NO120123B - - Google Patents

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Publication number
NO120123B
NO120123B NO167881A NO16788167A NO120123B NO 120123 B NO120123 B NO 120123B NO 167881 A NO167881 A NO 167881A NO 16788167 A NO16788167 A NO 16788167A NO 120123 B NO120123 B NO 120123B
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NO
Norway
Prior art keywords
conductors
strip
shaped
plastic
mold
Prior art date
Application number
NO167881A
Other languages
Norwegian (no)
Inventor
J Eigeman
Water P Van De
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of NO120123B publication Critical patent/NO120123B/no

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

Fremgangsmåte til fremstilling av halvlederanordninger. Process for manufacturing semiconductor devices.

Oppfinnelsen angår en fremgangsmåte til fremstilling av en halvlederanordning, f.eks. en transistor, med kunststoffomhylling, fra hvilken det rager ut minst to stromtilforselsledere hvis flate sider i det minste på de steder der de trer ut av omhyllingen, ligger i ett plan, hvor det på den frie ende av minst en av et antall i innbyrdes avstand holdte, strimmelformede metalledere anbringes et' halvledersystem, hvoretter vedkommende ender av lederne sammen med det på disse anbrakte halvledersystem, ved hjelp av en form innleires i isolerende kunststoff. The invention relates to a method for manufacturing a semiconductor device, e.g. a transistor, with a plastic casing, from which protrude at least two current supply conductors whose flat sides, at least at the places where they emerge from the casing, lie in one plane, where at the free end of at least one of a number of spaced apart held, strip-shaped metal conductors, a semiconductor system is placed, after which the respective ends of the conductors, together with the semiconductor system placed on them, are embedded in insulating plastic with the help of a mold.

En slik fremgangsmåte er kjent og finner bl.a. anvendelse ved massefremstilling av transistorer. Such a method is known and can be found i.a. application in the mass production of transistors.

Innleiringen av halvledersystemet i en kunststoffomhylling skjer ved hjelp av en form med et hulrom i hvilket en del av et sett i innbyrdes avstand holdte strimmelformede ledere med det på disse anbrakte halvledersystem er anordnet i foreskrevet stilling. Selve formen er delbar og har i lukket stilling et antall åpninger gjennom hvilke de strimmelformede ledere rager ut. Ved sammenset-ning av en slik form må såvel konfigurasjonen av åpningen som deres dimensjoner tilsvare de strimmelformede ledere mest mulig noyaktig. Det viser seg i praktis at dette er meget vanskelig å oppnå, fordi til tross for noyaktig dimensjonering av formens åpninger vil det i praksis ved opphetning av den tyntflytende kunststoffmengde på steder mellom åpningenes vegger og de strimmelformede ledere flyte ut noe av kunststoffmassen. Dette har til folge at vedkommende strimmelformede ledere også på de steder hvor det ikke er onskelig overtrekkes med et tynt kunststoffsjikt, slik at ved fastlodding av lederne under montasjen, f.eks. på en monteringsplate med trykket ledningsføring, opptrer det vanskeligheter. The embedding of the semiconductor system in a plastic casing takes place by means of a mold with a cavity in which part of a set of spaced apart strip-shaped conductors with the semiconductor system placed on them is arranged in a prescribed position. The mold itself is divisible and in the closed position has a number of openings through which the strip-shaped conductors protrude. When assembling such a form, both the configuration of the opening and their dimensions must correspond to the strip-shaped conductors as precisely as possible. It turns out in practice that this is very difficult to achieve, because despite accurate dimensioning of the mold's openings, in practice some of the plastic mass will flow out when the thin-flowing amount of plastic is heated in places between the walls of the openings and the strip-shaped conductors. This has the result that the relevant strip-shaped conductors are also coated with a thin plastic layer in places where it is not desirable, so that when soldering the conductors during assembly, e.g. on a mounting plate with compressed wiring, difficulties arise.

