NL9401675A - Sputterbron met doelsamenstel en bevestiging. - Google Patents

Sputterbron met doelsamenstel en bevestiging. Download PDF

Info

Publication number
NL9401675A
NL9401675A NL9401675A NL9401675A NL9401675A NL 9401675 A NL9401675 A NL 9401675A NL 9401675 A NL9401675 A NL 9401675A NL 9401675 A NL9401675 A NL 9401675A NL 9401675 A NL9401675 A NL 9401675A
Authority
NL
Netherlands
Prior art keywords
target assembly
target
assembly
attachment
recesses
Prior art date
Application number
NL9401675A
Other languages
English (en)
Dutch (nl)
Original Assignee
Balzers Hochvakuum
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Balzers Hochvakuum filed Critical Balzers Hochvakuum
Publication of NL9401675A publication Critical patent/NL9401675A/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
NL9401675A 1993-10-13 1994-10-11 Sputterbron met doelsamenstel en bevestiging. NL9401675A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH308393 1993-10-13
CH03083/93A CH687427A5 (de) 1993-10-13 1993-10-13 Sputterquelle mit Targetanordnung und Halterung.

Publications (1)

Publication Number Publication Date
NL9401675A true NL9401675A (nl) 1995-05-01

Family

ID=4248260

Family Applications (1)

Application Number Title Priority Date Filing Date
NL9401675A NL9401675A (nl) 1993-10-13 1994-10-11 Sputterbron met doelsamenstel en bevestiging.

Country Status (6)

Country Link
US (1) US5833823A (de)
JP (1) JPH07150343A (de)
CH (1) CH687427A5 (de)
DE (1) DE4436176A1 (de)
FR (1) FR2711148B1 (de)
NL (1) NL9401675A (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19648390A1 (de) * 1995-09-27 1998-05-28 Leybold Materials Gmbh Target für die Sputterkathode einer Vakuumbeschichtungsanlage
DE19535894A1 (de) * 1995-09-27 1997-04-03 Leybold Materials Gmbh Target für die Sputterkathode einer Vakuumbeschichtungsanlage und Verfahren zu seiner Herstellung
DE19627533A1 (de) * 1996-07-09 1998-01-15 Leybold Materials Gmbh Target für die Sputterkathode einer Vakuumbeschichtungsanlage und Verfahren zu seiner Herstellung
DE19746988A1 (de) * 1997-10-24 1999-05-06 Leybold Ag Zerstäuberkathode
US6093293A (en) * 1997-12-17 2000-07-25 Balzers Hochvakuum Ag Magnetron sputtering source
DE19806879A1 (de) * 1998-02-19 1999-08-26 Leybold Materials Gmbh Target für die Sputterkathode einer Vakuumbeschichtungsanlage und Verfahren zu seiner Herstellung
US6113761A (en) 1999-06-02 2000-09-05 Johnson Matthey Electronics, Inc. Copper sputtering target assembly and method of making same
US6858102B1 (en) 2000-11-15 2005-02-22 Honeywell International Inc. Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets
DE19958857B4 (de) * 1999-06-16 2014-09-25 Applied Materials Gmbh & Co. Kg Sputterkathode
EP1232525A2 (de) 1999-11-24 2002-08-21 Honeywell International, Inc. Leitende verbindung
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system
US6620296B2 (en) * 2000-07-17 2003-09-16 Applied Materials, Inc. Target sidewall design to reduce particle generation during magnetron sputtering
KR20030064398A (ko) * 2000-09-11 2003-07-31 토소우 에스엠디, 인크 내부 냉각 채널을 갖는 스퍼터 타겟의 제조 방법
WO2003013703A1 (en) * 2001-08-03 2003-02-20 Aclara Biosciences, Inc. Straightflow system
KR100838065B1 (ko) * 2002-05-31 2008-06-16 삼성에스디아이 주식회사 박막증착기용 고정장치와 이를 이용한 고정방법
JP2007523993A (ja) * 2003-06-20 2007-08-23 キャボット　コーポレイション スパッタターゲットをバッキングプレートに結合させるための方法及び設計
US20070039817A1 (en) * 2003-08-21 2007-02-22 Daniels Brian J Copper-containing pvd targets and methods for their manufacture
TW200710243A (en) * 2005-05-02 2007-03-16 Honeywell Int Inc Target assemblies, targets, backing plates, and methods of target cooling
EP1835525A1 (de) * 2006-03-16 2007-09-19 Sulzer Metco AG (Switzerland) Targethaltevorrichtung
US20140021044A1 (en) * 2006-10-02 2014-01-23 Thermal Conductive Bonding, Inc. Elastomer Bonded Rotary Sputtering Target
US20140174918A1 (en) * 2012-12-20 2014-06-26 Intermolecular, Inc. Sputter Gun
CN103286403A (zh) * 2013-05-06 2013-09-11 郑凯 一种平板焊接炉

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0276962A1 (de) * 1987-01-27 1988-08-03 Machine Technology Inc. Kühlvorrichtung für Sputter-Target und -Quelle
JPS6432761A (en) * 1987-07-29 1989-02-02 Fuji Photo Film Co Ltd Ragiograph information reader
DE3912381A1 (de) * 1988-04-15 1989-10-26 Sharp Kk Auffaengereinheit
JPH0285068A (ja) * 1988-08-10 1990-03-26 Nissan Motor Co Ltd 操舵抵抗制御装置
DE4015388C2 (de) * 1990-05-14 1997-07-17 Leybold Ag Kathodenzerstäubungsvorrichtung
DE9102052U1 (de) * 1991-02-21 1991-06-13 Hauzer Holding B.V., Venlo Indirekt gekühlter Verdampfer mit Schnellwechselsystem
DE59208623D1 (de) * 1991-05-08 1997-07-24 Balzers Hochvakuum Verfahren zur Montage bzw. Demontage einer Targetplatte in einem Vakuumprozessraum, Montageanordnung hierfür sowie Targetplatte bzw. Vakuumkammer
US5147521A (en) * 1991-05-20 1992-09-15 Tosoh Smd, Inc. Quick change sputter target assembly
DE4223091C1 (en) * 1992-07-14 1993-07-01 Vtd-Vakuumtechnik Dresden Gmbh, O-8017 Dresden, De Water cooled holder for inserted exchangeable target - comprises housing, cooling plate and axially freely movable metal bellows, vacuum arc discharge vapour deposition appts.

Also Published As

Publication number Publication date
US5833823A (en) 1998-11-10
CH687427A5 (de) 1996-11-29
FR2711148B1 (fr) 1997-04-11
JPH07150343A (ja) 1995-06-13
FR2711148A1 (fr) 1995-04-21
DE4436176A1 (de) 1995-04-20

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
BN A decision not to publish the application has become irrevocable