Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
  • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
  • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
  • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
  • H10D48/01—Manufacture or treatment
  • H10D48/04—Manufacture or treatment of devices having bodies comprising selenium or tellurium in uncombined form
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
  • H10P95/50—Alloying conductive materials with semiconductor bodies
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S228/00—Metal fusion bonding
  • Y10S228/903—Metal to nonmetal

Applications Claiming Priority (1)

Publications (1)

Family

ID=19784660

Family Applications (2)

Family Applications After (1)

Country Status (7)

Families Citing this family (10)

Family Cites Families (4)

• 0
  • BE BE543253D patent/BE543253A/xx unknown
  • NL NL88273D patent/NL88273C/xx active
  • NL NL192839D patent/NL192839A/xx unknown
• 1955
  • 1955-11-28 DE DEN11498A patent/DE1009311B/de active Pending
  • 1955-11-28 GB GB34019/55A patent/GB789338A/en not_active Expired
  • 1955-11-29 CH CH339990D patent/CH339990A/de unknown
  • 1955-11-29 FR FR1136613D patent/FR1136613A/fr not_active Expired
  • 1955-12-01 US US550502A patent/US2865794A/en not_active Expired - Lifetime

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