Hensikten med oppfinnelsen er å tilveiebringe en fremgangsmåte hvor denne ulempe unngås. .Dette oppnås ifolge oppfinnelsen ved at de strimmelformede ledere er forbundet med hverandre ved en brodel umiddelbart utenfor uttredelsesstedene i omhyllingen, og anbringes i formen slik at brodelen danner en av formhulrommets begrensninger og etter anbringelsen av omhyllingen fjernes helt eller delvis. The purpose of the invention is to provide a method where this disadvantage is avoided. .This is achieved according to the invention by the strip-shaped conductors being connected to each other by a bridge part immediately outside the exit points in the casing, and placed in the mold so that the bridge part forms one of the limitations of the mold cavity and after the installation of the casing is removed in whole or in part.

Ved at det mellom lederne er anbrakt brodeler kan det anvendes en form hvor åpningene som lederne fores ut gjennom, er erstattet av en enkelt bred sliss med liten hoyde. Ved anvendelse av disse brodeler oppnås den fordel at de i avstand fra hverandre holdte strimmelformede ledere holdes sammen til en fast enhet, slik at denne enhet av ledere er lettere å håndtere. Vedkommende brodeler strekker seg fortrinnsvis over en liten del av ledernes lengde, fordi de etter behandlingen i formen igjen skal fjernes helt eller delvis. Videre danner brodelene fortrinnsvis en enhet med de strimmelformede ledere. I dette tilfelle kan lederne og brodelene være fremstilt av samme metallplatestrimmel. By placing bridge parts between the conductors, a form can be used in which the openings through which the conductors are fed out are replaced by a single wide slot with a small height. By using these bridge parts, the advantage is achieved that the strip-shaped conductors held at a distance from each other are held together into a fixed unit, so that this unit of conductors is easier to handle. The corresponding bridge parts preferably extend over a small part of the length of the conductors, because after the treatment in the form they must again be removed in whole or in part. Furthermore, the bridge parts preferably form a unit with the strip-shaped conductors. In this case, the conductors and bridge parts can be made from the same sheet metal strip.

Oppfinnelsen skal forklares nærmere under henvisning til tegningen. Fig. 1 viser en kamformet strimmel på hvilken det er montert halvlederanordninger. Fig. 2 viser i perspektiv en del av den kamformede strimmel anbrakt i en form. Fig. 3 viser på samme måte som fig. 2 en kamformet strimmeldel med brodeler mellom lederne. Fig. 4 viser i perspektiv et ferdig produkt fremstilt ved hjelp av fremgangsmåten,, ifolge oppfinnelsen. Fig. 1 viser en kamformet strimmel som finner anvendelse ved massefremstilling av transistorer. Metallplatestrimme-len 1 har et antall grupper med parallelt utragende strimmelformede stromtilforselsledere 3>5°S 7- På en av disse strimmelformede-ledere 3 blir det i nærheten av dens frie ende fastloddet et halv-lederlegeme, på hvilket det er anbrakt legeringskontakter som ved hjelp av tynne tråder er forbundet med de strimmelformede ledere 5 og 7« Deretter blir det rundt en del av strimmelene påsmeltet kunststoff på den måte at etter avkjolingen av omhyllingen 9 er halvledersystemet innleiret i omhyllingen. Deretter blir strimmelene kuttet av langs den strekprikkede linje a-a, slik at det fra den om-hyllede enhet rager ut flate strimmelformede ledere som kan festes i huller i en monteringsplate med trykt ledningsføring. Ved an-bringelse av kunststoffomhyllingen anvendes en form som vist på fig. 2, bestående av to deler 11 og 13 som på en ikke vist måte tilfores smeltet kunststoff. Formen har i lukket stilling et antall åpninger 15, 17 og 19 gjennom hvilke lederne er fort ut av formen. Det viser seg at særlig ved de steder som er betegnet med 21 og 23 trer det ut kunststoff, slik at også de av formen utragende deler av lederne 3>5 og 7 overtrekkes med et kunststoffsjikt, hvilket er uonsket fordi de kan gi vanskeligheter ved fastlodding av lederne f.eks. på en monteringsplate. The invention shall be explained in more detail with reference to the drawing. Fig. 1 shows a comb-shaped strip on which semiconductor devices are mounted. Fig. 2 shows in perspective a part of the comb-shaped strip placed in a mold. Fig. 3 shows in the same way as fig. 2 a comb-shaped strip part with bridge parts between the conductors. Fig. 4 shows in perspective a finished product produced using the method according to the invention. Fig. 1 shows a comb-shaped strip which is used in the mass production of transistors. The sheet metal strip 1 has a number of groups of parallel protruding strip-shaped current supply conductors 3>5°S 7- On one of these strip-shaped conductors 3, a semi-conductor body is soldered near its free end, on which are placed alloy contacts as in with the help of thin wires are connected to the strip-shaped conductors 5 and 7" Next, plastic is melted around part of the strips in such a way that after the cooling of the casing 9, the semiconductor system is embedded in the casing. The strips are then cut off along the dash-dotted line a-a, so that flat strip-shaped conductors protrude from the shrouded unit which can be fixed in holes in a mounting plate with printed wiring. When applying the plastic covering, a form is used as shown in fig. 2, consisting of two parts 11 and 13 which are supplied with molten plastic in a manner not shown. In the closed position, the mold has a number of openings 15, 17 and 19 through which the conductors are quickly out of the mold. It turns out that especially at the places designated by 21 and 23, plastic sticks out, so that the protruding parts of the conductors 3>5 and 7 are also coated with a layer of plastic, which is undesirable because they can cause difficulties when soldering of the managers e.g. on a mounting plate.

