NO120651B - - Google Patents
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- Publication number
- NO120651B NO120651B NO169397A NO16939767A NO120651B NO 120651 B NO120651 B NO 120651B NO 169397 A NO169397 A NO 169397A NO 16939767 A NO16939767 A NO 16939767A NO 120651 B NO120651 B NO 120651B
- Authority
- NO
- Norway
- Prior art keywords
- alloy
- ceramic
- titanium
- copper
- silver
- Prior art date
Links
- 239000010936 titanium Substances 0.000 claims description 24
- 229910045601 alloy Inorganic materials 0.000 claims description 21
- 239000000956 alloy Substances 0.000 claims description 21
- 229910052719 titanium Inorganic materials 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 229910052726 zirconium Inorganic materials 0.000 claims description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 239000011733 molybdenum Substances 0.000 claims description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052845 zircon Inorganic materials 0.000 claims description 4
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 229910001316 Ag alloy Inorganic materials 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- -1 titanium hydride Chemical compound 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 229910000048 titanium hydride Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007937 lozenge Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D90/00—Component parts, details or accessories for large containers
- B65D90/12—Supports
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Containers Having Bodies Formed In One Piece (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Packages (AREA)
- Ceramic Products (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
Description
Loddemateriale. Soldering material.
Oppfinnelsen angår et loddemateriale til å forbinde gjenstander, spesielt et titan-eller zirkonholdig loddemateriale som også inneholder kobber og sølv. The invention relates to a solder material for connecting objects, in particular a titanium or zirconium-containing solder material which also contains copper and silver.
Det er kjent at visse materialer bare kan forbindes med hverandre ved hjelp av spesielle legeringer. Således er det kjent å forbinde et metall som f. eks. kromjern med en keramisk overflate, ved at den keramiske overflate først dekkes med titan ved påfø-ring av titanhydrid som spaltes ved opphetningen. En kromjernskive kan da loddes til dette titanlag ved hjelp av sølv, gull eller kobber. Eventuelt kan titanhydrid i form av pulver blandes med sølv eller kobber og anbringes mellom de overflater på keramisk og/eller metalliske gjenstander som skal forbindes. Ved opphetning i vakuum spal-ter hydridet seg og det danner seg en legering av Ti med Cu eller Ag, som hefter godt til den keramiske overflate og som også legerer seg med metaller som kromjern, slik at det fåes en fast vedhengning. It is known that certain materials can only be joined together using special alloys. Thus, it is known to connect a metal such as e.g. chrome iron with a ceramic surface, in that the ceramic surface is first covered with titanium by the application of titanium hydride which decomposes during heating. A chrome iron disk can then be soldered to this titanium layer using silver, gold or copper. Optionally, titanium hydride in the form of powder can be mixed with silver or copper and placed between the surfaces of ceramic and/or metallic objects to be joined. When heated in a vacuum, the hydride splits and an alloy of Ti with Cu or Ag is formed, which adheres well to the ceramic surface and which also alloys with metals such as chromium iron, so that a firm attachment is obtained.
Det viser seg at slike kjente fremgangsmåter har visse ulemper. Således frigjøres det ved spaltningen av hydridet meget gass, hvilket er uheldig når det skal fremstilles vakuumrør. Ennvidere er tykkelsen og ved-hengningen av titanlaget ikke alltid jevn, slik at disse kjente fremgangsmåter er van-skelige å reprodusere. It turns out that such known methods have certain disadvantages. Thus, a lot of gas is released during the splitting of the hydride, which is unfortunate when vacuum tubes are to be produced. Furthermore, the thickness and adhesion of the titanium layer is not always uniform, so that these known methods are difficult to reproduce.
I henhold til en annen kjent fremgangsmåte framstilles det at titan- eller zirkonholdig loddemateriale derved at en Ti- eller Zr-tråd innleires i en kobber-sølv-legering som inneholder 28 pst. Cu og 72 pst. Ag. Ved smeltning av metallene dannes loddematerialet. According to another known method, titanium or zirconium-containing solder material is produced by embedding a Ti or Zr wire in a copper-silver alloy containing 28% Cu and 72% Ag. By melting the metals, the solder material is formed.
