loddemetaller med betegnelsene "9 Carat Easy", "9 Carat The new solders with the designations "9 Carat Easy", "9 Carat
Medium" og "18 Carat Medium" ble funnet å være hovedsakelig lik Medium" and "18 Carat Medium" were found to be essentially similar
sine respektive kadmiumholdige motstykker i denne henseende. their respective cadmium-containing counterparts in this respect.
Alle de tre loddemetaller hadde hovedsakelig samme farge som All three solders were essentially the same color as
sine kadmiumholdige motstykker. their cadmium-containing counterparts.
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2359074A GB1469856A (en) | 1974-05-28 | 1974-05-28 | Solder alloy |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO751858L NO751858L (en) | 1975-12-01 |
| NO142407B true NO142407B (en) | 1980-05-05 |
| NO142407C NO142407C (en) | 1980-08-20 |
Family
ID=10198144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO751858A NO142407C (en) | 1974-05-28 | 1975-05-26 | CADMIUM-FREE WELDING METAL CONTAINING GOLD, SILVER AND COPPER |
Country Status (7)
| Country | Link |
|---|---|
| DK (1) | DK233175A (en) |
| FI (1) | FI66436C (en) |
| FR (1) | FR2275271A1 (en) |
| GB (1) | GB1469856A (en) |
| IT (1) | IT1032963B (en) |
| NO (1) | NO142407C (en) |
| SE (1) | SE425223B (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1042975B (en) * | 1975-09-30 | 1980-01-30 | Snam Progetti | METHOD FOR THE CONSTRUCTION OF A THERMOELECTRIC MODULE AND MODULE SO OBTAINED |
| US4014690A (en) * | 1976-05-14 | 1977-03-29 | Howmedica, Inc. | Gold-colored alloy solders |
| DE2739839C2 (en) | 1977-09-03 | 1979-11-15 | W.C. Heraeus Gmbh, 6450 Hanau | Gold-containing dental solder alloy |
| DE2829284A1 (en) * | 1978-07-04 | 1980-01-17 | Wagner Fa Ferd | GOLD ALLOY WIRE FOR JEWELERY CHAINS |
| JPS5684077U (en) * | 1979-12-04 | 1981-07-07 | ||
| JPS5698436A (en) * | 1979-12-11 | 1981-08-07 | Seiko Epson Corp | Gold solder |
| JPS5695493A (en) * | 1979-12-27 | 1981-08-01 | Seiko Epson Corp | Method of joining armoring parts for portable timepiece |
| JPS6338943Y2 (en) * | 1980-07-04 | 1988-10-13 | ||
| US4473621A (en) * | 1983-07-19 | 1984-09-25 | Johnson Matthey Limited | Cadmium free gold alloys |
| US5531962A (en) * | 1992-09-02 | 1996-07-02 | Degussa Aktiengesellschaft | Cadmium-free silver alloy brazing solder, method of using said solder, and metal articles brazed with said solder |
| DE4323227C1 (en) * | 1993-07-12 | 1994-07-28 | Degussa | Cadmium-free silver alloy used as solder at temps. below 630 deg.C. |
| NL9401960A (en) * | 1994-11-23 | 1996-07-01 | Schoene Edelmetaal B V | Cadmium-free solder alloys for soldering jewellery |
| DE19615642C2 (en) * | 1996-04-21 | 1998-04-09 | Werner Harald Dr | Dental alloy system containing high gold |
| EP1323492A4 (en) * | 2001-03-23 | 2004-10-06 | Citizen Watch Co Ltd | Brazing filler metal |
| EP2756914A1 (en) * | 2013-01-18 | 2014-07-23 | Umicore AG & Co. KG | Solder alloy |
| EP3144401B1 (en) | 2015-09-16 | 2021-02-17 | C. Hafner GmbH + Co. KG | White gold alloy for jewellery |
| DE102015011788A1 (en) * | 2015-09-16 | 2017-03-16 | C. Hafner Gmbh + Co. Kg | White gold alloy |
| EP3783124A1 (en) | 2019-08-23 | 2021-02-24 | Omega SA | Gold timepiece, ornament or jewellery |
-
1974
- 1974-05-28 GB GB2359074A patent/GB1469856A/en not_active Expired
-
1975
- 1975-05-23 IT IT68333/75A patent/IT1032963B/en active
- 1975-05-23 FI FI751505A patent/FI66436C/en not_active IP Right Cessation
- 1975-05-26 NO NO751858A patent/NO142407C/en unknown
- 1975-05-26 SE SE7505986A patent/SE425223B/en unknown
- 1975-05-27 DK DK233175A patent/DK233175A/en unknown
- 1975-05-28 FR FR7516715A patent/FR2275271A1/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DK233175A (en) | 1975-11-29 |
| GB1469856A (en) | 1977-04-06 |
| SE7505986L (en) | 1975-12-01 |
| NO751858L (en) | 1975-12-01 |
| FI66436B (en) | 1984-06-29 |
| FR2275271B1 (en) | 1980-10-24 |
| SE425223B (en) | 1982-09-13 |
| FI66436C (en) | 1984-10-10 |
| FR2275271A1 (en) | 1976-01-16 |
| NO142407C (en) | 1980-08-20 |
| FI751505A (en) | 1975-11-29 |
| IT1032963B (en) | 1979-06-20 |
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