Denne ulempe unngås ifolge oppfinnelsen ved at det mellom de strimmelformede ledere 1 den kamformede metallstrimmel anbringes brodeler 31°g 33- Disse brodeler danner samtidig en begrensning av formens hulrom og erstatter formmaterialet ved 21 og.23 mellom åpningene 15, 17°g 19* Det kan da anvendes en form som ikke har særskilte åpninger 15, 17°g 19>men hare en enkel sliss som da lukkes helt ved hjelp av lederne og deres brodeler. ;Etter anbringelsen av kunststoffomhyllingen blir brodelene fjernet som vist på fig. 4- Hvis det er nodvendig behover bare en del av brodelene å fjernes slik at det dannes ansatser 35 som danner anslag for begrensning av den dybde med hvilken lederne 3>5 og 7 kan fores inn i huller i monteringsplaten. ;Hvis strimmelen på fig. 1 anvendes anbefales det at det mellom lederne 7 og 8 anordnes en brodel. En slik brodel er på fig. 3 betegnet med 37* This disadvantage is avoided according to the invention by placing bridge parts 31°g 33 between the strip-shaped conductors 1 and the comb-shaped metal strip. a form can then be used which does not have separate openings 15, 17°g 19> but has a simple slot which is then completely closed with the help of the conductors and their bridging parts. ;After placing the plastic covering, the bridge parts are removed as shown in fig. 4- If necessary, only a part of the bridge parts needs to be removed so that abutments 35 are formed which form stops for limiting the depth with which the conductors 3>5 and 7 can be fed into holes in the mounting plate. ;If the strip in fig. 1 is used, it is recommended that a bridge part be arranged between conductors 7 and 8. Such a bridge part is in fig. 3 denoted by 37*

Claims (2)