En meget godt egnet og godt reproduserbar fremgangsmåte til å forbinde gjenstander av materialer hvis smelte- eller mykningstemperatur ligger over 1000° C, under anvendelse av en titan- eller zirkonholdig sølv/kobber-legering som loddemid-del oppnås hvis man i henhold til oppfinnelsen lodder sammen gjenstandene i en ikke oksyderende atmosfære ved hjelp av en A very suitable and highly reproducible method for connecting objects made of materials whose melting or softening temperature is above 1000° C, using a titanium or zirconium-containing silver/copper alloy as the solder part is obtained if one solders according to the invention together the objects in a non-oxidizing atmosphere using a
legering som inneholder mellom 10 pst. og 20 pst. titan eller zirkon og forøvrig består alloy that contains between 10% and 20% titanium or zircon and otherwise consists of
av omtrent like vektprosentmengder sølv og kobber. Det viser seg at en slik legering uten videre hefter meget godt til praktisk talt alle stoffer som har et smelte- eller mykningspunkt over 1000° C. Eksempelvis kan man på enkel og reproduserbar måte forbinde gjenstander av grafitt, karbider, kromjern, keramiske materialer osv. ved hjelp av fremgangsmåten i henhold til oppfinnelsen. Legeringen frigir ingen gass og når det anvendes zirkon virker den også som fangstoff (getter), hvilket er av betyd-ning for vakuumrør. Dessuten blir forbin-delsen vakuumtett. En ytterligere fordel er den at utflytningen av legeringen over en ikke metallisk, f. eks. keramisk flate samt smeltetemperaturen kan reguleres innenfor vide grenser ved passende valg av titan- resp. zirkoninnholdet. En legering med ca. 10 vektpst. Ti eller Zr har et for-holdsvis lavt smeltepunkt på ca. 900° C og flyter godt utover keramiske overflater. Den beste utflytning og den kraftigste vedheng- of approximately equal weight percentage amounts of silver and copper. It turns out that such an alloy readily adheres very well to practically all substances that have a melting or softening point above 1000° C. For example, objects made of graphite, carbides, chromium iron, ceramic materials etc. can be joined in a simple and reproducible way. by means of the method according to the invention. The alloy does not release any gas and when zircon is used it also acts as a trap (getter), which is important for vacuum tubes. In addition, the connection becomes vacuum-tight. A further advantage is that the flow of the alloy over a non-metallic, e.g. ceramic surface as well as the melting temperature can be regulated within wide limits by suitable selection of titanium or the zircon content. An alloy with approx. 10 wt. Ti or Zr has a relatively low melting point of approx. 900° C and flows well over ceramic surfaces. The best displacement and the most powerful attachment
ning fåes hvis legeringen Inneholder 13 vekcprosent Ti eller Zr, 43,5 vektprosent Ag og 43,5 vektprosent Cu. Prosentmengden av Cu og Ag kan eventuelt variere med høyst 10 pst. Ved anvendelsen av høyere prosent-mengder Ti eller Zr, f. eks. 15—20 pst., har legeringen et høyt smeltepunkt og flyter mindre utover keramiske overflate. Dette er særlig viktig når flere kontaktstifter i et elektrisk utladningsrør skal festes vakuumtett i en keramisk skive. En sterk utflytning av legeringen over skivens overflate må da ikke finne sted, da det ellers kan opptre en forkortning av isolasjonsveien eller endog en kortslutning mellom stiftene. I dette tilfelle er det meget egnet å