NL9401675A - Sputterbron met doelsamenstel en bevestiging. - Google Patents
Sputterbron met doelsamenstel en bevestiging. Download PDFInfo
- Publication number
- NL9401675A NL9401675A NL9401675A NL9401675A NL9401675A NL 9401675 A NL9401675 A NL 9401675A NL 9401675 A NL9401675 A NL 9401675A NL 9401675 A NL9401675 A NL 9401675A NL 9401675 A NL9401675 A NL 9401675A
- Authority
- NL
- Netherlands
- Prior art keywords
- target assembly
- target
- assembly
- attachment
- recesses
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH308393 | 1993-10-13 | ||
CH03083/93A CH687427A5 (de) | 1993-10-13 | 1993-10-13 | Sputterquelle mit Targetanordnung und Halterung. |
Publications (1)
Publication Number | Publication Date |
---|---|
NL9401675A true NL9401675A (nl) | 1995-05-01 |
Family
ID=4248260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL9401675A NL9401675A (nl) | 1993-10-13 | 1994-10-11 | Sputterbron met doelsamenstel en bevestiging. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5833823A (de) |
JP (1) | JPH07150343A (de) |
CH (1) | CH687427A5 (de) |
DE (1) | DE4436176A1 (de) |
FR (1) | FR2711148B1 (de) |
NL (1) | NL9401675A (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19648390A1 (de) * | 1995-09-27 | 1998-05-28 | Leybold Materials Gmbh | Target für die Sputterkathode einer Vakuumbeschichtungsanlage |
DE19535894A1 (de) * | 1995-09-27 | 1997-04-03 | Leybold Materials Gmbh | Target für die Sputterkathode einer Vakuumbeschichtungsanlage und Verfahren zu seiner Herstellung |
DE19627533A1 (de) * | 1996-07-09 | 1998-01-15 | Leybold Materials Gmbh | Target für die Sputterkathode einer Vakuumbeschichtungsanlage und Verfahren zu seiner Herstellung |
DE19746988A1 (de) * | 1997-10-24 | 1999-05-06 | Leybold Ag | Zerstäuberkathode |
US6093293A (en) * | 1997-12-17 | 2000-07-25 | Balzers Hochvakuum Ag | Magnetron sputtering source |
DE19806879A1 (de) * | 1998-02-19 | 1999-08-26 | Leybold Materials Gmbh | Target für die Sputterkathode einer Vakuumbeschichtungsanlage und Verfahren zu seiner Herstellung |
US6113761A (en) | 1999-06-02 | 2000-09-05 | Johnson Matthey Electronics, Inc. | Copper sputtering target assembly and method of making same |
US6858102B1 (en) | 2000-11-15 | 2005-02-22 | Honeywell International Inc. | Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets |
DE19958857B4 (de) * | 1999-06-16 | 2014-09-25 | Applied Materials Gmbh & Co. Kg | Sputterkathode |
EP1232525A2 (de) | 1999-11-24 | 2002-08-21 | Honeywell International, Inc. | Leitende verbindung |
US6264804B1 (en) | 2000-04-12 | 2001-07-24 | Ske Technology Corp. | System and method for handling and masking a substrate in a sputter deposition system |
US6620296B2 (en) * | 2000-07-17 | 2003-09-16 | Applied Materials, Inc. | Target sidewall design to reduce particle generation during magnetron sputtering |
KR20030064398A (ko) * | 2000-09-11 | 2003-07-31 | 토소우 에스엠디, 인크 | 내부 냉각 채널을 갖는 스퍼터 타겟의 제조 방법 |
WO2003013703A1 (en) * | 2001-08-03 | 2003-02-20 | Aclara Biosciences, Inc. | Straightflow system |
KR100838065B1 (ko) * | 2002-05-31 | 2008-06-16 | 삼성에스디아이 주식회사 | 박막증착기용 고정장치와 이를 이용한 고정방법 |
JP2007523993A (ja) * | 2003-06-20 | 2007-08-23 | キャボット コーポレイション | スパッタターゲットをバッキングプレートに結合させるための方法及び設計 |
US20070039817A1 (en) * | 2003-08-21 | 2007-02-22 | Daniels Brian J | Copper-containing pvd targets and methods for their manufacture |
TW200710243A (en) * | 2005-05-02 | 2007-03-16 | Honeywell Int Inc | Target assemblies, targets, backing plates, and methods of target cooling |
EP1835525A1 (de) * | 2006-03-16 | 2007-09-19 | Sulzer Metco AG (Switzerland) | Targethaltevorrichtung |
US20140021044A1 (en) * | 2006-10-02 | 2014-01-23 | Thermal Conductive Bonding, Inc. | Elastomer Bonded Rotary Sputtering Target |
US20140174918A1 (en) * | 2012-12-20 | 2014-06-26 | Intermolecular, Inc. | Sputter Gun |
CN103286403A (zh) * | 2013-05-06 | 2013-09-11 | 郑凯 | 一种平板焊接炉 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0276962A1 (de) * | 1987-01-27 | 1988-08-03 | Machine Technology Inc. | Kühlvorrichtung für Sputter-Target und -Quelle |
JPS6432761A (en) * | 1987-07-29 | 1989-02-02 | Fuji Photo Film Co Ltd | Ragiograph information reader |
DE3912381A1 (de) * | 1988-04-15 | 1989-10-26 | Sharp Kk | Auffaengereinheit |
JPH0285068A (ja) * | 1988-08-10 | 1990-03-26 | Nissan Motor Co Ltd | 操舵抵抗制御装置 |
DE4015388C2 (de) * | 1990-05-14 | 1997-07-17 | Leybold Ag | Kathodenzerstäubungsvorrichtung |
DE9102052U1 (de) * | 1991-02-21 | 1991-06-13 | Hauzer Holding B.V., Venlo | Indirekt gekühlter Verdampfer mit Schnellwechselsystem |
DE59208623D1 (de) * | 1991-05-08 | 1997-07-24 | Balzers Hochvakuum | Verfahren zur Montage bzw. Demontage einer Targetplatte in einem Vakuumprozessraum, Montageanordnung hierfür sowie Targetplatte bzw. Vakuumkammer |
US5147521A (en) * | 1991-05-20 | 1992-09-15 | Tosoh Smd, Inc. | Quick change sputter target assembly |
DE4223091C1 (en) * | 1992-07-14 | 1993-07-01 | Vtd-Vakuumtechnik Dresden Gmbh, O-8017 Dresden, De | Water cooled holder for inserted exchangeable target - comprises housing, cooling plate and axially freely movable metal bellows, vacuum arc discharge vapour deposition appts. |
-
1993
- 1993-10-13 CH CH03083/93A patent/CH687427A5/de not_active IP Right Cessation
-
1994
- 1994-10-10 FR FR9412069A patent/FR2711148B1/fr not_active Expired - Fee Related
- 1994-10-10 DE DE4436176A patent/DE4436176A1/de not_active Withdrawn
- 1994-10-11 NL NL9401675A patent/NL9401675A/nl active Search and Examination
- 1994-10-12 JP JP6246097A patent/JPH07150343A/ja active Pending
-
1995
- 1995-11-20 US US08/559,883 patent/US5833823A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5833823A (en) | 1998-11-10 |
CH687427A5 (de) | 1996-11-29 |
FR2711148B1 (fr) | 1997-04-11 |
JPH07150343A (ja) | 1995-06-13 |
FR2711148A1 (fr) | 1995-04-21 |
DE4436176A1 (de) | 1995-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
BN | A decision not to publish the application has become irrevocable |