1. Fremgangsmåte til fremstilling av en halvlederanordning, f.eks. en transistor, med en kunststoffomhylling, fra hvilken det rager ut minst to stromtilforselsledere hvis flate sider i det minste på de steder der de trer ut av omhyllingen, ligger i ett plan, hvor det på den frie ende av minst en av et antall i innbrydes avstand holdte, strimmelformede metalledere anbringes et halvledersystem, hvoretter vedkommende ender av lederne sammen med det på disse anbrakte halvledersystem, ved hjelp av en form innleires i isolerende kunststoff,karakterisert vedat de strim- ve d melformede ledere er forbundet med hverandre en brodel umiddelbart utenfor uttredelsesstedene i omhyllingen, og anbringelsen i formen slik at brodelen danner en av formhulrommets begrensninger og etter anbringelsen av omhyllingen fjernes helt eller delvis.1. Method for manufacturing a semiconductor device, e.g. a transistor, with a plastic casing, from which protrude at least two current supply conductors whose flat sides, at least at the places where they exit the casing, lie in one plane, where at the free end of at least one of a number of Spaced, strip-shaped metal conductors are placed on a semiconductor system, after which the respective ends of the conductors together with the semiconductor system placed on them are embedded in insulating plastic with the help of a mold, characterized by the strip- woe d flour-shaped conductors are connected to each other by a bridge part immediately outside the exit points in the sheath, and the placement in the mold so that the bridge part forms one of the limitations of the mold cavity and after the placement of the sheath is removed in whole or in part. 2. Fremgangsmåte ifolge krav 1,karakterisert vedat de strimmelformede ledere og brodelen er fremstilt av samme metallplatestrimmel.2. Method according to claim 1, characterized in that the strip-shaped conductors and the bridge part are produced from the same sheet metal strip. 3- Fremgangsmåte til fremstilling av et antall halvlederanordninger ved anvendelse av fremgangsmåten ifolge krav 1 eller 2,karakterisert vedet antall grupper av hoved-sakelig parallelt forlopende og i egnet innbyrdes avstand holdte strimmelformede ledere, samtidig på ender som strekker seg i samme retning forsynes med et antall tilhorende halvledersystemer som ved hjelp av en eller flere former innleires i kunststoff, idet også brodelen for de etter hverandre folgende grupper av ledere er forbundet med hverandre, hvoretter samtlige brodeler mellom de enkelte ledere fjernes helt eller delvis.3- Method for the production of a number of semiconductor devices using the method according to claim 1 or 2, characterized by the number of groups of strip-shaped conductors that run mainly in parallel and are kept at a suitable distance from each other, while at the same time ends that extend in the same direction are provided with a the number of associated semiconductor systems which are embedded in plastic by means of one or more forms, as the bridge part for the successive groups of conductors are also connected to each other, after which all bridge parts between the individual conductors are removed in whole or in part.
NO167881A 1966-04-28 1967-04-25 NO120123B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6605674A NL6605674A (en) 1966-04-28 1966-04-28

Publications (1)

Publication Number Publication Date
NO120123B true NO120123B (en) 1970-08-31

Family

ID=19796427

Family Applications (1)

Application Number Title Priority Date Filing Date
NO167881A NO120123B (en) 1966-04-28 1967-04-25

Country Status (11)

Country Link
AT (1) AT268381B (en)
BE (1) BE697849A (en)
CH (1) CH470759A (en)
DE (1) DE1614242A1 (en)
DK (1) DK116949B (en)
ES (1) ES339806A1 (en)
FR (1) FR1550982A (en)
GB (1) GB1125428A (en)
NL (1) NL6605674A (en)
NO (1) NO120123B (en)
SE (1) SE309455B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3210623A1 (en) * 1982-03-23 1983-10-06 Siemens Ag Method of preventing the formation of burrs in encapsulating components
DE3320700A1 (en) * 1983-06-08 1984-12-13 Siemens AG, 1000 Berlin und 8000 München Process for plastics covering of electrical components
JPS60176259A (en) * 1984-02-22 1985-09-10 Toshiba Corp Manufacture of resin seal type semiconductor device
DE3406538A1 (en) * 1984-02-23 1985-08-29 Bbc Brown Boveri & Cie PERFORMANCE SEMICONDUCTOR MODULE AND PRODUCTION METHOD
FR2638594B1 (en) * 1988-11-03 1990-12-21 Cartier Systemes G METHOD FOR PRODUCING A SINGLE-LAYER OR MULTI-LAYER POWER CIRCUIT, AND CIRCUIT OBTAINED BY THIS METHOD

Also Published As

Publication number Publication date
SE309455B (en) 1969-03-24
AT268381B (en) 1969-02-10
DK116949B (en) 1970-03-02
GB1125428A (en) 1968-08-28
BE697849A (en) 1967-10-30
CH470759A (en) 1969-03-31
ES339806A1 (en) 1968-05-16
FR1550982A (en) 1968-12-27
NL6605674A (en) 1967-10-30
DE1614242A1 (en) 1970-05-27

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