an-bringe mellom-laget ikke i form av legering, men som en blanding av pulverfor-met Ti eller Zr, Ag og Cu, som er presset til en bestemt form, f. eks. til en ring eller en pastille og som anbringes i nærheten av det sted hvor den vakuumtette forbindelse skal dannes. Det viser seg at ved opphetningen i en ikke oksyderende atmosfære, f. eks. i vakuum, argon eller vannstoff, smelter først kobberet og sølvet og flyter godt ut mellom de flater som skal forbindes, hvoretter Ti eller Zr litt etter litt løser seg opp i kobber-sølvlegeringen, slik at den hefter til den keramiske overflate. En slik loddeforbin-delse kan endog fremstilles når den pres-sede pulverblanding befinner seg i et hul-rom på undersiden av den keramiske gjen-stand. ning is obtained if the alloy contains 13 wt% Ti or Zr, 43.5 wt% Ag and 43.5 wt% Cu. The percentage amount of Cu and Ag may possibly vary by a maximum of 10 percent. When using higher percentage amounts of Ti or Zr, e.g. 15-20 per cent, the alloy has a high melting point and flows less onto the ceramic surface. This is particularly important when several contact pins in an electric discharge tube are to be fixed vacuum-tight in a ceramic disk. A strong spreading of the alloy over the disc's surface must not take place, as otherwise a shortening of the insulation path or even a short circuit between the pins may occur. In this case, it is very suitable to provide the intermediate layer not in the form of an alloy, but as a mixture of powdered Ti or Zr, Ag and Cu, which has been pressed into a specific shape, e.g. to a ring or a lozenge and which is placed near the place where the vacuum-tight connection is to be formed. It turns out that when heated in a non-oxidizing atmosphere, e.g. in vacuum, argon or hydrogen, the copper and silver first melt and flow well between the surfaces to be joined, after which the Ti or Zr little by little dissolves in the copper-silver alloy, so that it adheres to the ceramic surface. Such a solder connection can even be produced when the pressed powder mixture is located in a cavity on the underside of the ceramic object.
Hvis den høye smeltetemperatur av en sådan legering med ca. 18 pst. Ti eller Zr ikke er ønskelig, kan titan- resp. zirkoninnholdet velges i nærheten av 10—13 pst. og til blandingen av de pulverformede materialer som anvendes kan det tilsettes en del molybden eller wolframpulver, for å hindre utflytning. Molybdenet eller wolframet for-blir til slutt i form av pulver i legeringen. Samtidig blir herved loddematerialets ut-videlseskoeffisient i sin helhet lavere, slik at den kommer i bedre overensstemmelss med det keramiske materiales utvidelses-koeffisient. If the high melting temperature of such an alloy with approx. 18 percent Ti or Zr is not desirable, titanium or the zirconium content is selected in the vicinity of 10-13 percent and a portion of molybdenum or tungsten powder can be added to the mixture of the powdered materials used, to prevent flow. The molybdenum or tungsten ultimately remains in the form of powder in the alloy. At the same time, the expansion coefficient of the solder material as a whole is lower, so that it is more in line with the expansion coefficient of the ceramic material.
Oppfinnelsen skal bli nærmere forklart i forbindelse med den vedføyde tegning som gjelder fremstilling av et utladningsrør. The invention shall be explained in more detail in connection with the attached drawing relating to the manufacture of a discharge tube.
