NL99576C - - Google Patents
Info
- Publication number
- NL99576C NL99576C NL99576DA NL99576C NL 99576 C NL99576 C NL 99576C NL 99576D A NL99576D A NL 99576DA NL 99576 C NL99576 C NL 99576C
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Rectifiers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1826054 | 1954-06-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL99576C true NL99576C (xx) |
Family
ID=10109405
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL198115D NL198115A (xx) | 1954-06-22 | ||
| NL99576D NL99576C (xx) | 1954-06-22 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL198115D NL198115A (xx) | 1954-06-22 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US2783418A (xx) |
| BE (1) | BE540197A (xx) |
| CH (1) | CH332312A (xx) |
| FR (1) | FR1126253A (xx) |
| NL (2) | NL99576C (xx) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2942165A (en) * | 1957-01-03 | 1960-06-21 | Gen Electric | Liquid cooled current rectifiers |
| GB859849A (en) * | 1957-04-03 | 1961-01-25 | Gen Electric Co Ltd | Improvements in or relating to semiconductor devices |
| US3007088A (en) * | 1957-09-26 | 1961-10-31 | Int Rectifier Corp | Rectifier and means for mounting the same |
| DE1086811B (de) * | 1958-04-24 | 1960-08-11 | Intermetall | Verfahren zur Kontaktierung und zum Zusammenbau von mittels eines Aluminiumdrahtes legierten Silizium-Gleichrichtern |
| GB882788A (en) * | 1958-07-05 | 1961-11-22 | Reinold Hagen | Process and apparatus for manufacturing bottles and the like neck-provided articles from thermoplastic material |
| US2994203A (en) * | 1960-01-14 | 1961-08-01 | Westinghouse Electric Corp | Thermoelectric cooling device |
| US3204157A (en) * | 1960-08-30 | 1965-08-31 | Welduction Corp | Crystal diode heat dissipating mounting |
| CH586464A5 (xx) * | 1974-12-06 | 1977-03-31 | Bbc Brown Boveri & Cie | |
| JPS63157449A (ja) * | 1986-12-22 | 1988-06-30 | Nec Corp | 集積回路の冷却構造 |
| US4942497A (en) * | 1987-07-24 | 1990-07-17 | Nec Corporation | Cooling structure for heat generating electronic components mounted on a substrate |
| CA1283225C (en) * | 1987-11-09 | 1991-04-16 | Shinji Mine | Cooling system for three-dimensional ic package |
| CA1327710C (en) * | 1987-12-07 | 1994-03-15 | Kazuhiko Umezawa | Cooling system for ic package |
| EP0341950B1 (en) * | 1988-05-09 | 1994-09-14 | Nec Corporation | Flat cooling structure of integrated circuit |
| US4975766A (en) * | 1988-08-26 | 1990-12-04 | Nec Corporation | Structure for temperature detection in a package |
| JPH06100408B2 (ja) * | 1988-09-09 | 1994-12-12 | 日本電気株式会社 | 冷却装置 |
| EP0363687B1 (en) * | 1988-09-20 | 1996-01-10 | Nec Corporation | Cooling structure for electronic components |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2162740A (en) * | 1939-06-20 | Film type rectifier | ||
| DE967450C (de) * | 1952-08-27 | 1957-11-14 | Siemens Ag | Kuehleinrichtung fuer Trockengleichrichter mit Kuehlkanaelen |
| US2725505A (en) * | 1953-11-30 | 1955-11-29 | Rca Corp | Semiconductor power devices |
-
0
- NL NL198115D patent/NL198115A/xx unknown
- BE BE540197D patent/BE540197A/xx unknown
- NL NL99576D patent/NL99576C/xx active
-
1955
- 1955-06-09 US US514174A patent/US2783418A/en not_active Expired - Lifetime
- 1955-06-17 FR FR1126253D patent/FR1126253A/fr not_active Expired
- 1955-08-05 CH CH332312D patent/CH332312A/fr unknown
Also Published As
| Publication number | Publication date |
|---|---|
| BE540197A (xx) | |
| US2783418A (en) | 1957-02-26 |
| NL198115A (xx) | |
| FR1126253A (fr) | 1956-11-19 |
| CH332312A (fr) | 1958-08-31 |