På tegningen betegner 1 en keramisk sylinder av f. eks. aluminiumoksyd (alun-dum) som er lukket ved to keramiske ski-ver 2 og 3. Den på denne måte fremstilte vakuumbeholder inneholder et elektrode-system 4, som er festet på stifter 5. Stiftene 5 går gjennom bunnskiven 3 og er festet i denne ved hjelp av fremgangsmåten i henhold til oppfinnelsen ved hjelp av et loddemateriale i form av mellomlag 8, som for-trinnsvis har et høyt Ti-innhold, (18—20 vektprosent), og som i form av en pulverblanding av Ti, Cu og Ag er blitt presset f. eks. til en ring som er blitt skjøvet inn på stiftene og inn i åpningene i keramikkski-ven. Under opphetningen smelter først kobberet og sølvet og flyter inn i rommet mellom de f. eks. av molybden bestående stifter og skiven 3. Titanpulveret oppløser seg etter hvert i denne kobber-sølvlegerin-gen, slik at det oppnås vedhengning til det keramiske materiale og smeltetemperaturen øker. Det viser seg at det ikke inntrer noen utillatelig utflytning av legeringen over den keramiske flate. Keramikkskivene 2 og 3 er ved hjelp av mellomlag 6 og 7 blitt forbundet med sylinderen 1, f. eks. under en vakuumklokke. In the drawing, 1 denotes a ceramic cylinder of e.g. aluminum oxide (alum-dum) which is closed by two ceramic discs 2 and 3. The vacuum container produced in this way contains an electrode system 4, which is attached to pins 5. The pins 5 go through the bottom disc 3 and are fixed in this using the method according to the invention using a solder material in the form of intermediate layer 8, which preferably has a high Ti content (18-20% by weight), and which is in the form of a powder mixture of Ti, Cu and Ag has been pressured, e.g. to a ring that has been pushed onto the pins and into the openings in the ceramic disc. During the heating, the copper and silver first melt and flow into the space between them, e.g. pins consisting of molybdenum and the disk 3. The titanium powder gradually dissolves in this copper-silver alloy, so that adhesion to the ceramic material is achieved and the melting temperature increases. It turns out that no unacceptable flow of the alloy over the ceramic surface occurs. The ceramic discs 2 and 3 have been connected to the cylinder 1 by means of intermediate layers 6 and 7, e.g. under a vacuum watch.
Etter at elektrodesystemet er blitt mon-tert, blir de keramiske deler 1, 2 og 3 stilt på hverandre i en vakuumklokke, mens det mellom disse deler legges ringskiver som består av en blanding av Ti-, Cu- og Ag-pulver med f. eks. 13 pst. Ti. Etter utpump-ing oppheter man så sterkt at legeringen smelter og danner mellomlagene 6 og 7, som forbinder de keramiske deler meget fast med hinannen. Denne legering smelter ved lavere temperatur enn legeringen 8, som har høyere Zr- og Ti-innhold, slik at det ikke er noen fare for at stiftene 5 skal løsne. Hvis legeringen 6, 7 flyter i forstyrrende grad utover den keramiske overflate, kan man på forhånd tilblande denne legering pulverbestanddeler, molybden- eller wolframpulver f. eks. i et volumforhold på 1 : 1 eller noe mindre wolfram eller molybden. After the electrode system has been assembled, the ceramic parts 1, 2 and 3 are placed on top of each other in a vacuum chamber, while between these parts are placed rings consisting of a mixture of Ti, Cu and Ag powder with e.g. e.g. 13 percent Ti. After pumping out, it is heated so strongly that the alloy melts and forms the intermediate layers 6 and 7, which connect the ceramic parts very firmly to each other. This alloy melts at a lower temperature than alloy 8, which has a higher Zr and Ti content, so that there is no danger of the pins 5 loosening. If the alloy 6, 7 flows to a disturbing extent beyond the ceramic surface, this alloy can be mixed beforehand with powder components, molybdenum or tungsten powder, e.g. in a volume ratio of 1:1 or somewhat less tungsten or molybdenum.
Claims (2)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE11505/66D SE303854B (en) | 1966-08-25 | 1966-08-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
NO120651B true NO120651B (en) | 1970-11-16 |
Family
ID=20294096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO169397A NO120651B (en) | 1966-08-25 | 1967-08-16 |
Country Status (13)
Country | Link |
---|---|
US (1) | US3643903A (en) |
AT (1) | AT278659B (en) |
BE (1) | BE703023A (en) |
CH (1) | CH488906A (en) |
DE (1) | DE1709159A1 (en) |
DK (1) | DK122772B (en) |
ES (1) | ES142160Y (en) |
FI (1) | FI44849C (en) |
FR (1) | FR1534625A (en) |
GB (1) | GB1202237A (en) |
NL (1) | NL6711614A (en) |
NO (1) | NO120651B (en) |
SE (1) | SE303854B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2332377A1 (en) * | 1975-11-19 | 1977-06-17 | Buss Ag | SEAT FOR SPHERICAL TANK |
DE2837007C3 (en) * | 1978-08-24 | 1981-03-12 | Gebrüder Sulzer AG, 8401 Winterthur | Storage for a ball container |
DE3335545A1 (en) * | 1983-09-28 | 1985-04-04 | Kraftwerk Union AG, 4330 Mülheim | SUPPORTING DEVICE FOR LEVEL PRESSURE TANKS |
DE19943473B4 (en) * | 1999-09-10 | 2005-11-10 | Atu Armaturen Gmbh | sealing device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US929542A (en) * | 1909-04-10 | 1909-07-27 | Eugen Boermel | Elevated water-reservoir. |
US1670024A (en) * | 1926-10-16 | 1928-05-15 | Chicago Bridge & Iron Co | Container |
US1732829A (en) * | 1926-12-11 | 1929-10-22 | Boardman Company | Tank support |
US1958421A (en) * | 1932-12-17 | 1934-05-15 | Chicago Bridge & Iron Co | Method of making spherical containers |
US2302802A (en) * | 1939-04-15 | 1942-11-24 | Edward G Roberts | Bowling ball carrier |
US2313823A (en) * | 1940-08-17 | 1943-03-16 | Harrigan Wesley | Bowling ball support |
US2363992A (en) * | 1942-05-09 | 1944-11-28 | Smith Corp A O | Support for spherical pressure vessels |
US2870982A (en) * | 1954-01-18 | 1959-01-27 | Pfaudler Permutit Inc | Tank supporting means |
US2988333A (en) * | 1959-06-15 | 1961-06-13 | Frank J Mesic | Flask support |
US3043465A (en) * | 1959-10-28 | 1962-07-10 | Thompson Ramo Wooldridge Inc | Tank |
BE618383A (en) * | 1962-05-11 | 1962-09-17 | Constructiewerkplaatsen En Mac | Spherical high-pressure reservoir |
-
1966
- 1966-08-25 SE SE11505/66D patent/SE303854B/xx unknown
-
1967
- 1967-08-11 DK DK410167AA patent/DK122772B/en unknown
- 1967-08-12 DE DE19671709159 patent/DE1709159A1/en active Pending
- 1967-08-16 NO NO169397A patent/NO120651B/no unknown
- 1967-08-17 CH CH1169567A patent/CH488906A/en not_active IP Right Cessation
- 1967-08-21 US US662176A patent/US3643903A/en not_active Expired - Lifetime
- 1967-08-22 ES ES1967142160U patent/ES142160Y/en not_active Expired
- 1967-08-23 AT AT775867A patent/AT278659B/en not_active IP Right Cessation
- 1967-08-23 NL NL6711614A patent/NL6711614A/xx unknown
- 1967-08-23 FI FI672262A patent/FI44849C/en active
- 1967-08-24 BE BE703023D patent/BE703023A/xx unknown
- 1967-08-24 FR FR118923A patent/FR1534625A/en not_active Expired
- 1967-08-25 GB GB39197/67A patent/GB1202237A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
SE303854B (en) | 1968-09-09 |
NL6711614A (en) | 1968-02-26 |
DE1709159A1 (en) | 1971-05-19 |
FI44849B (en) | 1971-09-30 |
US3643903A (en) | 1972-02-22 |
ES142160U (en) | 1969-03-16 |
DK122772B (en) | 1972-04-10 |
ES142160Y (en) | 1969-10-16 |
GB1202237A (en) | 1970-08-12 |
AT278659B (en) | 1970-02-10 |
FI44849C (en) | 1972-01-10 |
CH488906A (en) | 1970-04-15 |
BE703023A (en) | 1968-02-26 |
FR1534625A (en) | 1968-07-26 |
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